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    • 11. 发明授权
    • Method and apparatus for manufacturing organic EL device
    • 用于制造有机EL器件的方法和装置
    • US08921142B2
    • 2014-12-30
    • US14235353
    • 2012-10-17
    • Nitto Denko Corporation
    • Ryohei KakiuchiSatoru YamamotoKanako Hida
    • H01L21/00H01L51/56C23C14/12C23C14/56H01L51/00
    • H01L51/56B65H23/32B65H2301/5114C23C14/12C23C14/562H01L51/0008
    • Provided is a method and an apparatus for manufacturing an organic EL device which make it possible to manufacture organic EL devices capable of suppressing quality degradation. The method for manufacturing an organic EL device, in which constituent layers of an organic EL element are formed over a substrate in the form of a strip by deposition, while the substrate is being moved in the longitudinal direction, includes: a constituent layer-forming step of performing deposition over one surface of the substrate, while the substrate is being moved in the longitudinal direction, sequentially in an upward deposition unit and a lateral deposition unit provided along the moving direction of the substrate by discharging a vaporized material from an evaporation source. The constituent layer-forming step includes an upward deposition step, a laterally deposition step, and a direction changing step.
    • 提供一种制造有机EL器件的方法和装置,其可以制造能够抑制质量劣化的有机EL器件。 有机EL元件的制造方法,其中有机EL元件的构成层在基板沿长度方向移动的同时通过沉积形成在带状形式的基板上,包括:构成层形成 在基板沿纵向移动的同时,在沿着基板的移动方向设置的向上沉积单元和横向沉积单元中顺序地在基板的一个表面上进行沉积的步骤,通过从蒸发源排出蒸发的材料 。 构成层形成步骤包括向上沉积步骤,横向沉积步骤和方向改变步骤。
    • 12. 发明申请
    • METHOD AND APPARATUS FOR MANUFACTURING ORGANIC EL DEVICE
    • 制造有机EL器件的方法和装置
    • US20140220722A1
    • 2014-08-07
    • US14235986
    • 2012-10-17
    • NITTO DENKO CORPORATION
    • Ryohei KakiuchiSatoru YamamotoKanako Hida
    • H01L51/00
    • H01L51/001B65H23/32B65H2301/5114B65H2301/51145C23C14/12C23C14/562H01L51/56H05B33/10
    • Provided are a method and an apparatus for manufacturing an organic EL device, which makes it possible to manufacture organic EL devices capable of suppressing quality degradation. The method for manufacturing an organic EL device, in which constituent layers of an organic EL element are formed by deposition over a substrate in the form of a strip, while the substrate is being moved in the longitudinal direction, includes a constituent layer-forming step of performing deposition over one surface of the substrate, while the substrate is being moved in the longitudinal direction, sequentially in first and second deposition units arranged along the moving direction of the substrate by discharging a vaporized material from an evaporation source. The constituent layer-forming step includes a plurality of upward deposition steps and a direction changing step.
    • 提供一种用于制造有机EL器件的方法和设备,其可以制造能够抑制质量劣化的有机EL器件。 包含构成层形成工序的有机EL元件的制造方法,其中有机EL元件的构成层通过在条形状的基板上沉积而形成, 在基板沿纵向移动的同时,在沿着基板的移动方向布置的第一和第二沉积单元中顺序地在基板的一个表面上进行沉积,从蒸发源排出蒸发的材料。 构成层形成步骤包括多个向上沉积步骤和方向改变步骤。
    • 13. 发明申请
    • METHOD AND APPARATUS FOR MANUFACTURING ORGANIC EL DEVICE
    • 制造有机EL器件的方法和装置
    • US20140084276A1
    • 2014-03-27
    • US14115793
    • 2012-12-10
    • NITTO DENKO CORPORATION
    • Ryohei KakiuchiSatoru YamamotoKanako Hida
    • H01L51/56H01L51/50
    • H01L51/5012C23C14/042C23C14/562H01L51/001H01L51/56
    • Provided are a method and an apparatus for manufacturing an organic EL device which enable deposition of a vaporized material from an evaporation source onto a substrate in a desired pattern, while eliminating the need for a conventional strip-shaped shadow mask. A shielding portion 51 is configured to be switchable between a shield position where the shielding portion 51 is arranged between an evaporation source 4 and a substrate 81 so as to shield the substrate 81 and a shield release position where the shielding portion 51 is withdrawn from between the evaporation source 4 and the substrate 81 so as to release the shielding of the substrate 81. The shielding portion 51 is switched between the shield position and the shield release position while rotating together with a roller 3.
    • 提供一种用于制造有机EL器件的方法和装置,其能够以蒸发源将蒸发的材料以期望的图案沉积到衬底上,同时不需要常规的带状阴影掩模。 屏蔽部分51被配置为可以在遮蔽部分​​51布置在蒸发源4和基板81之间的屏蔽位置之间切换,以屏蔽基板81和屏蔽部分51从屏蔽部分51之间撤出的屏蔽释放位置 蒸发源4和基板81,以便释放基板81的屏蔽。屏蔽部分51在与滚筒3一起旋转的同时在屏蔽位置和屏蔽释放位置之间切换。