会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 12. 发明授权
    • Delay fault testing using distributed clock dividers
    • 使用分布式时钟分频器延迟故障测试
    • US08375265B1
    • 2013-02-12
    • US13231229
    • 2011-09-13
    • Ramakrishnan VenkatasubramanianAlan HalesWilliam Wallace
    • Ramakrishnan VenkatasubramanianAlan HalesWilliam Wallace
    • G01R31/28
    • G01R31/31725G01R31/31858
    • In an embodiment of the invention, an integrated circuit with several clock domains bank is tested by first disabling a PLL clock and scanning test data into scan chains. Next delay fault testing (DFT) code is transmitted to each distributed clock divider on the integrated circuit. The PLL clock is then enabled to the distributed clock dividers. Selected clock dividers generate launch pulses that allow test data to be propagated from the scan chains into circuit blocks in the clock domains. Capture pulses are then generated by selected distributed clock dividers to capture test data coming form the circuit blocks into the scan chains. Next the PLL clock is disabled and the test data is scanned from the scan chains to an on-chip test control circuit.
    • 在本发明的一个实施例中,通过首先禁用PLL时钟并将测试数据扫描到扫描链中来测试具有多个时钟域组的集成电路。 下一个延迟故障测试(DFT)代码被发送到集成电路上的每个分布式时钟分频器。 PLL时钟然后被使能到分布式时钟分频器。 选择的时钟分频器产生启动脉冲,允许测试数据从扫描链传播到时钟域中的电路块。 捕获脉冲然后由选定的分布式时钟分频器产生,以将来自电路块的测试数据捕获到扫描链中。 接下来PLL时钟被禁用,测试数据从扫描链扫描到片上测试控制电路。
    • 13. 发明申请
    • SCAN TESTING SYSTEM, METHOD AND APPARATUS
    • 扫描测试系统,方法和设备
    • US20100095171A1
    • 2010-04-15
    • US12638441
    • 2009-12-15
    • Lee D. WhetselAlan Hales
    • Lee D. WhetselAlan Hales
    • G01R31/3177G06F11/25
    • G01R31/3177G01R1/07342G01R31/318536G01R31/318541G01R31/318544G01R31/318547G01R31/318555G01R31/318558G01R31/318563G01R31/318566G01R31/318572G01R31/31924G01R31/31926
    • Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible.
    • 位于半导体管芯上的测试电路使得测试仪能够通过将激励和响应模式输入到多个管芯/ IC来并行地测试多个管芯/ IC。 来自测试器的响应模式与待比较的芯片/ IC的输出响应一起输入到测试电路。 还公开了使用响应信号编码方案,其中测试者使用每个测试电路的单个信号向测试电路发送响应测试命令,以执行:(1)比较管芯/ IC输出与期望的逻辑高( 2)比较管芯/ IC输出与预期逻辑低电平,以及(3)掩模比较操作。 信号编码方案的使用允许对芯片和IC进行功能测试,因为每个管芯/ IC输出所需的所有响应测试命令(即1-3以上)可以仅使用单个测试仪信号连接传输到每个管芯/ IC输出 芯片/ IC输出。 除功能测试外,还可以对芯片和IC进行扫描测试。
    • 14. 发明申请
    • SCAN TESTING SYSTEM, METHOD AND APPARATUS
    • 扫描测试系统,方法和设备
    • US20090089634A1
    • 2009-04-02
    • US12329957
    • 2008-12-08
    • Lee D. WhetselAlan Hales
    • Lee D. WhetselAlan Hales
    • G01R31/3185G06F11/267
    • G01R31/3177G01R1/07342G01R31/318536G01R31/318541G01R31/318544G01R31/318547G01R31/318555G01R31/318558G01R31/318563G01R31/318566G01R31/318572G01R31/31924G01R31/31926
    • Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible.
    • 位于半导体管芯上的测试电路使得测试仪能够通过将激励和响应模式输入到多个管芯/ IC来并行地测试多个管芯/ IC。 来自测试器的响应模式与待比较的芯片/ IC的输出响应一起输入到测试电路。 还公开了使用响应信号编码方案,其中测试者使用每个测试电路的单个信号向测试电路发送响应测试命令,以执行:(1)比较管芯/ IC输出与期望的逻辑高( 2)比较管芯/ IC输出与预期逻辑低电平,以及(3)掩模比较操作。 信号编码方案的使用允许对芯片和IC进行功能测试,因为每个管芯/ IC输出所需的所有响应测试命令(即1-3以上)可以仅使用单个测试仪信号连接传输到每个管芯/ IC输出 芯片/ IC输出。 除功能测试外,还可以对芯片和IC进行扫描测试。
    • 15. 发明申请
    • SCAN TESTING SYSTEM, METHOD AND APPARATUS
    • 扫描测试系统,方法和设备
    • US20070114529A1
    • 2007-05-24
    • US11626201
    • 2007-01-23
    • Lee WhetselAlan Hales
    • Lee WhetselAlan Hales
    • G01R31/26
    • G01R31/3177G01R1/07342G01R31/318536G01R31/318541G01R31/318544G01R31/318547G01R31/318555G01R31/318558G01R31/318563G01R31/318566G01R31/318572G01R31/31924G01R31/31926
    • Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible.
    • 位于半导体管芯上的测试电路使得测试仪能够通过将激励和响应模式输入到多个管芯/ IC来并行地测试多个管芯/ IC。 来自测试器的响应模式与待比较的芯片/ IC的输出响应一起输入到测试电路。 还公开了使用响应信号编码方案,其中测试者使用每个测试电路的单个信号向测试电路发送响应测试命令,以执行:(1)比较管芯/ IC输出与期望的逻辑高( 2)比较管芯/ IC输出与预期逻辑低电平,以及(3)掩模比较操作。 信号编码方案的使用允许对芯片和IC进行功能测试,因为每个管芯/ IC输出所需的所有响应测试命令(即1-3以上)可以仅使用单个测试仪信号连接传输到每个管芯/ IC输出 芯片/ IC输出。 除功能测试外,还可以对芯片和IC进行扫描测试。
    • 18. 发明授权
    • IC dies with serarate connections to expected and mask data
    • IC死亡与预期和掩模数据的serarate连接
    • US08604475B2
    • 2013-12-10
    • US13629854
    • 2012-09-28
    • Lee D. WhetselAlan Hales
    • Lee D. WhetselAlan Hales
    • H01L23/58
    • G01R31/3177G01R1/07342G01R31/318536G01R31/318541G01R31/318544G01R31/318547G01R31/318555G01R31/318558G01R31/318563G01R31/318566G01R31/318572G01R31/31924G01R31/31926
    • Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible.
    • 位于半导体管芯上的测试电路使得测试仪能够通过将激励和响应模式输入到多个管芯/ IC来并行地测试多个管芯/ IC。 来自测试器的响应模式与待比较的芯片/ IC的输出响应一起输入到测试电路。 还公开了使用响应信号编码方案,其中测试者使用每个测试电路的单个信号向测试电路发送响应测试命令,以执行:(1)比较管芯/ IC输出与期望的逻辑高( 2)比较管芯/ IC输出与预期逻辑低电平,以及(3)掩模比较操作。 信号编码方案的使用允许对芯片和IC进行功能测试,因为每个管芯/ IC输出所需的所有响应测试命令(即1-3以上)可以仅使用单个测试仪信号连接传输到每个管芯/ IC输出 芯片/ IC输出。 除功能测试外,还可以对芯片和IC进行扫描测试。
    • 19. 发明授权
    • Comparator receiving expected and mask data from circuit pads
    • 比较器从电路板接收预期和掩模数据
    • US08299464B2
    • 2012-10-30
    • US12911424
    • 2010-10-25
    • Lee D. WhetselAlan Hales
    • Lee D. WhetselAlan Hales
    • H01L23/58
    • G01R31/3177G01R1/07342G01R31/318536G01R31/318541G01R31/318544G01R31/318547G01R31/318555G01R31/318558G01R31/318563G01R31/318566G01R31/318572G01R31/31924G01R31/31926
    • Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible.
    • 位于半导体管芯上的测试电路使得测试仪能够通过将激励和响应模式输入到多个管芯/ IC来并行地测试多个管芯/ IC。 来自测试器的响应模式与待比较的芯片/ IC的输出响应一起输入到测试电路。 还公开了使用响应信号编码方案,其中测试者使用每个测试电路的单个信号向测试电路发送响应测试命令,以执行:(1)比较管芯/ IC输出与期望的逻辑高( 2)比较管芯/ IC输出与预期逻辑低电平,以及(3)掩模比较操作。 信号编码方案的使用允许对芯片和IC进行功能测试,因为每个管芯/ IC输出所需的所有响应测试命令(即1-3以上)可以仅使用单个测试仪信号连接传输到每个管芯/ IC输出 芯片/ IC输出。 除功能测试外,还可以对芯片和IC进行扫描测试。
    • 20. 发明授权
    • IC with comparator receiving expected and mask data from pads
    • IC与比较器接收来自焊盘的预期和掩模数据
    • US07491970B2
    • 2009-02-17
    • US11971561
    • 2008-01-09
    • Lee D. WhetselAlan Hales
    • Lee D. WhetselAlan Hales
    • H01L23/58G01R31/26
    • G01R31/3177G01R1/07342G01R31/318536G01R31/318541G01R31/318544G01R31/318547G01R31/318555G01R31/318558G01R31/318563G01R31/318566G01R31/318572G01R31/31924G01R31/31926
    • Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible.
    • 位于半导体管芯上的测试电路使得测试仪能够通过将激励和响应模式输入到多个管芯/ IC来并行地测试多个管芯/ IC。 来自测试器的响应模式与待比较的芯片/ IC的输出响应一起输入到测试电路。 还公开了使用响应信号编码方案,其中测试者使用每个测试电路的单个信号向测试电路发送响应测试命令,以执行:(1)比较管芯/ IC输出与期望的逻辑高( 2)比较管芯/ IC输出与预期逻辑低电平,以及(3)掩模比较操作。 信号编码方案的使用允许对芯片和IC进行功能测试,因为每个管芯/ IC输出所需的所有响应测试命令(即1-3以上)可以仅使用单个测试仪信号连接传输到每个管芯/ IC输出 芯片/ IC输出。 除功能测试外,还可以对芯片和IC进行扫描测试。