专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US07443496B2 Apparatus and method for testing defects 失效
标题翻译：检测缺陷的装置和方法
公开(公告)号：US07443496B2
公开(公告)日：2008-10-28
申请号：US11681996
申请日：2007-03-05
申请人： Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
发明人： Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
IPC分类号： G01N21/00
CPC分类号： B82Y15/00 , G01N21/94 , G01N21/95623 , G01N21/95684 , G01N2021/8822 , G01R31/308 , H01J37/00 , H01J2237/022 , H01J2237/0225 , H01L21/67253 , H01L21/67288 , H01L21/681 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： A defect inspection apparatus includes an illumination optical unit for obliquely illuminating an object with a slit-like shaped laser, a first detection optical unit for detecting a first image formed by light reflected from the object by the illumination of the slit-like shaped laser and reflected in a first direction substantially normal to a surface of the object, a second detection optical unit for detecting a second image formed by light reflected from the object by the illumination of the slit-like shaped laser and reflected in a second direction inclined to the normal direction to the surface of the object, an image signal processing unit which processes a signal outputted from the first detection optical unit and a signal outputted from the second detection optical unit, and an output unit which outputs information processed by the image signal processing unit.
摘要翻译：缺陷检查装置包括：用狭缝状激光器对物体进行倾斜照明的照明光学单元;第一检测光学单元，用于检测由所述狭缝状激光的照射而从物体反射的光形成的第一图像;以及反射在基本上垂直于物体的表面的第一方向上;第二检测光学单元，用于检测由通过照射狭缝状激光而从物体反射的光形成的第二图像，并以与第二方向倾斜的第二方向反射对象物的表面的正常方向，处理从第一检测光学单元输出的信号和从第二检测光学单元输出的信号的图像信号处理单元，以及输出单元，其输出由图像信号处理单元处理的信息。

12. 发明授权

US06411377B1 Optical apparatus for defect and particle size inspection 失效
标题翻译：用于缺陷和粒度检查的光学设备
公开(公告)号：US06411377B1
公开(公告)日：2002-06-25
申请号：US09362135
申请日：1999-07-28
申请人： Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
发明人： Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Shunichi Matsumoto , Yukio Kembo , Ryouji Matsunaga , Keiji Sakai , Takanori Ninomiya , Tetsuya Watanabe , Hisato Nakamura , Takahiro Jingu , Yoshio Morishige , Shuichi Chikamatsu
IPC分类号： G01N2101
CPC分类号： B82Y15/00 , G01N21/94 , G01N21/95623 , G01N21/95684 , G01N2021/8822 , G01R31/308 , H01J37/00 , H01J2237/022 , H01J2237/0225 , H01L21/67253 , H01L21/67288 , H01L21/681 , H01L22/12 , H01L2924/0002 , H01L2924/00
摘要： The present invention provides a defect inspecting apparatus and a defect inspection method for inspecting an object of inspection for a defect such as a foreign particle existing on the object wherein, by using a high-efficiency illumination optical system for radiating an illumination beam to the object of inspection from a direction to reduce the intensity of a scattered light generated by a pattern on the object of inspection, it is possible to decrease the intensity of the scattered light from the pattern which causes a variation of a signal and, in addition, by using a means for setting a detection threshold value based on a variation of a signal computed for each area in a chip on the object of inspection, the detection threshold value can be made small and, thus, the sensitivity as well as the throughput can be raised.
摘要翻译：本发明提供了一种缺陷检查装置和缺陷检查方法，用于检查物体上存在的异物等缺陷的检查对象，其中，通过使用用于向对象照射照明光束的高效率照明光学系统从减少由检查对象上的图案产生的散射光的强度的方向进行检查的情况下，可以降低来自图案的散射光的强度，导致信号的变化，另外，由使用基于针对检查对象中的芯片中的每个区域计算的信号的变化来设置检测阈值的装置，可以使检测阈值较小，因此灵敏度以及吞吐量可以是上调。

13. 发明授权

US07177020B2 Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process 失效
标题翻译：用于分析半导体制造工艺中的外来颗粒的产生状态的方法和装置
公开(公告)号：US07177020B2
公开(公告)日：2007-02-13
申请号：US11128352
申请日：2005-05-13
申请人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Hidetoshi Nishiyama , Kazuhiko Matsuoka , Yoshiharu Shigyo
发明人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Hidetoshi Nishiyama , Kazuhiko Matsuoka , Yoshiharu Shigyo
IPC分类号： G01J3/00
CPC分类号： H01L21/681 , B82Y15/00 , G01N21/94 , G01N21/9501 , G01N21/95623 , G01N2021/8822 , G01R31/308 , H01J37/00 , H01J2237/022 , H01J2237/0225 , H01L21/67253 , H01L21/67288 , H01L22/12
摘要： An apparatus and method for detecting defects on a specimen includes an illumination optical unit which obliquely projects a laser onto a region which is longer in one direction on a surface of a specimen than in a transverse direction, a table unit which mounts the specimen and which is movable, a detection optical unit which detects light from the specimen illuminated by the laser with an image sensor while the table is moving, and a signal processor. The signal processor processes a signal outputted from the image sensor of the detection optical unit and converted to a digital signal and extracts defects of the specimen by comparing the converted digital signal with a reference digital signal. A display unit displays information of defects extracted by the signal processor.
摘要翻译：用于检测试样缺陷的装置和方法包括照射光学单元，其将激光倾斜地突出到在一个方向上在一个方向上比在横向方向上更长的区域，安装样本的台单元，可移动的检测光学单元，检测光学单元，其在桌子移动时利用图像传感器检测由激光照射的样本的光，以及信号处理器。信号处理器处理从检测光学单元的图像传感器输出的信号并转换为数字信号，并通过将转换的数字信号与参考数字信号进行比较来提取样本的缺陷。显示单元显示由信号处理器提取的缺陷的信息。

14. 发明申请

US20050206887A1 Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process 失效
标题翻译：用于分析半导体制造工艺中的外来颗粒的产生状态的方法和装置
公开(公告)号：US20050206887A1
公开(公告)日：2005-09-22
申请号：US11128352
申请日：2005-05-13
申请人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Hidetoshi Nishiyama , Kazuhiko Matsuoka , Yoshiharu Shigyo
发明人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Hidetoshi Nishiyama , Kazuhiko Matsuoka , Yoshiharu Shigyo
IPC分类号： G01N21/00 , G01N21/94 , G01N21/95 , G01N21/956 , G01R31/308 , H01J37/00 , H01L21/00 , H01L21/66 , H01L21/68
CPC分类号： H01L21/681 , B82Y15/00 , G01N21/94 , G01N21/9501 , G01N21/95623 , G01N2021/8822 , G01R31/308 , H01J37/00 , H01J2237/022 , H01J2237/0225 , H01L21/67253 , H01L21/67288 , H01L22/12
摘要： An apparatus and method for detecting defects on a specimen includes an illumination optical unit which obliquely projects a laser onto a region which is longer in one direction on a surface of a specimen than in a transverse direction, a table unit which mounts the specimen and which is movable, a detection optical unit which detects light from the specimen illuminated by the laser with an image sensor while the table is moving, and a signal processor. The signal processor processes a signal outputted from the image sensor of the detection optical unit and converted to a digital signal and extracts defects of the specimen by comparing the converted digital signal with a reference digital signal. A display unit displays information of defects extracted by the signal processor.
摘要翻译：用于检测试样缺陷的装置和方法包括照射光学单元，其将激光倾斜地突出到在一个方向上在一个方向上比在横向方向上更长的区域，安装样本的台单元，可移动的检测光学单元，检测光学单元，其在桌子移动时利用图像传感器检测由激光照射的样本的光，以及信号处理器。信号处理器处理从检测光学单元的图像传感器输出的信号并转换为数字信号，并通过将转换的数字信号与参考数字信号进行比较来提取样本的缺陷。显示单元显示由信号处理器提取的缺陷的信息。

15. 发明授权

US06894773B2 Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process 失效
标题翻译：用于分析半导体制造工艺中的外来颗粒的产生状态的方法和装置
公开(公告)号：US06894773B2
公开(公告)日：2005-05-17
申请号：US09805188
申请日：2001-03-14
申请人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Hidetoshi Nishiyama , Kazuhiko Matsuoka , Yoshiharu Shigyo
发明人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Hidetoshi Nishiyama , Kazuhiko Matsuoka , Yoshiharu Shigyo
IPC分类号： G01N21/00 , G01N21/94 , G01N21/95 , G01N21/956 , G01R31/308 , H01J37/00 , H01L21/00 , H01L21/66 , H01L21/68
CPC分类号： H01L21/681 , B82Y15/00 , G01N21/94 , G01N21/9501 , G01N21/95623 , G01N2021/8822 , G01R31/308 , H01J37/00 , H01J2237/022 , H01J2237/0225 , H01L21/67253 , H01L21/67288 , H01L22/12
摘要： A processing method for semiconductor devices in a semiconductor fabrication line includes processing a substrate in a first processing apparatus, transferring the substrate processed in the first processing apparatus to a detecting apparatus without removal of the substrate from the semiconductor fabrication line while continuing fabrication of the semiconductor devices, detecting foreign particle defects on the substrate transferred to the detecting apparatus, and determining a foreign particle generation condition of the processing apparatus based on a data from the detecting.
摘要翻译：半导体制造线中的半导体器件的处理方法包括在第一处理设备中处理衬底，将在第一处理设备中处理的衬底转移到检测设备，而不从半导体制造线移除衬底，同时继续制造半导体检测转移到检测装置的基板上的异物缺陷，以及根据来自检测的数据确定处理装置的异物生成条件。

16. 发明授权

US06650409B1 Semiconductor device producing method, system for carrying out the same and semiconductor work processing apparatus included in the same system 失效
标题翻译：半导体器件制造方法，用于实施相同的系统和包括在同一系统中的半导体工件处理设备
公开(公告)号：US06650409B1
公开(公告)日：2003-11-18
申请号：US08617270
申请日：1996-03-14
申请人： Minori Noguchi , Yukio Kembo , Hiroshi Morioka , Hidetoshi Nishiyama , Hideaki Doi , Masataka Shiba , Yoshiharu Shigyo , Kazuhiko Matsuoka , Kenji Watanabe , Yoshimasa Ohshima , Fumiaki Endo , Yuzo Taniguchi
发明人： Minori Noguchi , Yukio Kembo , Hiroshi Morioka , Hidetoshi Nishiyama , Hideaki Doi , Masataka Shiba , Yoshiharu Shigyo , Kazuhiko Matsuoka , Kenji Watanabe , Yoshimasa Ohshima , Fumiaki Endo , Yuzo Taniguchi
IPC分类号： G01N2189
CPC分类号： H01L21/67288 , G01N21/9501 , H01J2237/0225 , H01L21/67253 , H01L21/681
摘要： A semiconductor device producing method and a semiconductor device producing system employs a processing apparatus provided with a dust particle detecting apparatus. The dust particle detecting apparatus measures the condition of adhesion of dust particles adhering to a work at least before or after processing the work, manages the condition of incremental adhesion of dust particles to the work resulting from processing for each lot of works or for each work on the basis of the measured condition of adhesion of dust particles measured before or after processing the work, and determines the time when the processing apparatus is to be cleaned or the cycle of cleaning the processing apparatus on the basis of the managed condition of adhesion of dust particles.
摘要翻译：半导体器件制造方法和半导体器件制造系统采用具有灰尘粒子检测装置的处理装置。尘埃粒子检测装置至少在工件加工之前或之后测量附着在工件上的灰尘颗粒的附着状态，管理灰尘颗粒对于每批工件或每个工件的加工产生的增加粘附的条件基于在处理工件之前或之后测量的粉尘颗粒的粘附测量条件，并根据管理的粘附条件确定处理设备要清洁的时间或清洁处理设备的循环灰尘颗粒。

17. 发明授权

US5463459A Method and apparatus for analyzing the state of generation of foreign particles in semiconductor fabrication process 失效
标题翻译：用于分析半导体制造工艺中的外来颗粒的产生状态的方法和装置
公开(公告)号：US5463459A
公开(公告)日：1995-10-31
申请号：US46720
申请日：1993-04-16
申请人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Hidetoshi Nishiyama , Kazuhiko Matsuoka , Yoshiharu Shigyo
发明人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Hidetoshi Nishiyama , Kazuhiko Matsuoka , Yoshiharu Shigyo
IPC分类号： G01N21/00 , G01N21/94 , G01N21/95 , G01N21/956 , G01R31/308 , H01J37/00 , H01L21/00 , H01L21/66 , H01L21/68 , G01N21/89 , G02B27/46 , G06F15/46
CPC分类号： H01L21/681 , B82Y15/00 , G01N21/94 , G01N21/9501 , G01N21/95623 , G01R31/308 , H01J37/00 , H01L21/67253 , H01L21/67288 , G01N2021/8822 , H01J2237/022 , H01J2237/0225 , H01L22/12
摘要： A defect detecting apparatus including an illumination system for radiating a light of a plane wave linearly to a substrate having repetitive patterns of different pitches; a focusing optical system for focusing a light image reflected from the substrate thus illuminated by the illumination system; a spatial filter disposed intermediate the focusing optical system so as to shield a diffraction light from repetitive patterns of a small pitch on the substrate; a detector for detecting the light image formed by the focusing optical system; an erasing means for comparing and erasing signals which are generated on the basis of repetitive patterns of a large pitch and obtained through the spatial filter, out of signals detected by the detector; and a defect detecting means for detecting defects on the substrate in accordance with a signal detected by the detector, as well as a method applied to the said apparatus.
摘要翻译：一种缺陷检测装置，包括用于将平面波的光线线性地发射到具有不同间距的重复图案的基板的照明系统; 聚焦光学系统，用于聚焦由照明系统照射的从基板反射的光图像; 设置在聚焦光学系统之间的空间滤光器，以便屏蔽来自基板上的小间距的重复图案的衍射光; 用于检测由聚焦光学系统形成的光图像的检测器; 擦除装置，用于根据由检测器检测到的信号，比较和擦除基于大间距的重复图案并通过空间滤波器获得的信号; 以及缺陷检测装置，用于根据由检测器检测的信号检测基板上的缺陷，以及应用于所述装置的方法。

18. 发明授权

US5274434A Method and apparatus for inspecting foreign particles on real time basis in semiconductor mass production line 失效
标题翻译：半导体批量生产线实时检测外来颗粒的方法和装置
公开(公告)号：US5274434A
公开(公告)日：1993-12-28
申请号：US778363
申请日：1991-10-17
申请人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Yuzo Taniguchi
发明人： Hiroshi Morioka , Minori Noguchi , Yoshimasa Ohshima , Yukio Kembo , Yuzo Taniguchi
IPC分类号： G01N21/94 , G01N21/956 , G01R31/308 , H01J37/00 , H01L21/00 , H01L21/66 , H01L21/68 , G01N21/89 , G02B27/46 , G06F15/46
CPC分类号： H01L21/681 , B82Y15/00 , G01N21/94 , G01R31/308 , H01J37/00 , H01L21/67253 , H01L21/67276 , H01L21/67288 , H01L22/20 , G01N2021/8822 , G01N21/95623 , H01J2237/022 , H01J2237/0225 , H01L22/12
摘要： In a mass production line of a semiconductor manufacturing process, foreign particle inspection method and apparatus for preventing occurrence of large quantities of defects and for keeping a necessary yield. The inspection apparatus is made up in a small-sized apparatus and disposed at inlet/outlet of processing apparatuses of the production line or to a transfer system between the processing apparatuses. The inspection apparatus includes at least one monitor for real-time sampling foreign particles possible deposited on wafer which is being carried by the transfer system, thereby enabling simplification in construction of the production line and reduction of manufacturing cost. The inspection apparatus may comprise a refractive index changeable type lens array, a spatial filter and a pattern data elimination circuit, and makes possible to conduct foreign particle inspection on repetitively-patterned portions of the wafers during transfer. With the spatial filter for eliminating repetitive data of the repetition patterns the small-sized compact inspection apparatus is capable of real-time inspecting the foreign particles on the wafers at a high speed.
摘要翻译：在半导体制造方法的大规模生产线中，用于防止发生大量缺陷并保持必要成品率的外来颗粒检查方法和装置。检查装置由小型装置构成，配置在生产线的处理装置的出入口处或处理装置之间的转印系统。该检查装置包括至少一个监视器，用于实时采样可能沉积在由转印系统携带的晶片上的异物，从而能够简化生产线的构造和降低制造成本。检查装置可以包括折射率可变型透镜阵列，空间滤光器和图案数据消除电路，并且可以在转印期间对晶片的重复构图部分进行异物检查。利用用于消除重复图案的重复数据的空间滤波器，小型紧凑型检查装置能够以高速实时检查晶片上的异物。

19. 发明授权

US5233191A Method and apparatus of inspecting foreign matters during mass production start-up and mass production line in semiconductor production process 失效
标题翻译：在半导体生产过程中批量生产启动和批量生产线中检查异物的方法和装置
公开(公告)号：US5233191A
公开(公告)日：1993-08-03
申请号：US679317
申请日：1991-04-02
申请人： Minori Noguchi , Yukio Kembo , Hiroshi Morioka , Hiroshi Yamaguchi , Makiko Kohno , Yoshimasa Ohshima
发明人： Minori Noguchi , Yukio Kembo , Hiroshi Morioka , Hiroshi Yamaguchi , Makiko Kohno , Yoshimasa Ohshima
IPC分类号： G01N21/94 , G01N21/956 , G01Q10/00 , G01Q30/02 , G01Q30/04 , G01Q30/14 , G01Q60/10 , G01R31/311 , H01J37/256 , H01L21/00 , H01L21/66
CPC分类号： H01L21/67253 , G01R31/311 , H01J37/256 , H01L21/67276 , H01L21/67288 , H01L22/20 , B82Y35/00 , G01N2021/8822 , G01N21/94 , G01N21/95623
摘要： Method and apparatus of detecting, analyzing and evaluating the content of foreign matters such as dusts and impurities contained in various materials, units, processes and environment standing for constituting components of a mass production line during mass production start-up and during mass production, in order to manage a semiconductor production process. A mass production off-line system including an apparatus for detecting, analyzing and evaluating the content of foreign matters during the mass production start-up is separated from the production line and installed independently thereof. Monitors for detection of foreign matters are provided at necessary locations in the production line and monitor data is evaluated through various units to manage the content of foreign matters in the production line, permitting efficient and economical mass production start-up and mass production. The kind of element of a foreign matter on sampling wafer detected in the mass production line is analyzed by means of STM/STS and the results are compared with a data base to effect identification. A foreign matter or a contaminant is detected by detecting a scatttered beam, of a light spot which scans the surface of a substrate. The detection of the scattered beam is carried out under the condition that Rayleigh scattering of the light spot on the light spot irradiation and reflection paths and Rayleigh scattering of the scattered beam on the scattered beam detection path are suppressed to a minimum. For the suppression of Rayleigh scattering, a low-pressure or low-temperature atmosphere may be used.
摘要翻译：检测，分析和评估大规模生产启动期间和批量生产期间大规模生产线组成部件的各种材料，单位，工艺和环境中所含的灰尘和杂质等杂质的含量，为了管理半导体生产过程。包括用于在批量生产启动期间检测，分析和评估异物含量的装置的批量生产离线系统与生产线分离并独立安装。在生产线必需的位置提供检测异物的监测器，通过各种单位对监测数据进行评估，对生产线内的异物含量进行管理，实现高效，经济的批量生产启动和批量生产。通过STM / STS分析在大规模生产线上检测到的采样晶圆上的异物元素的种类，并将结果与数据库进行比较以进行识别。通过检测扫描基板表面的光斑的光斑光束来检测异物或污染物。在光点照射和反射路径上的光斑的瑞利散射和散射光束检测路径上的散射光束的瑞利散射被抑制到最小的条件下进行散射光束的检测。为了抑制瑞利散射，可以使用低压或低温气氛。

20. 发明申请

US20080087820A1 PROBE CONTROL METHOD FOR SCANNING PROBE MICROSCOPE 审中-公开
标题翻译：用于扫描探针显微镜的探测控制方法
公开(公告)号：US20080087820A1
公开(公告)日：2008-04-17
申请号：US11867476
申请日：2007-10-04
申请人： Toru KURENUMA , Hiroaki Yanagimoto , Yukio Kembo , Yuichi Kunitomo , Takafumi Morimoto , Satoshi Sekino
发明人： Toru KURENUMA , Hiroaki Yanagimoto , Yukio Kembo , Yuichi Kunitomo , Takafumi Morimoto , Satoshi Sekino
IPC分类号： G01N23/00
CPC分类号： G01Q10/06 , G01Q30/06
摘要： This probe control method is applied to the scanning probe microscope having a probe section with a probe pointed at a sample, a detection section for detecting physical quantity between the sample and the probe, a measurement section for measuring the surface of the sample to obtain the surface information on the basis of the physical quantity when scanning the sample surface by the probe, and a movement mechanism with at least two degree of freedom. The probe control method has steps of moving the probe in a scanning direction different from the contact direction while making the probe come into contact with the sample surface, detecting the torsional state of the probe during the movement of the probe, and adjusting either or both of the rate in the scanning direction and the force in the contact direction on the basis of the detected value obtained by the detection step.
摘要翻译：将该探针控制方法应用于具有探针指向样品的探针部的扫描探针显微镜，用于检测样品与探针之间的物理量的检测部，测定样品表面的测定部，基于通过探针扫描样品表面时的物理量的表面信息，以及具有至少两个自由度的移动机构。探针控制方法具有使探针沿着与接触方向不同的扫描方向移动的步骤，同时使探针与样品表面接触，检测探针移动期间探针的扭转状态，并且调节任一或两者基于通过检测步骤获得的检测值，扫描方向上的速率和接触方向上的力。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式