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11. 发明申请

US20220204693A1 Polyamide-Imide Copolymer and Film Containing the Same 有权
公开(公告)号：US20220204693A1
公开(公告)日：2022-06-30
申请号：US17404606
申请日：2021-08-17
申请人： MICROCOSM TECHNOLOGY CO., LTD.
发明人： Bo-Hung Lai , Tang-Chieh Huang
IPC分类号： C08G73/10 , C08J5/18
摘要： The present invention provides a polyamide-imide copolymer, which is obtained by copolymerizing an aromatic diamine monomer, a dianhydride monomer and an aromatic dicarbonyl monomer, wherein the aromatic diamine monomer comprises a diamine containing an amide group (—CONH2) represented by formula (1), and Q1, X1, X2, R1, R2, Y1, Y2 and m are as defined herein:

12. 发明授权

US09833973B2 Metal laminate with polyimide resin and method for manufacturing the same 有权
公开(公告)号：US09833973B2
公开(公告)日：2017-12-05
申请号：US14954724
申请日：2015-11-30
申请人： Microcosm Technology CO, LTD.
发明人： Tang-Chieh Huang , Sih-Ci Jheng , Chin-Te Yen
IPC分类号： B32B15/04 , B32B7/12 , B32B37/06 , B32B37/24 , B32B38/00 , H05K1/03 , H05K3/00 , H05K3/30 , H05K1/02 , H01B3/30 , B32B37/02 , B32B7/04 , B32B15/08 , B32B27/28 , C08J5/12 , H05K3/02 , B32B37/00
CPC分类号： B32B15/043 , B32B7/04 , B32B7/12 , B32B15/08 , B32B27/281 , B32B37/02 , B32B37/06 , B32B37/24 , B32B2037/0092 , B32B2037/243 , B32B2255/06 , B32B2255/26 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/412 , B32B2307/414 , B32B2307/50 , B32B2307/704 , B32B2307/732 , B32B2307/734 , B32B2311/00 , B32B2311/12 , B32B2379/08 , B32B2457/00 , B32B2457/08 , C08J2379/08 , H01B3/306 , H05K1/024 , H05K1/0346 , H05K3/022 , H05K2201/0154
摘要： A metal laminate comprising a metal layer and an insulating layer is provided. The insulating layer is disposed on the metal layer and directly contacts the metal layer. The insulating layer is made of a polyimide resin, and the polyimide resin is derived from at least two dianhydrides and at least two diamines. The dianhydride monomers are selected from the group consisting of p-phenylenebis (trimellitate anhydride), 4,4′-(hexafluoroisopropylidene)-diphthalic anhydride, 4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride) and the combination thereof. One of the diamine monomers is 2,2′-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4′-oxydianiline, 4,4′-methylenedianiline, 4,4′-diaminobenzanilide, 4,4′-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and the combination thereof. A molar ratio of the dianhydride monomers to the diamine monomers is between 0.85 and 1.15.

13. 发明申请

US20170077331A1 SEALING FILM FOR SOLAR CELL AND METHOD OF MANUFACTURING THE SAME, SEALING STRUCTURE FOR SOLAR CELL MODULE 审中-公开
标题翻译：用于太阳能电池的密封膜及其制造方法，用于太阳能电池模块的密封结构
公开(公告)号：US20170077331A1
公开(公告)日：2017-03-16
申请号：US14977666
申请日：2015-12-22
申请人： Industrial Technology Research Institute , Microcosm Technology Co., Ltd.
发明人： Chien-Rong Huang , Tung-Po Hsieh , Tang-Chieh Huang
IPC分类号： H01L31/048 , H01L31/05
CPC分类号： H01L31/048 , H01L31/022441 , H01L31/049 , H01L31/0516 , Y02E10/50
摘要： A sealing film for a solar cell and a method of manufacturing the same, and a sealing structure for a solar cell module having the sealing film for a solar cell are provided. The sealing film for a solar cell includes a substrate and an adhesive layer having a conducting wire structure, wherein the adhesive layer having the conducting wire structure is located on the substrate, and the conducting wire structure is in contact with the substrate. Via the sealing film for a solar cell having the above configuration, a plurality of solar cell units not electrically connected to one another can be electrically connected by using the conducting wire structure of the sealing film for a solar cell while sealing and laminating the solar cell.
摘要翻译：提供一种太阳能电池用密封膜及其制造方法以及具有太阳能电池用密封膜的太阳能电池模块用密封结构体。太阳能电池用密封膜包括基板和具有导线结构的粘合剂层，其中具有导线结构的粘合剂层位于基板上，导线结构与基板接触。通过具有上述结构的太阳能电池用密封膜，通过使用太阳能电池用密封膜的导线结构，能够将不能彼此电连接的多个太阳能电池单元电连接，同时密封并层压太阳能电池。

14. 发明申请

US20170009017A1 POLYMIDE RESIN, THIN FILM THEREOF AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：聚酰胺树脂，薄膜及其制造方法
公开(公告)号：US20170009017A1
公开(公告)日：2017-01-12
申请号：US14954767
申请日：2015-11-30
申请人： Microcosm Technology CO, LTD.
发明人： Tang-Chieh Huang , Sih-Ci Jheng
IPC分类号： C08G73/10
摘要： A polyimide resin derived from at least two dianhydrides and at least two diamines is provided. The dianhyride is selected from a group consisting of p-phenylenebis(trimellitate anhydride), 4,4′-(hexafluoroisopropylidene)-diphthalic anhydride, and 4,4′-(4,4′-isopropylidenediphenoxy)bis(phthalic anhydride). One of the diamine monomers is 2,2′-bis(trifluoromethyl)benzidine, and the other diamine monomers are selected from a group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl, 1,3-bis(4-aminophenoxy)benzene, p-phenylenediamine, 4,4′-oxydianiline, 4,4′-methylenedianiline, 4,4′-diaminobenzanilide, 4,4′-diaminodiphenyl-sulfone, m-tolidine, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane and the combination thereof. The molar ratio of the dianhydrides to the diamines is between 0.85 and 1.15.
摘要翻译：提供衍生自至少两种二酐和至少两种二胺的聚酰亚胺树脂。二苯胺选自对亚苯基双（偏苯三酸酐），4,4' - （六氟异亚丙基） - 邻苯二甲酸酐和4,4' - （4,4'-异丙基二苯氧基）双（邻苯二甲酸酐）组成的组。二胺单体之一是2,2'-双（三氟甲基）联苯胺，其它二胺单体选自2,2-双[4-（4-氨基苯氧基）苯基，1,3-双（ 4-氨基苯氧基）苯，对苯二胺，4,4'-氧二苯胺，4,4'-亚甲基二苯胺，4,4'-二氨基苯甲酰苯胺，4,4'-二氨基二苯基砜，间甲苯胺，2,2-双[ 4-（4-氨基苯氧基）苯基]六氟丙烷及其组合。二酐与二胺的摩尔比为0.85-1.15。

15. 发明授权

US09521759B2 Vertical conductive unit and manufacturing method thereof 有权
标题翻译：垂直导电单元及其制造方法
公开(公告)号：US09521759B2
公开(公告)日：2016-12-13
申请号：US14279774
申请日：2014-05-16
申请人： MICROCOSM TECHNOLOGY CO., LTD.
发明人： Tang-Chieh Huang
IPC分类号： H05K1/02 , H05K3/00 , H05K1/03 , H05K3/46 , C09D179/08 , C08G73/10
CPC分类号： H05K3/4644 , C08G73/1042 , C08G73/106 , C08G73/1075 , C09D179/08 , H05K3/4676 , H05K2201/0154
摘要： The invention provides a vertical conductive unit. The vertical conductive unit comprises an insulating layer comprising a connecting via, a first conductor, a second conductor, and a third conductor. The insulating layer comprises photosensitive polyimide, and the glass transition temperature of the photosensitive polyimide is lower than about 200° C. The invention also provides a method for manufacturing the vertical conductive unit.
摘要翻译：本发明提供一种垂直导电单元。垂直导电单元包括绝缘层，其包括连接通孔，第一导体，第二导体和第三导体。绝缘层包括光敏聚酰亚胺，感光性聚酰亚胺的玻璃化转变温度低于约200℃。本发明还提供了制造垂直导电单元的方法。

16. 发明申请

US20230117952A1 Flexible Display Cover Substrate 有权
公开(公告)号：US20230117952A1
公开(公告)日：2023-04-20
申请号：US17954709
申请日：2022-09-28
申请人： MICROCOSM TECHNOLOGY CO., LTD.
发明人： Chun-Yao Ou , Tang-Chieh Huang
IPC分类号： C08J7/046
摘要： The present invention provides a flexible display cover substrate, which comprises a transparent polyimide film; and a device protection layer formed by curing a hard coating composition and disposed on at least one surface of the transparent polyimide film. The hard coating composition includes a hydrophobic UV-curable resin, an antistatic agent, a compound with three or more reactive functional groups, an elastic oligomer, an initiator and a modified inorganic nanoparticle. According to the present invention, a flexible display cover substrate with low haze and good bending resistance can be obtained.

17. 发明申请

US20210165132A1 FLEXIBLE DISPLAY COVER SUBSTRATE 有权
公开(公告)号：US20210165132A1
公开(公告)日：2021-06-03
申请号：US16619089
申请日：2019-04-01
申请人： Microcosm Technology Co., Ltd.
发明人： Bo-Hung Lai , Chih-Te Yen , Tang-Chieh Huang
IPC分类号： G02B1/14 , G09F9/30 , C08J7/046 , C08L79/08 , C09D7/41 , C09D5/22
摘要： A flexible display cover substrate is provided, including a transparent polyimide film and a device protective layer. The device protective layer is formed by a hard coating layer disposed on at least one side of the transparent polyimide film, and the hard coating layer is composed of three or more reactive functional group compounds, an initiator, an elastic oligomer, a nano inorganic modified particle, and a fluorescent pigment. The flexible display cover substrate of the invention, after being folded by a radius of curvature of 1 mm, does not cause cracks on the surface of the hard coating layer or break the substrate, and the yellow index YI of the flexible display cover substrate is less than 2.0.

18. 发明授权

US10584209B2 Photosensitive polyimide resin composition and method of manufacturing cover film using the same 有权
公开(公告)号：US10584209B2
公开(公告)日：2020-03-10
申请号：US16519934
申请日：2019-07-23
申请人： Microcosm Technology CO. LTD
发明人： Tang-Chieh Huang , Kunhan Hsieh
IPC分类号： C08G73/10 , C08G59/02 , C08L79/08 , C09B57/10 , C09B69/10 , G03F7/038 , G03F7/16 , G03F7/40 , G03F7/075
摘要： A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition. The photo initiator has an amount of weight accounting for 0.1-15% of total solid weight of the transparent photosensitive resin.

19. 发明授权

US10407549B2 Photosensitive polyimide resin composition and method of manufacturing cover film using the same 有权
公开(公告)号：US10407549B2
公开(公告)日：2019-09-10
申请号：US15689402
申请日：2017-08-29
申请人： Microcosm Technology CO., LTD
发明人： Tang-Chieh Huang , Kunhan Hsieh
IPC分类号： C08G73/10 , C08G59/02 , C08L79/08 , C09B57/10 , C09B69/10 , G03F7/038 , G03F7/16 , G03F7/40 , G03F7/075
摘要： A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition. The photo initiator has an amount of weight accounting for 0.1-15% of total solid weight of the transparent photosensitive resin.

20. 发明申请

US20180346652A1 PHOTOSENSITIVE POLYIMIDE RESIN COMPOSITION AND METHOD OF MANUFACTURING COVER FILM USING THE SAME 审中-公开
公开(公告)号：US20180346652A1
公开(公告)日：2018-12-06
申请号：US15689402
申请日：2017-08-29
申请人： Microcosm Technology CO., LTD
发明人： Tang-Chieh Huang , Kunhan Hsieh
IPC分类号： C08G73/10 , C08G59/02 , C08L79/08 , C09B57/10 , C09B69/10 , G03F7/038 , G03F7/16 , G03F7/40
CPC分类号： C08G73/1042 , C08G59/02 , C08G73/1046 , C08G73/106 , C08L79/08 , C08L2666/70 , C09B57/10 , C09B69/10 , G03F7/0384 , G03F7/0387 , G03F7/0757 , G03F7/168 , G03F7/40 , C08K3/04
摘要： A photosensitive polyimide resin composition is provided. The resin composition comprises an infrared absorber, an epoxy, a photosensitive polyimide and a photo initiator. The infrared absorber includes pigment and has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The epoxy has an amount of weight accounting for 5-40% of total solid weight of the photosensitive polyimide resin composition. The photosensitive polyimide has the structure of formula (1): wherein m, n are independently 1 to 600; X is a tetravalent organic group, and the main chain of X includes alicyclic structure; Y is a divalent organic group, and the main chain of Y includes siloxane structure; Z is a divalent organic group, and the side chain of Z includes phenolic hydroxyl group or carboxyl group. The photosensitive polyimide has an amount of weight accounting for 30-90% of total solid weight of the photosensitive polyimide resin composition. The photo initiator has an amount of weight accounting for 0.1-15% of total solid weight of the transparent photosensitive resin.

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