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11. 发明授权

US08048978B2 Silphenylene compound and process for producing the same 有权
标题翻译：硅烯化合物及其制造方法
公开(公告)号：US08048978B2
公开(公告)日：2011-11-01
申请号：US12332924
申请日：2008-12-11
申请人： Michihiro Sugo , Takahiro Goi , Tomoyuki Goto , Shohei Tagami
发明人： Michihiro Sugo , Takahiro Goi , Tomoyuki Goto , Shohei Tagami
IPC分类号： C08G77/12
CPC分类号： C07F7/0812 , C08G73/1039 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/106 , C08G73/1075 , C08G73/1078 , H05K1/0346
摘要： The present invention relates to a silphenylene compound represented by the following formula (1): in which R1 to R4 each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R5 and R6 each independently represents a divalent hydrocarbon group having 2 to 8 carbon atoms. The silphenylene compound of the present invention is useful as a flexible printed wiring board material, a passivation film for IC chips, and a panel material for liquid crystals.
摘要翻译：本发明涉及由下式（1）表示的硅亚苯基化合物：其中R 1至R 4各自独立地表示氢原子或具有1至6个碳原子的一价烃基，R 5和R 6各自独立地表示二价烃具有2至8个碳原子的基团。本发明的硅亚苯基化合物可用作柔性印刷线路板材料，IC芯片用钝化膜和液晶面板材料。

12. 发明授权

US08501879B2 Adhesive composition, adhesive sheet, semiconductor apparatus protection material, and semiconductor apparatus 有权
标题翻译：胶粘剂组合物，粘合片，半导体装置保护材料和半导体装置
公开(公告)号：US08501879B2
公开(公告)日：2013-08-06
申请号：US13221547
申请日：2011-08-30
申请人： Kazunori Kondo , Michihiro Sugo , Hideto Kato
发明人： Kazunori Kondo , Michihiro Sugo , Hideto Kato
IPC分类号： C08G83/00 , C08G77/20 , C08L83/14 , C08F299/08
CPC分类号： H01L23/293 , C08G77/14 , C08G77/52 , C08L63/00 , C08L83/14 , C09J163/00 , C09J183/14 , H01L21/563 , H01L21/6836 , H01L23/3164 , H01L23/556 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L2221/68336 , H01L2221/6834 , H01L2224/16225 , H01L2224/16227 , H01L2224/27003 , H01L2224/27436 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/2939 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81011 , H01L2224/8113 , H01L2224/81193 , H01L2224/8313 , H01L2224/83191 , H01L2224/83192 , H01L2224/83201 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01045 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/15788 , H05K3/305 , H05K2201/10674 , H01L2224/81 , H01L2224/83 , H01L2924/00015 , H01L2924/00 , H01L2924/01047 , H01L2924/00014
摘要： A semiconductor apparatus adhesive composition having excellent adhesion properties when pressure-bonded and has excellent connection reliability and insulation reliability when hardened and an adhesive sheet using this adhesive composition. An adhesive composition including: (A) a silicone resin constituted of a repeating unit represented by the following general formula (1); (B) a thermosetting resin; and (C) a compound having a flux activity, where R1 to R4 represent univalent hydrocarbon groups having carbon numbers from 1 to 8, which are equal to or different from each other; each of l and m is an integer from 1 to 100; each of a, b, c, and d is 0 or a positive number and meets 0
摘要翻译：一种半导体装置粘合剂组合物，当粘合时具有优异的粘合性能，并且当硬化时具有优异的连接可靠性和绝缘可靠性，以及使用该粘合剂组合物的粘合一种粘合剂组合物，其包含：（A）由以下通式（1）表示的重复单元构成的有机硅树脂; （B）热固性树脂; 和（C）具有助焊剂活性的化合物，其中R 1至R 4表示碳数为1至8的一价烃基，它们彼此相同或不同; 1和m各自为1至100的整数; a，b，c和d中的每一个为0或正数，满足0 <（c + d）/（a + b + c + d）并且X和Y各自为二价有机基团。

13. 发明授权

US08378148B2 Alcoholic hydroxyl-containing compounds and making method 有权
标题翻译：含醇羟基的化合物及其制备方法
公开(公告)号：US08378148B2
公开(公告)日：2013-02-19
申请号：US12898136
申请日：2010-10-05
申请人： Takato Sakurai , Michihiro Sugo , Takanobu Takeda , Hideto Kato
发明人： Takato Sakurai , Michihiro Sugo , Takanobu Takeda , Hideto Kato
IPC分类号： C07C43/23 , C07C41/26
CPC分类号： C07C43/23 , C07C41/26 , C08K5/06 , C08K5/1515
摘要： Bisphenol derivatives having both alcoholic hydroxyl and allyl groups are novel and useful as reagents for modifying organic resins and silicone resins.
摘要翻译：具有醇羟基和烯丙基两者的双酚衍生物是新型的，可用作改性有机树脂和有机硅树脂的试剂。

14. 发明申请

US20130029145A1 WAFER PROCESSING LAMINATE, WAFER PROCESSING MEMBER, TEMPORARY BONDING ARRANGEMENT, AND THIN WAFER MANUFACTURING METHOD 有权
标题翻译：波浪加工层压板，波浪加工构件，临时粘结布置和薄膜制造方法
公开(公告)号：US20130029145A1
公开(公告)日：2013-01-31
申请号：US13556655
申请日：2012-07-24
申请人： Hideto Kato , Michihiro Sugo , Shohei Tagami
发明人： Hideto Kato , Michihiro Sugo , Shohei Tagami
IPC分类号： C09J183/04 , C09J7/02 , B32B27/04 , B32B7/12 , B32B37/02 , B32B38/10
CPC分类号： H01L21/6836 , C08G77/04 , C08G77/14 , C08G77/52 , C08G77/70 , C09J183/04 , C09J183/14 , H01L2221/68327 , H01L2221/6834 , Y10T428/2848 , Y10T428/31515 , Y10T428/31663
摘要： A laminate comprising a support, a temporary adhesive layer, and a wafer having a circuit-forming front surface and a back surface to be processed allows for processing the wafer. The temporary adhesive layer consists of a first temporary bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the front surface of the wafer and a second temporary bond layer (B) of thermosetting modified siloxane polymer which is laid contiguous to the first temporary bond layer and releasably bonded to the support.
摘要翻译：包括支撑体，临时粘合剂层和具有电路形成前表面和待加工的背面的晶片的层压体允许处理晶片。临时粘合剂层由热塑性有机硅氧烷聚合物的第一临时粘结层（A）组成，该第一临时粘结层（A）可释放地结合到晶片的前表面，以及热固性改性的硅氧烷聚合物的第二临时粘合层（B）临时粘合层并且可释放地结合到载体上。

15. 发明申请

US20110082321A1 ALCOHOLIC HYDROXYL-CONTAINING COMPOUNDS AND MAKING METHOD 有权
标题翻译：含醇羟基的化合物和制备方法
公开(公告)号：US20110082321A1
公开(公告)日：2011-04-07
申请号：US12898136
申请日：2010-10-05
申请人： Takato SAKURAI , Michihiro Sugo , Takanobu Takeda , Hideto Kato
发明人： Takato SAKURAI , Michihiro Sugo , Takanobu Takeda , Hideto Kato
IPC分类号： C07C43/23 , C07C41/26
CPC分类号： C07C43/23 , C07C41/26 , C08K5/06 , C08K5/1515
摘要： Bisphenol derivatives having both alcoholic hydroxyl and allyl groups are novel and useful as reagents for modifying organic resins and silicone resins.
摘要翻译：具有醇羟基和烯丙基两者的双酚衍生物是新型的，可用作改性有机树脂和有机硅树脂的试剂。

16. 发明申请

US20060183880A1 Photosensitive resin and a method of preparing the same 审中-公开
标题翻译：感光树脂及其制备方法
公开(公告)号：US20060183880A1
公开(公告)日：2006-08-17
申请号：US11352267
申请日：2006-02-13
申请人： Yoshitaka Aoki , Michihiro Sugo , Hideto Kato
发明人： Yoshitaka Aoki , Michihiro Sugo , Hideto Kato
IPC分类号： C08G73/00 , C08G69/08
CPC分类号： G03F7/023 , C08G73/10 , C08G73/1025 , C08G73/1039 , C08G73/1042 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1071
摘要： A polyimide resin having a number average molecular weight of from 2,000 to 800,000 and a repeating unit represented by the following formula (1): wherein X is a tetravalent organic group, Y is a divalent organic group, 75 to 98 mole % of R1 is hydrogen atom, and 2 to 25 mole % of R1 is 1,2-naphthoquinonediazide sulfonyl group.
摘要翻译：数均分子量为2,000〜800,000的聚酰亚胺树脂和由下式（1）表示的重复单元：其中X为四价有机基团，Y为二价有机基团，75〜98摩尔％ SUP> 1是氢原子，2〜25摩尔％的R 1是1,2-萘醌二叠氮化物磺酰基。

17. 发明授权

US06723432B2 Electrode-forming compositions and electrode members 有权
标题翻译：电极形成组合物和电极构件
公开(公告)号：US06723432B2
公开(公告)日：2004-04-20
申请号：US10105263
申请日：2002-03-26
申请人： Michihiro Sugo , Hideto Kato
发明人： Michihiro Sugo , Hideto Kato
IPC分类号： B32B1508
CPC分类号： H01G9/155 , C08G73/1039 , C08G73/106 , C08G73/1064 , C08G73/1067 , C08G73/1071 , H01M4/13 , H01M4/621 , H01M4/622 , H01M10/0525 , Y02E60/13 , Y10T428/31511 , Y10T428/31529 , Y10T428/31681
摘要： An electrode-forming composition comprising a binder component containing a solvent-soluble polyimide silicone and an epoxy compound, and an electrically conductive material can be cured and bonded to a current collector at a relatively low temperature and has excellent adhesion and chemical resistance, facilitating the manufacture of lithium ion batteries and electrical double-layer capacitors of various shapes.
摘要翻译：包含含有溶剂可溶性聚酰亚胺硅氧烷和环氧化合物的粘合剂组分和导电材料的电极形成组合物可以在相对低的温度下固化并结合到集电体上并且具有优异的粘合性和耐化学性，制造各种形状的锂离子电池和双电层电容器。

18. 发明授权

US06703133B2 Polyimide silicone resin, its solution composition, and polyimide silicone resin film 有权
标题翻译：聚酰亚胺硅树脂，其溶液组成和聚酰亚胺硅树脂薄膜
公开(公告)号：US06703133B2
公开(公告)日：2004-03-09
申请号：US09892445
申请日：2001-06-28
申请人： Michihiro Sugo , Hideto Kato
发明人： Michihiro Sugo , Hideto Kato
IPC分类号： C08G7726
CPC分类号： C08G77/455 , C08L83/10 , H05K3/285 , Y10T428/31663
摘要： A polyimide silicone resin which is obtained from a diamine containing an acid dianhydride and a diaminopolysiloxane, contains 50% by weight or more of a siloxane residual group and has an elongation at rupture of 400% or higher and a modulus of elasticity of 500 N/mm2 or lower. Also disclosed are a polyimide silicone resin solution composition comprising this polyimide silicone resin and a ketone solvent having a boiling point of 130° C. or below, and a polyimide silicone resin film comprising this polyimide silicone resin and formed on a substrate. The polyimide silicone resin can form films at relatively low temperature, has superior adhesiveness to substrates and durability under conditions of high humidity and also has low stress and high elongation.
摘要翻译：由含有酸二酐和二氨基聚硅氧烷的二胺获得的聚酰亚胺硅树脂含有50重量％以上的硅氧烷残基，断裂伸长率在400％以上，弹性模量为500N / mm 2以下。还公开了包含该聚酰亚胺硅树脂和沸点为130℃以下的酮溶剂的聚酰亚胺硅树脂溶液组合物和形成在基材上的聚酰亚胺硅树脂薄膜。聚酰亚胺硅树脂可以在较低温度下形成薄膜，在高湿度条件下具有优异的基材粘合性和耐久性，并且应力低和伸长率高。

19. 发明申请

US20090156753A1 SILPHENYLENE COMPOUND AND PROCESS FOR PRODUCING THE SAME 有权
标题翻译：苯乙烯化合物及其生产方法
公开(公告)号：US20090156753A1
公开(公告)日：2009-06-18
申请号：US12332924
申请日：2008-12-11
申请人： Michihiro Sugo , Takahiro Goi , Tomoyuki Goto , Shohei Tagami
发明人： Michihiro Sugo , Takahiro Goi , Tomoyuki Goto , Shohei Tagami
IPC分类号： C07F7/08 , C08G73/10
CPC分类号： C07F7/0812 , C08G73/1039 , C08G73/1042 , C08G73/1046 , C08G73/105 , C08G73/106 , C08G73/1075 , C08G73/1078 , H05K1/0346
摘要： The present invention relates to a silphenylene compound represented by the following formula (1): in which R1 to R4 each independently represents a hydrogen atom or a monovalent hydrocarbon group having 1 to 6 carbon atoms, and R5 and R6 each independently represents a divalent hydrocarbon group having 2 to 8 carbon atoms. The silphenylene compound of the present invention is useful as a flexible printed wiring board material, a passivation film for IC chips, and a panel material for liquid crystals.
摘要翻译：本发明涉及由下式（1）表示的硅亚苯基化合物：其中R 1至R 4各自独立地表示氢原子或具有1至6个碳原子的一价烃基，R 5和R 6各自独立地表示二价烃具有2至8个碳原子的基团。本发明的硅亚苯基化合物可用作柔性印刷线路板材料，IC芯片用钝化膜以及液晶面板材料。

20. 发明授权

US08487062B2 Polyimidesilicone having alcoholic hydroxyl group and process for producing the same 有权
标题翻译：具有醇羟基的聚酰亚胺及其制造方法
公开(公告)号：US08487062B2
公开(公告)日：2013-07-16
申请号：US12893784
申请日：2010-09-29
申请人： Michihiro Sugo , Shohei Tagami , Hideto Kato
发明人： Michihiro Sugo , Shohei Tagami , Hideto Kato
IPC分类号： C08G77/04
CPC分类号： C08G73/106 , C08G73/101 , C08G73/1039 , C08G73/1042 , C08G77/455 , H05K3/285 , H05K2201/0154 , H05K2201/0162
摘要： The present invention provides a polyimidesilicone having a primary alcoholic hydroxyl group, which is represented by the following general formula (1): in which k and m are each a positive integer where k and m satisfy a relation of 0.01≦k/(k+m)
摘要翻译：本发明提供一种具有伯醇羟基的聚酰亚胺，其由下列通式（1）表示：其中k和m各自为正整数，其中k和m满足0.01@k/（k + m）<1; X，Y和W如说明书中所定义。

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