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11. 发明授权

US06809031B1 Method for manufacturing a reclaimable test pattern wafer for CMP applications 失效
标题翻译：制造用于CMP应用的可回收测试图案晶片的方法
公开(公告)号：US06809031B1
公开(公告)日：2004-10-26
申请号：US09752610
申请日：2000-12-27
申请人： Michael S. Lacy
发明人： Michael S. Lacy
IPC分类号： H01L21302
CPC分类号： H01L22/34 , H01L21/31051
摘要： In a method for manufacturing a test pattern wafer, a silicon substrate is provided. A sacrificial oxide layer is deposited over the silicon substrate, and simulated transistor structure test features are fabricated into and on the sacrificial oxide layer. Chemical mechanical polishing characterization is performed using the test pattern wafer which provides data for the characterization of the chemical mechanical polishing. The sacrificial oxide layer is then stripped along with the simulated transistor structure test features, allowing the silicon substrate to be reclaimed and to be used in the fabrication of subsequent test pattern wafers.
摘要翻译：在制造测试图案晶片的方法中，提供硅衬底。在硅衬底上沉积牺牲氧化物层，并且将模拟的晶体管结构测试特征制造在牺牲氧化物层中和上。使用提供化学机械抛光表征的数据的测试图案晶片进行化学机械抛光表征。然后将牺牲氧化物层与模拟的晶体管结构测试特征一起剥离，允许回收硅衬底并用于后续测试图案晶片的制造。

12. 发明授权

US06554688B2 Method and apparatus for conditioning a polishing pad with sonic energy 失效
公开(公告)号：US06554688B2
公开(公告)日：2003-04-29
申请号：US09754702
申请日：2001-01-04
申请人： Michael S. Lacy
发明人： Michael S. Lacy
IPC分类号： B24B100
CPC分类号： B24B53/017 , B24B1/04 , B24B53/10
摘要： A method and apparatus for conditioning a polishing pad is described, wherein the polishing pad has a polishing surface for polishing the semiconductor wafer, and a back surface opposed to the polishing surface. The method includes positioning a sonic energy generator adjacent to the back surface of the polishing pad, and generating sonic energy through the back surface of the polishing pad. The apparatus includes a sonic energy generator adapted to be positioned adjacent the back surface, the sonic energy generator including a transducer connected to a contact member, wherein the sonic energy generator is adapted to transmit sonic energy in a direction through the back surface and to the polishing surface of the polishing belt.

13. 发明授权

US07435161B2 Multi-layer polishing pad material for CMP 有权
标题翻译：用于CMP的多层抛光垫材料
公开(公告)号：US07435161B2
公开(公告)日：2008-10-14
申请号：US11113498
申请日：2005-04-25
申请人： Abaneshwar Prasad , Michael S. Lacy
发明人： Abaneshwar Prasad , Michael S. Lacy
IPC分类号： B24B1/00
CPC分类号： B24D3/32 , B24B37/205 , B24B37/22
摘要： The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, the polishing layer being joined to the bottom layer without the use of an adhesive; the polishing layer having an average surface roughness, Ra, that is greater than the Ra of the bottom layer.
摘要翻译：本发明涉及一种用于化学机械抛光的多层抛光垫，其包括多孔抛光层和多孔底层，其中底层与抛光层基本上共同延伸，抛光层连接到底层，而没有使用粘合剂; 抛光层的平均表面粗糙度Ra大于底层的Ra。

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