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11. 再颁专利

USRE40975E1 Head suspension with resonance feedback transducer 有权
标题翻译：头部悬挂与共振反馈传感器
公开(公告)号：USRE40975E1
公开(公告)日：2009-11-17
申请号：US11452076
申请日：2006-06-09
申请人： Robert B. Evans , Todd A. Krinke
发明人： Robert B. Evans , Todd A. Krinke
IPC分类号： G11B21/02 , G11B5/596 , G11B5/48
CPC分类号： G11B5/4833
摘要： A head suspension assembly including a load beam having a rigid region, a mounting region on a proximal end of the load beam, and a flexure on a distal end of the load beam. The flexure has a read/write head attachment region for supporting a read/write head on the distal end of the load beam. Deformation of the head suspension assembly displaces the head attachment region. A strain transducer circuit that acts as a strain gauge is mounted on the head suspension assembly. The resistance of the transducer circuit varies with strain in the circuit, which, in turn, varies with displacement of the read/write head. The magnitude of resistance change of the transducer circuit indicates the magnitude of head off-neutral motion.
摘要翻译：头悬挂组件，包括具有刚性区域的负载梁，负载梁的近端上的安装区域和负载梁的远端上的挠曲件。弯曲部具有用于在负载梁的远端上支撑读/写头的读/写头附接区域。头部悬挂组件的变形使头部附接区域移位。用作应变计的应变传感器电路安装在磁头悬挂组件上。换能器电路的电阻随着电路中的应变而变化，随着读/写头的位移而变化。换能器电路的电阻变化幅度表示磁头偏离中性运动的大小。

12. 发明申请

US20120022431A1 Iontophoretic Drug Delivery Packaging 有权
标题翻译：离子电渗药物包装
公开(公告)号：US20120022431A1
公开(公告)日：2012-01-26
申请号：US12597950
申请日：2009-09-03
申请人： Todd A. Krinke
发明人： Todd A. Krinke
IPC分类号： A61N1/30 , B65B7/28 , B65B5/04
CPC分类号： A61N1/303 , A61N1/0428 , A61N1/044 , A61N1/0448 , A61N1/30 , A61N1/325
摘要： The present invention relates generally to iontophoretic drug delivery systems for transdermal delivery of therapeutic agents and, more particularly, to packaging such systems for long shelf life and easy assembly for use. The system package includes an iontophoretic skin worn patch component that accommodates a power source, electronics, electrodes and a drug pack component that carries a therapeutic agent which is contained as a separate sealed component. The packaged system further provides for ease of assembly at the time of use.
摘要翻译：本发明一般涉及用于经皮递送治疗剂的离子电渗药物递送系统，更具体地涉及包装这种系统以保持长期的保质期和易于使用的组装。系统包装包括离子电渗皮肤磨损的贴片组件，其容纳电源，电子器件，电极和携带治疗剂的药物组分，其作为单独的密封组分包含。该包装系统进一步提供了在使用时易于组装。

13. 发明授权

US07256968B1 Microactuated dimple for head suspensions 有权
标题翻译：用于头部悬挂的微动凹坑
公开(公告)号：US07256968B1
公开(公告)日：2007-08-14
申请号：US09952121
申请日：2001-09-11
申请人： Todd A. Krinke
发明人： Todd A. Krinke
IPC分类号： G11B21/10
CPC分类号： G11B5/4826 , G11B5/5552
摘要： A head suspension for supporting a head slider over a disk in a dynamic storage device and providing precise movement of the head slider relative to tracks on the disk. The head suspension includes a load beam, a flexure having a slider mounting region, and a dimple interface transmitting a load beam force to the slider mounting region. The head suspension further includes a microactuator mounted to the load beam. Movement of the microactuator is transmitted through the dimple interface by action of frictional forces at the dimple interface so as to cause movement of the slider mounting region transverse to tracks on the disk. A method of precisely moving a head slider supported by a head suspension includes providing and driving a microactuator configured to transmit movement of the microactuator to a slider mounting region through a dimple interface by action of frictional forces at the dimple interface.
摘要翻译：一种用于将磁头滑动器支撑在动态存储装置中的磁盘上的磁头悬架，并且提供磁头滑块相对于磁盘上的轨道的精确移动。磁头悬架包括负载梁，具有滑块安装区域的挠曲件和将载荷梁力传递到滑块安装区域的凹坑接口。磁头悬架还包括安装到负载梁的微型致动器。微型致动器的运动通过凹坑界面通过凹坑界面处的摩擦力的作用传递，以使滑块安装区域横向于盘上的轨道移动。精确地移动由头悬挂器支撑的磁头滑块的方法包括提供和驱动微致动器，该微致动器被配置为通过凹陷界面处的摩擦力的作用将微型致动器的运动传递到通过凹坑界面的滑块安装区域。

14. 发明授权

US06483669B1 Integrated lead suspension with IC chip and method of manufacture 失效
标题翻译：集成芯片芯片及其制造方法
公开(公告)号：US06483669B1
公开(公告)日：2002-11-19
申请号：US09397448
申请日：1999-09-17
申请人： Todd A. Krinke
发明人： Todd A. Krinke
IPC分类号： G11B548
CPC分类号： G11B5/48 , G11B5/127 , G11B5/4833 , G11B5/484 , G11B5/486 , H01L23/5387 , H01L2224/16237 , H01L2924/00014 , H05K1/056 , H05K1/112 , H05K1/189 , H05K2201/0394 , H05K2201/09472 , H05K2201/10674 , Y10T29/49027 , Y10T29/49028 , Y10T29/4903 , Y10T29/49032 , Y10T29/49041 , Y10T29/49043 , Y10T29/49044 , Y10T29/49149 , Y10T29/49156 , Y10T29/49169 , H01L2224/0401
摘要： An integrated lead suspension or flexure having an integrated circuit (IC) mounting region on which an IC chip with an array of solder-covered terminals can be mounted. The suspension or flexure include a stainless steel layer, integrated conductive leads and an insulating layer between the conductive leads and the stainless steel layer. The stainless steel layer has an IC window for receiving an array of terminals of an IC. The integrated conductive leads extend along the stainless steel layer into the IC window, and include an array of bond pads in the IC window corresponding to the array of terminals of the IC to be mounted to the suspension or flexure. The insulating layer extends into the IC window and includes an array of solder mask holes corresponding to the array of conductive lead bond pads. The IC chip can thereby be mounted to the suspension or flexure in the IC window and its array of terminals soldered to the corresponding array of conductive lead bond pads through the array of solder mask holes.
摘要翻译：具有集成电路（IC）安装区域的集成引线悬架或挠曲件，可安装具有焊料覆盖端子阵列的IC芯片。悬挂或挠曲包括不锈钢层，集成导电引线和导电引线与不锈钢层之间的绝缘层。不锈钢层具有用于接收IC的端子阵列的IC窗口。集成导电引线沿着不锈钢层延伸到IC窗口中，并且包括在IC窗口中的对应于要安装到悬架或挠曲件的IC的端子阵列的接合焊盘阵列。绝缘层延伸到IC窗口中，并且包括对应于导电引线接合焊盘阵列的焊接掩模孔阵列。因此，IC芯片可以安装在IC窗口中的悬挂或弯曲处，并且其阵列的端子通过焊接掩模孔的阵列焊接到相应的导电引线接合焊盘阵列。

15. 发明授权

US09456820B2 Incisionless gastric bypass method and devices 有权
公开(公告)号：US09456820B2
公开(公告)日：2016-10-04
申请号：US13528665
申请日：2012-06-20
申请人： Michel Gagner , David J. Blaeser , Todd A. Krinke , Philip J. Haarstad
发明人： Michel Gagner , David J. Blaeser , Todd A. Krinke , Philip J. Haarstad
IPC分类号： A61M5/00 , A61B1/00 , A61B18/18 , A61B19/00 , A61B17/11 , A61B17/221 , A61B17/00 , A61B17/29
CPC分类号： A61B17/1114 , A61B17/221 , A61B2017/00278 , A61B2017/00296 , A61B2017/00336 , A61B2017/0034 , A61B2017/00358 , A61B2017/00477 , A61B2017/00876 , A61B2017/1117 , A61B2017/1139 , A61B2017/2926
摘要： A system and method for endoscopically forming an anastomosis between two naturally adjacent points in the digestive tract. The system and method utilizes elongate magnetic devices that, when connected across a tissue boundary, necrose tissue until an anastomosis forms and the devices are passed naturally. Despite the elongate shape of the devices, the resulting anastomosis is substantially round. As such, round anastomoses can be formed having increased diameters merely by increasing the lengths of the devices, obviating the need for wider endoscopes.

16. 发明申请

US20110144560A1 Incisionless Gastric Bypass Method And Devices 审中-公开
标题翻译：无切口胃旁路方法和装置
公开(公告)号：US20110144560A1
公开(公告)日：2011-06-16
申请号：US12837392
申请日：2010-07-15
申请人： Michel Gagner , David J. Blaeser , Todd A. Krinke , Philip J. Haarstad
发明人： Michel Gagner , David J. Blaeser , Todd A. Krinke , Philip J. Haarstad
IPC分类号： A61M5/00
CPC分类号： A61B17/1114 , A61B17/221 , A61B2017/00278 , A61B2017/00296 , A61B2017/00336 , A61B2017/0034 , A61B2017/00358 , A61B2017/00477 , A61B2017/00876 , A61B2017/1117 , A61B2017/1139 , A61B2017/2926
摘要： A system and method for endoscopically forming an anastomosis between two naturally adjacent points in the digestive tract. The system and method utilizes elongate magnetic devices that, when connected across a tissue boundary, necrose tissue until an anastomosis forms and the devices are passed naturally. Despite the elongate shape of the devices, the resulting anastomosis is substantially round. As such, round anastomoses can be formed having increased diameters merely by increasing the lengths of the devices, obviating the need for wider endoscopes.
摘要翻译：用于内窥镜形成消化道中两个自然相邻点之间的吻合的系统和方法。该系统和方法利用细长的磁性装置，当穿过组织边界连接时，去皮组织直到吻合形成并且装置自然通过。尽管装置的细长形状，所得到的吻合基本上是圆形的。因此，仅通过增加装置的长度就可以形成具有增加的直径的圆形吻合，从而避免需要更宽的内窥镜。

17. 发明授权

US5862015A Head suspension with resonance feedback transducer 失效
公开(公告)号：US5862015A
公开(公告)日：1999-01-19
申请号：US861530
申请日：1997-05-22
申请人： Robert B. Evans , Todd A. Krinke
发明人： Robert B. Evans , Todd A. Krinke
IPC分类号： G11B21/21 , G11B5/48
CPC分类号： G11B5/4833
摘要： A head suspension assembly including a load beam having a rigid region, a mounting region on a proximal end of the load beam, and a flexure on a distal end of the load beam. The flexure has a read/write head attachment region for supporting a read/write head on the distal end of the load beam. Deformation of the head suspension assembly displaces the head attachment region. A strain transducer circuit that acts as a strain gauge is mounted on the head suspension assembly. The resistance of the transducer circuit varies with strain in the circuit, which, in turn, varies with displacement of the read/write head. The magnitude of resistance change of the transducer circuit indicates the magnitude of head off-neutral motion.

18. 发明授权

US09492650B2 Iontophoretic drug delivery packaging 有权
标题翻译：离子电渗药物输送包装
公开(公告)号：US09492650B2
公开(公告)日：2016-11-15
申请号：US12597950
申请日：2009-09-03
申请人： Todd A. Krinke
发明人： Todd A. Krinke
IPC分类号： A61N1/04 , A61N1/30 , A61N1/32
CPC分类号： A61N1/303 , A61N1/0428 , A61N1/044 , A61N1/0448 , A61N1/30 , A61N1/325
摘要： The present invention relates generally to iontophoretic drug delivery systems for transdermal delivery of therapeutic agents and, more particularly, to packaging such systems for long shelf life and easy assembly for use. The system package includes an iontophoretic skin worn patch component that accommodates a power source, electronics, electrodes and a drug pack component that carries a therapeutic agent which is contained as a separate sealed component. The packaged system further provides for ease of assembly at the time of use.
摘要翻译：本发明一般涉及用于经皮递送治疗剂的离子电渗药物递送系统，更具体地涉及包装这种系统以保持长期的保质期和易于使用的组装。系统包装包括离子电渗皮肤磨损的贴片组件，其容纳电源，电子器件，电极和携带治疗剂的药物组分，其作为单独的密封组分包含。该包装系统进一步提供了在使用时易于组装。

19. 发明申请

US20120330330A1 Incisionless Gastric Bypass Method And Devices 有权
公开(公告)号：US20120330330A1
公开(公告)日：2012-12-27
申请号：US13528649
申请日：2012-06-20
申请人： Michel Gagner , David J. Blaeser , Todd A. Krinke , Philip J. Haarstad
发明人： Michel Gagner , David J. Blaeser , Todd A. Krinke , Philip J. Haarstad
IPC分类号： A61B17/11
CPC分类号： A61B17/1114 , A61B17/221 , A61B2017/00278 , A61B2017/00296 , A61B2017/00336 , A61B2017/0034 , A61B2017/00358 , A61B2017/00477 , A61B2017/00876 , A61B2017/1117 , A61B2017/1139 , A61B2017/2926
摘要： A system and method for endoscopically forming an anastomosis between two naturally adjacent points in the digestive tract. The system and method utilizes elongate magnetic devices that, when connected across a tissue boundary, necrose tissue until an anastomosis forms and the devices are passed naturally. Despite the elongate shape of the devices, the resulting anastomosis is substantially round. As such, round anastomoses can be formed having increased diameters merely by increasing the lengths of the devices, obviating the need for wider endoscopes.

20. 发明授权

US06639757B2 Heat dissipation structures for integrated lead disk drive head suspensions 有权
公开(公告)号：US06639757B2
公开(公告)日：2003-10-28
申请号：US09757545
申请日：2001-01-10
申请人： Catherine A. Morley , Todd A. Krinke , John H. Tangren
发明人： Catherine A. Morley , Todd A. Krinke , John H. Tangren
IPC分类号： G11B2116
CPC分类号： G11B7/22 , G11B5/4833 , G11B5/484 , G11B7/0932 , G11B7/122 , G11B21/16 , G11B33/14
摘要： A head suspension or head suspension component that includes a spring metal support layer, an insulating layer and a conductive layer, into which three dimensional heat dissipation structures have been integrally formed to dissipate heat from the head suspension, especially in an area adjacent to an integrated circuit mounted on the head suspension. The heat dissipation structures may include a plurality of heat fins formed into or onto one or more conductive traces of the conductive layer, or may include a plurality of projections or indentations formed into or onto conductive traces. Use of a partial etching technique allows for simultaneous etching of both the traces and the heat fins within the traces, thereby decreasing production costs and increasing head suspension reliability. Heat fins may also be formed into the support layer in a region adjacent to the conductive layer heat fins, if desired in order to dissipate even more heat from the region.

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