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    • 15. 发明授权
    • Heat sink and memory module with heat sink
    • 散热器和带散热器的内存模块
    • US06424532B2
    • 2002-07-23
    • US09332325
    • 1999-06-14
    • Masashi Kawamura
    • Masashi Kawamura
    • H05K720
    • H01L23/367H01L25/105H01L2225/1005H01L2225/1029H01L2225/107H01L2225/1094H01L2924/0002H01L2924/3511H01L2924/00
    • A memory module 10 is fitted with a “cover and heat sink” 5 having a U-shape in cross section in such a manner that the memory module 10 is inserted into a U-shaped deep recess of the “cover and heat sink” 5, and all packaged memory ICs 3 and the other components 2 mounted on each face of a printed circuit board 1 are covered by the “cover and heat sink” 5, with a silicone grease 6 being filled between the “cover and heat sink” 5 and the packaged memory ICs 3. The heat generated in each packaged memory IC 3 is conducted to the “cover and heat sink” 5 through the silicone grease 6, and the heat is radiated from the surface of the “cover and heat sink” 5 having a large surface area. In addition, since all the components 2 and 3 mounted on the printed circuit board 1 are covered with the “cover and heat sink” 5, the components 2 and 3 mounted on the printed circuit board 1 are protected from a mechanical shock. Furthermore, it is possible to discriminate whether or not the degree of the warping of the printed circuit board 1 exceeds a permissible limit. Because, if the warping of the printed circuit board exceeds a certain limit, the memory module cannot be inserted into the U-shaped deep recess of the “cover and heat sink” 5.
    • 存储器模块10装配有具有U形横截面的“盖和散热器”5,使得存储器模块10插入“盖和散热器”5的U形深凹部 ,并且安装在印刷电路板1的每个面上的所有封装的存储器IC 3和其它部件2被“盖和散热器”5覆盖,硅胶6被填充在“盖和散热片”5之间 和封装的存储器IC 3.在每个封装的存储器IC 3中产生的热量通过硅树脂6传导到“盖和散热器”5,并且热量从“盖和散热器”5的表面辐射 具有较大的表面积。 此外,由于安装在印刷电路板1上的所有组件2和3被“盖和散热器”5覆盖,所以安装在印刷电路板1上的组件2和3被保护免受机械冲击。 此外,可以区分印刷电路板1的翘曲程度是否超过容许极限。 因为如果印刷电路板的翘曲超过一定限度,则内存模块不能插入“盖和散热片”的U形深凹槽5。