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11. 发明授权

US07078316B2 Substrate joining apparatus 失效
标题翻译：基板接合装置
公开(公告)号：US07078316B2
公开(公告)日：2006-07-18
申请号：US10875165
申请日：2004-06-25
申请人： Saburo Miyamoto , Yukitoshi Hase , Masaru Irie
发明人： Saburo Miyamoto , Yukitoshi Hase , Masaru Irie
IPC分类号： H01L21/30
CPC分类号： H01L21/67132 , H01L21/67092
摘要： A joining roller rolls on the surface of a reinforcing substrate held by a center and side latch claws so as to be close and opposite to an wafer placed and held on a holding table in the condition that an adhesive sheet is adhered on the surface, whereby joining proceeds. As the joining roller rolls, both of the latch claws oscillate downward and the latch claws themselves move down while keeping the bend of the reinforcing substrate nearly constant, and retract when the joining roller approaches the latch claws.
摘要翻译：接合辊在由粘合在表面上的粘合片的条件下，在由中央和侧面的锁定爪保持的加强基板的表面上滚动以与放置并保持在保持台上的晶片紧密相对，由此加入收益当接合辊滚动时，两个闩锁爪向下摆动，并且闩爪自身向下运动，同时保持加强基板的弯曲几乎恒定，并且当接合辊接近闩锁爪时缩回。

12. 发明授权

US08258490B2 Ultraviolet irradiation device 失效
标题翻译：紫外线照射装置
公开(公告)号：US08258490B2
公开(公告)日：2012-09-04
申请号：US12768645
申请日：2010-04-27
申请人： Masayuki Yamamoto , Masaru Irie
发明人： Masayuki Yamamoto , Masaru Irie
IPC分类号： G21G5/00
CPC分类号： H01L21/67132 , H01L21/67092 , H01L21/67253
摘要： Prior to applying of ultraviolet rays to a surface of a wafer with a protective tape joined thereto that is placed and held on a holding table, an illumination sensor moves to a position below an ultraviolet irradiation unit having ultraviolet light emitting diodes arranged in one dimensional array to measure ultraviolet intensity in a position corresponding to a surface of the protective tape, and output voltage of each diode is controlled so as to maintain a uniform accumulated quantity of light in an area of the protective tape where ultraviolet rays are applied that is determined from the result of measurement and a turning velocity of the holding table.
摘要翻译：在将放置并保持在保持台上的具有与其接合的保护带施加到晶片的表面之前，照射传感器移动到具有以一维阵列排列的紫外线发光二极管的紫外线照射单元下方的位置测定与保护带的表面相对应的位置的紫外线强度，控制各二极管的输出电压，使得在施加了紫外线的保护带的区域内保持均匀的积聚光，测量结果和保持台的转动速度。

13. 发明申请

US20080093025A1 Adhesive tape cutting method and apparatus using the same 失效
标题翻译：胶带切割方法及使用其的装置
公开(公告)号：US20080093025A1
公开(公告)日：2008-04-24
申请号：US11907429
申请日：2007-10-12
申请人： Masayuki Yamamoto , Masaru Irie
发明人： Masayuki Yamamoto , Masaru Irie
IPC分类号： B32B38/10 , B32B43/00
CPC分类号： B26F1/3846 , B26D7/26 , B26D7/2628 , H01L21/67132 , Y10T82/16032 , Y10T83/141 , Y10T83/145 , Y10T83/148 , Y10T83/162 , Y10T83/4667 , Y10T83/8691 , Y10T156/12 , Y10T156/1313 , Y10T156/1343 , Y10T156/1348 , Y10T156/1361 , Y10T156/1378 , Y10T156/1978
摘要： A strip-shaped supporting adhesive tape is joined to a ring frame, and then is stuck with a cutter blade such that the cutter blade penetrates the adhesive tape. In a state where a cutting edge of the cutter blade is brought into contact with a tape joined side of the ring frame, thereafter, the adhesive tape is cut along a contour of the ring frame while electric current is fed to each of the cutter blade and the ring frame. Herein, a sensor monitors a conduction status in real time.
摘要翻译：带状支撑胶带连接到环形框架上，然后用切割刀片粘合，使得切割刀片穿透粘合带。在切割刀片的切割刃与环形框架的带接合侧接触的状态下，然后沿着环形框架的轮廓切割胶带，同时向每个切割刀片供给电流和戒指框架。这里，传感器实时地监视导通状态。

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