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    • 11. 发明授权
    • Semiconductor device, and method for manufacturing semiconductor device
    • 半导体装置及半导体装置的制造方法
    • US08558301B2
    • 2013-10-15
    • US13208454
    • 2011-08-12
    • Masao ShinguAkira TakashimaKoichi Muraoka
    • Masao ShinguAkira TakashimaKoichi Muraoka
    • H01L29/76
    • H01L29/788H01L21/28273H01L21/28282H01L27/11521H01L27/11568H01L29/42324H01L29/4234H01L29/513H01L29/66825
    • There is provided a semiconductor device in which degradation of reliability originating in the interface between an upper insulating layer and an element isolation insulating layer is suppressed. The semiconductor device includes: a semiconductor region; a plurality of stacked structures each of which is disposed on the semiconductor region and has a tunnel insulating film, a charge storage layer, an upper insulating layer, and a control electrode stacked sequentially; an element isolation insulating layer disposed on side faces of the plurality of stacked structures; and a source-drain region disposed on the semiconductor region and among the plurality of stacked structures. The element isolation insulating layer includes at least one of SiO2, SiN, and SiON, the upper insulating layer is an oxide containing at least one metal M selected from the group consisting of a rare earth metal, Y, Zr, and Hf, and Si, and respective lengths Lcharge, Ltop, and Lgate of the charge storage layer, the upper insulating layer, and the control electrode in a channel length direction satisfy the relation “Lcharge
    • 提供一种半导体器件,其中抑制源于上绝缘层和元件隔离绝缘层之间的界面的可靠性的劣化。 半导体器件包括:半导体区域; 多个堆叠结构,其各自设置在所述半导体区域上,并且具有依次堆叠的隧道绝缘膜,电荷存储层,上绝缘层和控制电极; 设置在所述多个堆叠结构的侧面上的元件隔离绝缘层; 以及设置在半导体区域和多个堆叠结构中的源极 - 漏极区域。 元件隔离绝缘层包括SiO 2,SiN和SiON中的至少一种,上绝缘层是含有选自稀土金属,Y,Zr和Hf中的至少一种金属M的氧化物,Si ,并且沟道长度方向上的电荷存储层,上绝缘层和控制电极的各自的长度Lcharge,Ltop和Lgate满足关系“Lcharge
    • 13. 发明申请
    • SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
    • 半导体器件及制造半导体器件的方法
    • US20120025294A1
    • 2012-02-02
    • US13208454
    • 2011-08-12
    • Masao SHINGUAkira TakashimaKoichi Muraoka
    • Masao SHINGUAkira TakashimaKoichi Muraoka
    • H01L29/788H01L21/336
    • H01L29/788H01L21/28273H01L21/28282H01L27/11521H01L27/11568H01L29/42324H01L29/4234H01L29/513H01L29/66825
    • There is provided a semiconductor device in which degradation of reliability originating in the interface between an upper insulating layer and an element isolation insulating layer is suppressed. The semiconductor device includes: a semiconductor region; a plurality of stacked structures each of which is disposed on the semiconductor region and has a tunnel insulating film, a charge storage layer, an upper insulating layer, and a control electrode stacked sequentially; an element isolation insulating layer disposed on side faces of the plurality of stacked structures; and a source-drain region disposed on the semiconductor region and among the plurality of stacked structures. The element isolation insulating layer includes at least one of SiO2, SiN, and SiON, the upper insulating layer is an oxide containing at least one metal M selected from the group consisting of a rare earth metal, Y, Zr, and Hf, and Si, and respective lengths Lcharge, Ltop, and Lgate of the charge storage layer, the upper insulating layer, and the control electrode in a channel length direction satisfy the relation “Lcharge
    • 提供一种半导体器件,其中抑制源于上绝缘层和元件隔离绝缘层之间的界面的可靠性的劣化。 半导体器件包括:半导体区域; 多个堆叠结构,其各自设置在所述半导体区域上,并且具有依次堆叠的隧道绝缘膜,电荷存储层,上绝缘层和控制电极; 设置在所述多个堆叠结构的侧面上的元件隔离绝缘层; 以及设置在半导体区域和多个堆叠结构中的源极 - 漏极区域。 元件隔离绝缘层包括SiO 2,SiN和SiON中的至少一种,上绝缘层是含有选自稀土金属,Y,Zr和Hf中的至少一种金属M的氧化物,Si ,并且沟道长度方向上的电荷存储层,上绝缘层和控制电极的各自的长度Lcharge,Ltop和Lgate满足关系“Lcharge
    • 19. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
    • 非易失性半导体存储器件及其制造方法
    • US20080121979A1
    • 2008-05-29
    • US11846251
    • 2007-08-28
    • Yukie NISHIKAWAAkira TakashimaKoichi Muraoka
    • Yukie NISHIKAWAAkira TakashimaKoichi Muraoka
    • H01L29/788H01L21/336
    • H01L29/7881H01L27/115H01L27/11521H01L29/42336H01L29/513
    • A nonvolatile semiconductor memory device includes: a tunneling insulating film; a floating gate electrode; an inter-electrode insulating film, in which an interface facing the floating gate electrode and an interface facing a control gate electrode are defined as the first interface and the second interface, respectively; and a control gate electrode. The inter-electrode insulating film includes one or more first elements selected from rare earth elements, one or more second elements selected from Al, Ti, Zr, Hf, Ta, Mg, Ca, Sr and Ba, and oxygen. A composition ratio of the first element, which is defined as the number of atoms of the first element divided by that of the second element, is changed between the first interface and the second interface, and the composition ratio in the vicinity of the first interface is lower than that in the vicinity of the second interface.
    • 非易失性半导体存储器件包括:隧道绝缘膜; 浮栅电极; 分别将面对浮置栅极的界面和面对控制栅电极的界面分别定义为第一界面和第二界面的电极间绝缘膜; 和控制栅电极。 电极间绝缘膜包括选自稀土元素,选自Al,Ti,Zr,Hf,Ta,Mg,Ca,Sr和Ba中的一种或多种第二元素和氧的一种或多种第一元素。 被定义为第一元素的原子数除以第二元素的原子数的第一元素的组成比在第一界面和第二界面之间改变,并且第一界面附近的组成比 低于第二界面附近的位置。