会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件
    • US20070215929A1
    • 2007-09-20
    • US11680945
    • 2007-03-01
    • Naoki YASUDA
    • Naoki YASUDA
    • H01L29/76
    • H01L29/513H01L21/28273H01L21/28282H01L29/42324H01L29/4234H01L29/7881H01L29/792
    • A nonvolatile semiconductor memory device according to the embodiments of the invention includes a first insulating film on a channel, a floating gate electrode on the first insulating film, a second insulating film on the floating gate electrode, and a control gate electrode on the second insulating film. Each of the first and second insulating films comprises at least two layers, one layer directly in contact with the floating gate electrode is formed by an insulating material (A) including a metal element having a d-orbital, and the other at least one layer is formed by an insulating material (B) chiefly including one of a metal element without the d-orbital, and a semiconductor element.
    • 根据本发明实施例的非易失性半导体存储器件包括沟道上的第一绝缘膜,第一绝缘膜上的浮栅,浮栅上的第二绝缘膜,第二绝缘上的控制栅电极 电影。 第一和第二绝缘膜中的每一个包括至少两个层,与浮动栅电极直接接触的一个层由包括具有d轨道的金属元素的绝缘材料(A)形成,而另一个层 由主要包括没有d轨道的金属元素之一的绝缘材料(B)和半导体元件形成。
    • 12. 发明申请
    • NONVOLATILE SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 非易失性半导体存储器件及其制造方法
    • US20130087845A1
    • 2013-04-11
    • US13428185
    • 2012-03-23
    • Naoki YASUDA
    • Naoki YASUDA
    • H01L29/792H01L21/20
    • H01L27/11582H01L21/28282H01L29/7926
    • According to one embodiment, a method of manufacturing a nonvolatile semiconductor memory device is provided. In the method, a conductive film serving as a control gate is formed above a substrate. A hole extending through the conductive film from its upper surface to its lower surface is formed. A block insulating film, a charge storage layer, a tunnel insulating film, and a semiconductor layer are formed on the inner surface of the hole. A film containing a material having an oxygen dissociation catalytic action is formed on the semiconductor layer not to fill the hole. The interface between the tunnel insulating film and the semiconductor layer is oxidized through the film from the inside of the hole.
    • 根据一个实施例,提供一种制造非易失性半导体存储器件的方法。 在该方法中,在基板上形成用作控制栅极的导电膜。 形成从其上表面到其下表面延伸穿过导电膜的孔。 在孔的内表面上形成块绝缘膜,电荷存储层,隧道绝缘膜和半导体层。 在不填充孔的半导体层上形成含有具有氧解离催化作用的材料的膜。 隧道绝缘膜与半导体层之间的界面从孔的内部通过膜氧化。
    • 14. 发明申请
    • MEMORY CELL OF NONVOLATILE SEMICONDUCTOR MEMORY DEVICE
    • 非易失性半导体存储器件的存储单元
    • US20100072539A1
    • 2010-03-25
    • US12560035
    • 2009-09-15
    • Naoki YASUDA
    • Naoki YASUDA
    • H01L29/792
    • H01L21/28282H01L27/11568H01L29/513H01L29/517H01L29/518H01L29/792
    • A memory cell of a nonvolatile semiconductor memory device according to an embodiment of the invention has a MONOS structure. The charge storage layer of the memory cell includes insulating material layers. The relationship between the conduction band edge energy and valance band edge energy of the insulating material layers either increases gradually or decreases gradually from the tunnel insulating film toward the block insulating film. Furthermore, when the relative permittivity of the block insulating film is expresses as ∈r, an energy barrier between the charge storage layer and the block insulating film is equal to or larger than 4.5 ∈r−2/3 (eV) and is equal to or smaller than 3.8 (eV).
    • 根据本发明实施例的非易失性半导体存储器件的存储单元具有MONOS结构。 存储单元的电荷存储层包括绝缘材料层。 绝缘材料层的导带边缘能量与价带边缘能量之间的关系从隧道绝缘膜向块绝缘膜逐渐增加或逐渐减小。 此外,当块绝缘膜的相对介电常数表示为εr时,电荷存储层和块绝缘膜之间的能量势垒等于或大于4.5∈r-2/3(eV),并且等于 或小于3.8(eV)。