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11. 发明授权

US5720100A Assembly having a frame embedded in a polymeric encapsulant and method for forming same 失效
标题翻译：具有嵌入聚合物密封剂中的框架的组件及其形成方法
公开(公告)号：US5720100A
公开(公告)日：1998-02-24
申请号：US581695
申请日：1995-12-29
申请人： Andrew F. Skipor , Daniel Roman Gamota , Chao-Pin Yeh , Karl W. Wyatt , Wen Xu Zhou
发明人： Andrew F. Skipor , Daniel Roman Gamota , Chao-Pin Yeh , Karl W. Wyatt , Wen Xu Zhou
IPC分类号： H01L21/56 , H01L23/00 , H05K3/34
CPC分类号： H01L23/562 , H01L21/563 , H01L2224/05568 , H01L2224/05573 , H01L2224/056 , H01L2224/16 , H01L2224/73203 , H01L2924/01322 , Y10T29/49144
摘要： A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34) and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
摘要翻译：微电子组件（10）包括安装到印刷电路板（14）的集成电路管芯（12）。集成电路管芯（12）覆盖印刷电路板（14），并且包括面向印刷电路板（14）的有效面（26），并通过间隙（30）与其间隔开。多个焊料凸点互连（32）跨过间隙（30）延伸并且将多个板接合焊盘（22）与多个管芯接合焊盘（28）连接。聚合物前体（13）围绕集成电路管芯（12）分配到印刷电路板（14）上并且可固化以形成聚合密封剂（16）。聚合物前体（13）被拉入间隙（30）并形成覆盖印刷电路板（14）的圆角（34）。将框架（18）嵌入在圆角（34）中，并且加热聚合物前体（13）以固化聚合物前体（13）以形成聚合物密封剂（16）。框架（18）固定在聚合物密封剂（16）内的印刷电路板（14）上，以为微电子组件（10）提供增加的机械强度。

12. 发明授权

US06201192B1 Method and assembly for providing improved underchip encapsulation 有权
标题翻译：提供改进的底片封装的方法和装配
公开(公告)号：US06201192B1
公开(公告)日：2001-03-13
申请号：US09558825
申请日：2000-04-26
申请人： Steven Lewis Wille , Daniel Roman Gamota
发明人： Steven Lewis Wille , Daniel Roman Gamota
IPC分类号： H05K103
CPC分类号： H01L21/563 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83102 , H01L2224/92125 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/00 , H01L2924/3512
摘要： A microelectronic assembly (10) includes a printed circuit board (12) that includes a substrate (14) having a die attach region (22) and a plurality of first bond pads (24) disposed and spaced apart at the die attach region (22). A channel (26) effective in improving fluid flow extends across the die attach region (22) apart from the first bond pads (24). An integrated circuit die (16) is mounted onto the printed circuit board (12) and includes a major face (28) facing the substrate (14) and spaced apart therefrom by a gap (30) and second bond pads (25) disposed on the major face (28) in a pattern such that each of the second bond pads (25) registers with a first bond pad (24). Solder bump interconnections (18) connect the first bond pads (24) to the second bond pads (25). Encapsulant (20) is disposed within the gap (30) and flows over the substrate (14) and the channel (26) to encapsulate the solder bump interconnections (18). Channel 26 enhances the flow of the precursor (19) in the gap (30) prior to curing the precursor (19) to form the encapsulant (20).
摘要翻译：微电子组件（10）包括印刷电路板（12），其包括具有管芯附着区域（22）的衬底（14）和在管芯附着区域（22）处设置和间隔开的多个第一接合焊盘（24））。有效改善流体流动的通道（26）跨越第一接合焊盘（24）延伸穿过管芯附接区域（22）。集成电路管芯（16）安装在印刷电路板（12）上并且包括面向衬底（14）的主面（28），并通过间隙（30）与第二接合焊盘（25）间隔开，所述主面（28）具有使得每个第二接合焊盘（25）与第一接合焊盘（24）配准的图案。焊接凸块（18）将第一接合焊盘（24）连接到第二接合焊盘（25）。密封剂（20）设置在间隙（30）内并流过衬底（14）和通道（26）以封装焊料凸点互连（18）。通道26在固化前体（19）之前增强间隙（30）中的前体（19）的流动以形成密封剂（20）。

13. 发明授权

US6083819A Method and assembly for providing improved underchip encapsulation 失效
标题翻译：提供改进的底片封装的方法和装配
公开(公告)号：US6083819A
公开(公告)日：2000-07-04
申请号：US105749
申请日：1998-06-26
申请人： Steven Lewis Wille , Daniel Roman Gamota
发明人： Steven Lewis Wille , Daniel Roman Gamota
IPC分类号： H01L21/56 , H01L21/44
CPC分类号： H01L21/563 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83101 , H01L2224/83102 , H01L2224/92125 , H01L2924/01006 , H01L2924/01023 , H01L2924/01029 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/14
摘要： A microelectronic assembly (10) includes a printed circuit board (12) that includes a substrate (14) having a die attach region (22) and a plurality of first bond pads (24) disposed and spaced apart at the die attach region (22). A channel (26) effective in improving fluid flow extends across the die attach region (22) apart from the first bond pads (24). An integrated circuit die (16) is mounted onto the printed circuit board (12) and includes a major face (28) facing the substrate (14) and spaced apart therefrom by a gap (30) and second bond pads (25) disposed on the major face (28) in a pattern such that each of the second bond pads (25) registers with a first bond pad (24). Solder bump interconnections (18) connect the first bond pads (24) to the second bond pads (25). Encapsulant (20) is disposed within the gap (30) and flows over the substrate (14) and the channel (26) to encapsulate the solder bump interconnections (18). Channel 26 enhances the flow of the precursor (19) in the gap (30) prior to curing the precursor (19) to form the encapsulant (20).
摘要翻译：微电子组件（10）包括印刷电路板（12），其包括具有管芯附着区域（22）的衬底（14）和在管芯附着区域（22）处设置和间隔开的多个第一接合焊盘（24））。有效改善流体流动的通道（26）跨越第一接合焊盘（24）延伸穿过管芯附接区域（22）。集成电路管芯（16）安装在印刷电路板（12）上并且包括面向衬底（14）的主面（28），并通过间隙（30）与第二接合焊盘（25）间隔开，所述主面（28）具有使得每个第二接合焊盘（25）与第一接合焊盘（24）配准的图案。焊接凸块（18）将第一接合焊盘（24）连接到第二接合焊盘（25）。密封剂（20）设置在间隙（30）内并流过衬底（14）和通道（26）以封装焊料凸点互连（18）。通道26在固化前体（19）之前增强间隙（30）中的前体（19）的流动以形成密封剂（20）。

14. 发明授权

US5821456A Microelectronic assembly including a decomposable encapsulant, and method for forming and reworking same 失效
公开(公告)号：US5821456A
公开(公告)日：1998-10-13
申请号：US641394
申请日：1996-05-01
申请人： Steven Lewis Wille , Daniel Roman Gamota , Colleen Mary Walsh
发明人： Steven Lewis Wille , Daniel Roman Gamota , Colleen Mary Walsh
IPC分类号： H01L21/56 , H05K3/28 , H01L23/28
CPC分类号： H01L21/563 , H01L24/28 , H05K3/284 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83102 , H01L2224/92125 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/14
摘要： A microelectronic assembly (10) includes an integrated circuit component (14) spaced apart from a substrate (12) by a gap filled with a polymeric encapsulant (18). The polymeric encapsulant (18) contains a thermally decomposable azide group. In the event that it is necessary to remove the component (14), such as if the component (14) is found to be defective, the microelectronic assembly (10) is heated to a temperature above the decomposition temperature of the azide group. Decomposition of the azide group disintegrates the encapsulant (18) and preferably detaches the component from the substrate (12), thereby permitting replacement of the component (14).

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