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11. 发明申请

US20070075236A1 Packaging method of a light-sensing semiconductor device and packaging structure thereof 审中-公开
标题翻译：光敏半导体器件的封装方法及其封装结构
公开(公告)号：US20070075236A1
公开(公告)日：2007-04-05
申请号：US11239028
申请日：2005-09-30
申请人： Po-Hung Chen , Mao-Jung Chen
发明人： Po-Hung Chen , Mao-Jung Chen
IPC分类号： H01J5/02 , H01J40/14
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.
摘要翻译：本发明公开了一种感光半导体器件及其封装结构的封装方法，其中在具有多个光感测芯片的感光晶片上形成间隔壁矩阵，并将该粘合剂直接施加到在非感光区域上的两个相邻间隔壁之间。因此，当安装光透明盖时，没有更多的粘合剂落在感光片的感光区上。此外，当将光透明盖按压以与间隔壁接合时，其中沟槽形成在间隔壁的顶部处，粘合剂将不会从接缝处溢出进入感光区域。

12. 发明申请

US20070057169A1 Package structure for an optical sensor 审中-公开
标题翻译：光学传感器的封装结构
公开(公告)号：US20070057169A1
公开(公告)日：2007-03-15
申请号：US11225076
申请日：2005-09-14
申请人： Chung-Chi Hsiao , Po-Hung Chen , Mao-Jung Chen
发明人： Chung-Chi Hsiao , Po-Hung Chen , Mao-Jung Chen
IPC分类号： H01J40/14
CPC分类号： H01L27/14618 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： The present invention relates to a package structure for an optical sensor having a base set with the plurality of metallization traces on its upper and under surface and several conductors passing through the base electrically connects to the plurality of metallization traces on the surface; at least one optical sensor and its peripheral frame are set upon the base in which the conductors can be located within the frame area or the area between the optical sensor and the frame; and a light-pervious lid encapsulates the frame and completes the package structure. In addition, an enclosing base having a containing capacity can be adopted to replace the base and the frame. The present invention can efficiently raise the reliability of elements and yield and quality by said package structure.
摘要翻译：本发明涉及一种用于光学传感器的封装结构，其具有在其上表面和下表面上具有多个金属化迹线的基座，并且穿过基座的多个导体电连接到表面上的多个金属化迹线; 至少一个光学传感器及其外围框架设置在基座上，导体可以位于框架区域内或光学传感器与框架之间的区域内; 并且透光的盖子封装框架并完成封装结构。此外，可以采用具有容纳能力的封闭基座来代替基座和框架。本发明可以通过所述包装结构有效提高元件的可靠性和产量和质量。

13. 发明授权

US5347918A Vacuum thermal cooker 失效
标题翻译：真空热煲
公开(公告)号：US5347918A
公开(公告)日：1994-09-20
申请号：US223718
申请日：1994-04-06
申请人： Po-Hung Chen
发明人： Po-Hung Chen
IPC分类号： A47J27/00 , A47J27/08 , A47J36/06 , B65D81/20 , B65B31/04 , B65D51/16
CPC分类号： A47J36/06 , A47J27/002 , A47J27/08 , B65D81/2038 , Y10S220/912
摘要： A vacuum thermal cooker comprising an outer cooler, an inner cooker, a sealing lid unit and an insulating disc, the inner cooker being used for boiling food and then to be placed in the outer cooker sealed by the sealing lid unit and then the air in the outer cooker being sucked out by a separate simple sucking pump operated by hand, the interior of the outer cooker becoming vacuum so that the heat of the food and the inner cooker may be kept for a long period of time, not easily cooled off by function of the vacuum condition of the outer cooker.
摘要翻译：一种真空热炊具，包括外部冷却器，内部炊具，密封盖单元和绝缘盘，所述内部炊具用于沸腾食物，然后被放置在由密封盖单元密封的外部炊具中，然后将空气外部炊具被单独操作的简单的吸入泵吸出，外部炊具的内部变得真空，使得食物和炊具的热量可以长时间保持，不容易被冷却外锅的真空条件功能。

14. 发明授权

US08489814B2 Cache controller, method for controlling the cache controller, and computing system comprising the same 有权
标题翻译：缓存控制器，用于控制高速缓存控制器的方法以及包括其的计算系统
公开(公告)号：US08489814B2
公开(公告)日：2013-07-16
申请号：US12489795
申请日：2009-06-23
申请人： Po-Hung Chen , Chang-Hsien Tai
发明人： Po-Hung Chen , Chang-Hsien Tai
IPC分类号： G06F12/00 , G06F13/00
CPC分类号： G06F12/126 , G06F12/0802 , G06F12/0848
摘要： A cache controller, a method for controlling the cache controller, and a computing system comprising the same are provided. The computer system comprises a processor and a cache controller. The cache controller is electrically connected to the processor and comprises a first port, a second port, and at least one cache. The first port is configured to receive an address of a content, wherein a type of the content is one of instruction and data. The second port is configured to receive an information bit corresponding to the content, wherein the information bit indicates the type of the content. The at least one cache comprises at least one cache lines. Each of the cache lines comprises a content field and corresponding to an information field. The content and the information bit is stored in the content field of one of the cache lines and the corresponding information field respectively according to the information bit and the address. Thereby, instruction and data are separated in a unified cache.
摘要翻译：提供了缓存控制器，用于控制高速缓存控制器的方法，以及包括该控制器的计算系统。计算机系统包括处理器和高速缓存控制器。高速缓存控制器电连接到处理器，并且包括第一端口，第二端口和至少一个高速缓存。第一端口被配置为接收内容的地址，其中内容的类型是指令和数据之一。第二端口被配置为接收对应于内容的信息位，其中信息位指示内容的类型。至少一个高速缓存包括至少一个高速缓存行。每个高速缓存行包括与信息字段对应的内容字段。内容和信息位分别根据信息位和地址存储在高速缓存线之一的内容字段和对应的信息字段中。因此，指令和数据在统一缓存中分离。

15. 发明授权

US07843747B2 System and method for better testability of OTP memory 有权
标题翻译： OTP内存的更好的可测试性的系统和方法
公开(公告)号：US07843747B2
公开(公告)日：2010-11-30
申请号：US12124989
申请日：2008-05-21
申请人： Fu-Lung Hsueh , Shine Chung , Wen-Kuan Fang , Po-Hung Chen
发明人： Fu-Lung Hsueh , Shine Chung , Wen-Kuan Fang , Po-Hung Chen
IPC分类号： G11C29/00
CPC分类号： G11C29/08 , G11C2216/26
摘要： A system for testing logic circuits for executing writing and reading operations in a one-time programmable (OTP) memory having an array of memory cells is disclosed, the system comprising a column of testing cells having the same number of cells as that of an entire column of the array of memory cells, a row of testing cells having the same number of cells as that of an entire row of the array of memory cells, wherein both the column and row of testing cells are first written to and then read out from during a testing operation, and can never be accessed during non-testing operations of the OTP memory.
摘要翻译：公开了一种用于测试在具有存储器单元阵列的一次可编程（OTP）存储器中执行写入和读取操作的逻辑电路的系统，该系统包括具有与整个存储器单元相同数量的单元格的测试单元列存储单元阵列的列，一行具有与存储器单元阵列的整行相同数量的单元的测试单元，其中测试单元的列和行首先被写入然后从在测试操作期间，并且在OTP存储器的非测试操作期间永远不能被访问。

16. 发明授权

US07733096B2 Methods of testing fuse elements for memory devices 失效
标题翻译：测试存储器件熔丝元件的方法
公开(公告)号：US07733096B2
公开(公告)日：2010-06-08
申请号：US11731960
申请日：2007-04-02
申请人： Sung-Chieh Lin , Po-Hung Chen
发明人： Sung-Chieh Lin , Po-Hung Chen
IPC分类号： G01R31/02
CPC分类号： G11C29/02 , G11C17/165 , G11C29/027
摘要： A method of testing a fuse element for a memory device is provided. A first test probe is electrically connected to a program terminal of the memory device. A second test probe is electrically connected to a ground terminal. The fuse element is on an electrical circuit path between the program terminal and the ground terminal. The first and second test probes are electrically connected to a testing device. A first voltage is applied with the testing device between the program terminal and the ground terminal. At least part of a first current of the first voltage flows across the fuse element. The first voltage and the at least part of the first current that flows across the fuse element is not large enough to change the conductivity state of the fuse element. The first current is measured and used to evaluated the conductive state of the fuse element.
摘要翻译：提供一种测试用于存储器件的熔丝元件的方法。第一测试探针电连接到存储器件的程序终端。第二测试探针电连接到接地端子。保险丝元件位于程序端子和接地端子之间的电路上。第一和第二测试探针电连接到测试装置。测试设备在程序终端和接地端子之间施加第一个电压。第一电压的第一电流的至少一部分流过熔丝元件。在熔断元件上流动的第一电流和第一电流的至少一部分不足以改变熔丝元件的导电状态。测量第一电流并用于评估熔丝元件的导电状态。

17. 发明授权

US07459629B2 Extension box of storage media 有权
标题翻译：扩展箱的存储介质
公开(公告)号：US07459629B2
公开(公告)日：2008-12-02
申请号：US11298539
申请日：2005-12-12
申请人： Po-Hung Chen
发明人： Po-Hung Chen
IPC分类号： H02G3/08
CPC分类号： G11B33/122 , G11B33/025 , G11B33/124 , G11B33/1426
摘要： The invention discloses an extension box of storage media, which mainly utilized a plurality of heat dissipation fins protruding from a bottom surface of a bottom shell of the extension box. The heat dissipation fins efficaciously dissipate heat from the storage media, so it improves the dissipation heat efficiency and reduces breakdown for the storage media. The extension box of storage media of the present invention is electrically connected with an external electronic apparatus by a universal series bus (USB) or an IEEE 1394 interface connector for transmitting a data.
摘要翻译：本发明公开了一种存储介质的扩展箱，主要利用从扩展箱的底壳的底面突出的多个散热片。散热片有效地从存储介质中散热，从而提高散热效率，减少存储介质的故障。本发明的存储介质的扩展盒通过通用串行总线（USB）或IEEE 1394接口连接器与外部电子设备电连接，用于发送数据。

18. 发明申请

US20080188031A1 Packaging method of a light-sensing semiconductor device and packaging structure thereof 失效
标题翻译：光敏半导体器件的封装方法及其封装结构
公开(公告)号：US20080188031A1
公开(公告)日：2008-08-07
申请号：US12078819
申请日：2008-04-07
申请人： Po-Hung Chen , Mao-Jung Chen
发明人： Po-Hung Chen , Mao-Jung Chen
IPC分类号： H01L31/0216
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly applied to between two neighboring spacer walls on the non-light-sensing regions. Thus, when the light transparent cover is installed, there is no more adhesive dropping onto the light-sensing regions of the light-sensing chips. Further, when the light transparent cover is pressed to join with the spacer walls, with the trenches formed at the tops of the spacer walls, the adhesive will not overflow from the joint seams into the light-sensing regions.
摘要翻译：本发明公开了一种感光半导体器件及其封装结构的封装方法，其中在具有多个光感测芯片的感光晶片上形成间隔壁矩阵，并将该粘合剂直接施加到在非感光区域上的两个相邻间隔壁之间。因此，当安装光透明盖时，没有更多的粘合剂落在感光片的感光区上。此外，当将光透明盖按压以与间隔壁接合时，其中沟槽形成在间隔壁的顶部处，粘合剂将不会从接缝处溢出进入感光区域。

19. 发明授权

US07358482B2 Packaging structure of a light-sensing element and fabrication method thereof 失效
标题翻译：光敏元件的包装结构及其制造方法
公开(公告)号：US07358482B2
公开(公告)日：2008-04-15
申请号：US11231842
申请日：2005-09-22
申请人： Po-Hung Chen
发明人： Po-Hung Chen
IPC分类号： H01L27/14
CPC分类号： H01L27/14618 , H01L31/0203 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The present invention discloses a packaging structure of a light-sensing element and a fabrication method thereof, wherein the light-sensing chip is installed on the substrate, and then a cleaning step is undertaken; next, a light transparent cover with a cavity is installed to the substrate with a glue material in order to envelop the light-sensing chip. Thereby, the present invention not only can clean pollutants completely and promote the yield, but also can reduce the packaging area. In the present invention, the engagement portions may also be formed on the substrate and the light transparent cover so that the alignment can be undertaken easily.
摘要翻译：本发明公开了一种感光元件的封装结构及其制造方法，其中，将感光芯片安装在基板上，然后进行清洁工序; 接下来，使用胶合材料将具有空腔的透明透明盖安装到基板上，以便包围感光芯片。因此，本发明不仅可以完全清洁污染物并提高产量，还可以减少包装面积。在本发明中，也可以在基板和透光盖上形成接合部，使得可以容易地进行对准。

20. 发明授权

US07297918B1 Image sensor package structure and image sensing module 失效
标题翻译：图像传感器封装结构和图像传感模块
公开(公告)号：US07297918B1
公开(公告)日：2007-11-20
申请号：US11464564
申请日：2006-08-15
申请人： Po-Hung Chen , Mao-Jung Chen , Chung-Chi Hsiao
发明人： Po-Hung Chen , Mao-Jung Chen , Chung-Chi Hsiao
IPC分类号： H01J40/14 , G02B7/02
CPC分类号： H01L27/14625 , H01L27/14618 , H01L31/0203 , H01L31/02325 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/16195 , H04N5/2252 , H04N5/2253 , H04N5/2257 , H01L2924/00014
摘要： An image sensor package structure and an image sensing module are proposed. A substrate, a frame and a light transparent layer are used to package an image sensing chip to form the image sensor package structure. The frame is mounted on the substrate and located around the image sensing chip. The top of the frame extends toward the image sensing chip and upwards to form a locking and placing portion with an L-shaped cross section. Bend positions of the locking and placing portion form a placement space formed to accommodate and position the light transparent layer. The structure is simple, the fabrication is easy, and the gluing and packaging operations can be facilitated. Moreover, when the image sensor package structure and a lens set are assembled into an image sensing module, a lens base with a smaller size can be used to shrink the package area.
摘要翻译：提出了一种图像传感器封装结构和图像感测模块。使用基板，框架和透光层来封装图像感测芯片以形成图像传感器封装结构。框架安装在基板上并位于图像感测芯片周围。框架的顶部朝向图像感测芯片向上延伸以形成具有L形横截面的锁定和放置部分。锁定和放置部分的弯曲位置形成为容纳和定位透光层而形成的放置空间。该结构简单，制造容易，并且可以促进胶合和包装操作。此外，当图像传感器封装结构和透镜组组装成图像感测模块时，可以使用具有较小尺寸的透镜基座来缩小封装区域。

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