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11. 发明申请

US20110278601A1 LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译：发光二极管封装
公开(公告)号：US20110278601A1
公开(公告)日：2011-11-17
申请号：US12979368
申请日：2010-12-28
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
IPC分类号： H01L33/48
CPC分类号： H01L33/486 , H01L25/167 , H01L33/507 , H01L33/508 , H01L33/62 , H01L2924/0002 , H01L2924/00
摘要： An LED package includes a silicon base, an LED and a glass encapsulant. The silicon base has a first surface and a second surface opposite to the first surface. The LED chip is located on the first surface of the silicon base. The glass encapsulant covers the LED chip. The glass encapsulant and the silicon base define a receiving space therebetween to receive the LED chip. The glass encapsulant is fixedly engaged with the first surface of the silicon base, so the glass encapsulant and the silicon base enclose the LED chip.
摘要翻译： LED封装包括硅基，LED和玻璃密封剂。硅基部具有与第一表面相对的第一表面和第二表面。 LED芯片位于硅基底的第一表面上。玻璃密封剂覆盖LED芯片。玻璃密封剂和硅基底在其间限定了接收LED芯片的接收空间。玻璃密封剂与硅基体的第一表面固定接合，因此玻璃密封剂和硅基底包围LED芯片。

12. 发明申请

US20110181182A1 TOP VIEW LIGHT EMITTING DEVICE PACKAGE AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：顶视图发光器件封装及其制造方法
公开(公告)号：US20110181182A1
公开(公告)日：2011-07-28
申请号：US12915072
申请日：2010-10-29
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
IPC分类号： H01J7/44 , H01J9/00
CPC分类号： H01L25/167 , H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A top view light emitting device package and fabrication method thereof include a bilateral circuit is provided for emitting two far light fields with no requirement for multiple devices. Moreover, the top view light emitting device package of the disclosure also provides depressions and reflectors formed on the surfaces of the silicon substrate to enhance the reflective efficiency and fix a specific light field.
摘要翻译：顶视图发光器件封装及其制造方法包括：双向电路，用于发射两个远光场，不需要多个器件。此外，本公开的顶视图发光器件封装还提供形成在硅衬底的表面上的凹陷和反射器，以增强反射效率并固定特定的光场。

13. 发明申请

US20110291135A1 LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译：发光二极管封装
公开(公告)号：US20110291135A1
公开(公告)日：2011-12-01
申请号：US13038385
申请日：2011-03-02
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
IPC分类号： H01L33/58
CPC分类号： H01L33/641 , H01L33/486 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/00011 , H01L2924/01322 , H01L2924/181 , H01L2924/00014 , H01L2924/00 , H01L2924/01004 , H01L2924/00012
摘要： A light emitting diode package includes a silicon substrate having a first surface and a second surface opposite to the first surface, wherein the first surface includes a cavity, a light emitting diode chip fixed on a bottom of the cavity, and a glass lens secured to the silicon substrate and covering the light emitting diode chip.
摘要翻译：发光二极管封装包括具有第一表面和与第一表面相对的第二表面的硅衬底，其中第一表面包括空腔，固定在空腔底部的发光二极管芯片和固定到硅衬底并覆盖发光二极管芯片。

14. 发明申请

US20110206079A1 SIDE EMITTING SEMICONDUCTOR PACKAGE 有权
标题翻译：侧面发射半导体封装
公开(公告)号：US20110206079A1
公开(公告)日：2011-08-25
申请号：US12900676
申请日：2010-10-08
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
IPC分类号： H01S5/02 , H01L33/48
CPC分类号： H01L25/0756 , H01L25/167 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01S5/4025 , H01L2924/00012 , H01L2924/00014
摘要： A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.
摘要翻译：侧面发射半导体封装包括形成在封装的硅衬底上的双面电路和接合在电路的两个双面上的多个半导体发光器件，以提供具有两个发光侧的表面安装器件。

15. 发明申请

US20130244355A1 METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20130244355A1
公开(公告)日：2013-09-19
申请号：US13653634
申请日：2012-10-17
申请人： LUNG-HSIN CHEN , WEN-LIANG TSENG
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG
IPC分类号： H01L33/58
CPC分类号： H01L33/486 , H01L33/501 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer.
摘要翻译：制造LED封装的示例性方法包括以下步骤：提供衬底; 在所述基板上形成反射器，其中所述接收室限定在所述反射器中; 提供LED芯片并将LED芯片安装在基板上，其中LED芯片被容纳在接收室中; 提供凝胶状荧光体层，并将凝胶状磷光体层设置在反射器的顶端，其中，凝胶状磷光体层覆盖接收室，荧光体粉末均匀地分布在凝胶磷光体层中; 提供加压模具并将压模布置在凝胶磷光体层的顶端上; 将压模压向凝胶状磷光体层，使凝胶状磷光体层填充在接收室中; 凝胶化荧光体层。

16. 发明申请

US20130217160A1 METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM 有权
标题翻译：用于制造磷光体膜的方法和制造具有磷光体膜的LED封装的方法
公开(公告)号：US20130217160A1
公开(公告)日：2013-08-22
申请号：US13600128
申请日：2012-08-30
申请人： LUNG-HSIN CHEN , WEN-LIANG TSENG , PIN-CHUAN CHEN
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG , PIN-CHUAN CHEN
IPC分类号： H01L33/50 , B44C1/22 , B29C45/02
CPC分类号： C09K11/02 , C09K11/08 , H01L33/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.
摘要翻译：一种制造用于LED封装的荧光膜的方法，包括以下步骤：提供包括第一和第二成型部件的模具，第一模制部件和第二模制部件协同地形成模制室，第一模制部件限定与所述模制室连通的开口; 将荧光体颗粒和透明胶的混合物填充到第一开口中; 沿着从第一成型部到第二成型部的方向在第一开口中移动活塞，从而将混合物压入成型室; 使混合物固化形成荧光膜; 并从模具中去除荧光膜。荧光体膜用于与安装有LED芯片的基板相对的LED芯片的顶面附着。

17. 发明申请

US20140049955A1 LED ILLUMINATION DEVICE 审中-公开
标题翻译： LED照明装置
公开(公告)号：US20140049955A1
公开(公告)日：2014-02-20
申请号：US13663492
申请日：2012-10-30
申请人： LUNG-HSIN CHEN , WEN-LIANG TSENG
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG
IPC分类号： F21V21/00 , F21V9/16
CPC分类号： H01L25/0753 , F21K9/00 , F21Y2103/10 , F21Y2115/10 , H01L33/504 , H01L33/507 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H05K1/0274 , H05K2201/0108 , H05K2201/10106 , H01L2924/00014
摘要： An exemplary LED illumination device includes a lighting member and a supporting member. The lighting member includes a base plate allowing light passing therethrough and LEDs mounted on a top surface of the base plate. The supporting member includes a bottom wall allowing light passing therethrough and side walls extending upwardly from edges of the bottom wall. The side walls and the bottom plate cooperatively define a receiving chamber therebetween to receive the base plate therein. Light generated by the LEDs radiates upwardly, downwardly and laterally from the LED illumination device.
摘要翻译：示例性的LED照明装置包括照明部件和支撑部件。照明构件包括允许穿过其中的光的基板和安装在基板的顶表面上的LED。支撑构件包括允许光穿过的底壁和从底壁的边缘向上延伸的侧壁。侧壁和底板协同地在其间限定接收室，以在其中容纳基板。由LED产生的光从LED照明装置向上，向下和向外辐射。

18. 发明申请

US20120305960A1 LED PACKAGE AND METHOD FOR MAKING THE SAME 有权
标题翻译： LED封装及其制造方法
公开(公告)号：US20120305960A1
公开(公告)日：2012-12-06
申请号：US13337125
申请日：2011-12-25
申请人： CHIA-CHIANG YANG , WEN-LIANG TSENG
发明人： CHIA-CHIANG YANG , WEN-LIANG TSENG
IPC分类号： H01L33/60 , H01L33/62
CPC分类号： H01L33/486 , C08G77/58 , C09D183/14 , H01L33/52 , H01L33/62 , H01L2224/48227
摘要： An LED package includes a substrate, an electrode structure, an LED die, a packaging portion, and a covering portion. The electrode structure is formed on the substrate. The LED die is mounted on the substrate, and electrically connected to the electrode structure. The packaging portion covers the LED die. The covering portion surrounds a periphery of the LED package and seals a joint between the substrate, the electrode structure and the packaging portion. The covering portion is made of silicone-titanate resin with reactive monomers, wherein the reactive monomers comprises more than 60% of heptane, 7.0% to 13.0% of allytrimethoxysilane, 5.0% to 10.0% of tetrabutyl titanate, and less than 0.1% of tetramethoxysilane.
摘要翻译： LED封装包括基板，电极结构，LED管芯，封装部分和覆盖部分。电极结构形成在基板上。 LED芯片安装在基板上，并与电极结构电连接。封装部分覆盖LED管芯。覆盖部分围绕LED封装的周边并密封基板，电极结构和封装部分之间的接合部。覆盖部分由具有反应性单体的硅酸钛树脂制成，其中反应性单体包含超过60％的庚烷，7.0％至13.0％的烯丙基三甲氧基硅烷，5.0％至10.0％的四丁基钛酸酯和小于0.1％的四甲氧基硅烷。

19. 发明申请

US20120214264A1 MANUFACTURING METHOD FOR LED PACKAGE 失效
标题翻译： LED封装制造方法
公开(公告)号：US20120214264A1
公开(公告)日：2012-08-23
申请号：US13290144
申请日：2011-11-07
申请人： HSIN-CHIANG LIN , WEN-LIANG TSENG , CHIEH-LING CHANG
发明人： HSIN-CHIANG LIN , WEN-LIANG TSENG , CHIEH-LING CHANG
IPC分类号： H01L33/50
CPC分类号： H01L33/504 , H01L2224/48091 , H01L2224/8592 , H01L2933/0041 , H01L2924/00014
摘要： The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.
摘要翻译：本公开提供了一种用于LED封装的制造方法。包含一个第一发光转换元件的第一发光转换层位于LED芯片上，其中第一发光转换元件通过围绕LED芯片离心沉淀而不遮挡LED芯片。此后，第二发光转换层位于第一发光转换层上。第二发光层具有比第一发光转换元件低的激发效率的第二发光转换元件。

20. 发明申请

US20130107511A1 LED ILLUMINATION MODULE 审中-公开
标题翻译： LED照明模块
公开(公告)号：US20130107511A1
公开(公告)日：2013-05-02
申请号：US13492926
申请日：2012-06-11
申请人： CHIA-CHIANG YANG , WEN-LIANG TSENG
发明人： CHIA-CHIANG YANG , WEN-LIANG TSENG
IPC分类号： F21V13/08 , F21V9/00
CPC分类号： F21V7/048 , F21S2/005 , F21Y2105/10 , F21Y2113/00 , F21Y2115/10
摘要： An LED illumination module includes a base, first white-light LEDs mounted on a central portion of a top surface of the base, and second white-light LEDs mounted on a periphery of the top surface of the base and surrounding the first white-light LEDs. A power of the first white-light LEDs is equal to that of the second white-light LEDs. An average value of luminescence efficiencies of the first white-light LEDs is smaller than that of the second white-light LEDs. An average value of color rendering indexes of the first white-light LEDs is larger than that of the second white-light LEDs.
摘要翻译： LED照明模块包括基座，安装在基座顶面的中心部分上的第一白光LED以及安装在基座顶表面周围并围绕第一白光的第二白光LED LED。第一白光LED的功率等于第二白光LED的功率。第一白光LED的发光效率的平均值小于第二白光LED的发光效率的平均值。第一白光LED的显色指数的平均值大于第二白光LED的显色指数的平均值。

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