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11. 发明申请

US20110206079A1 SIDE EMITTING SEMICONDUCTOR PACKAGE 有权
标题翻译：侧面发射半导体封装
公开(公告)号：US20110206079A1
公开(公告)日：2011-08-25
申请号：US12900676
申请日：2010-10-08
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
IPC分类号： H01S5/02 , H01L33/48
CPC分类号： H01L25/0756 , H01L25/167 , H01L33/50 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01S5/4025 , H01L2924/00012 , H01L2924/00014
摘要： A side emitting semiconductor package includes a two-sided electric circuit formed on a silicon substrate of the package, and a plurality of semiconductor light emitting devices bonded on two bilateral surfaces of the electric circuit to provide a surface mounted device with two light emitting sides.
摘要翻译：侧面发射半导体封装包括形成在封装的硅衬底上的双面电路和接合在电路的两个双面上的多个半导体发光器件，以提供具有两个发光侧的表面安装器件。

12. 发明申请

US20110181182A1 TOP VIEW LIGHT EMITTING DEVICE PACKAGE AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：顶视图发光器件封装及其制造方法
公开(公告)号：US20110181182A1
公开(公告)日：2011-07-28
申请号：US12915072
申请日：2010-10-29
申请人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人： MIN-TSUN HSIEH , WEN-LIANG TSENG , LUNG-HSIN CHEN , CHIH-YUNG LIN
IPC分类号： H01J7/44 , H01J9/00
CPC分类号： H01L25/167 , H01L25/0753 , H01L33/486 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： A top view light emitting device package and fabrication method thereof include a bilateral circuit is provided for emitting two far light fields with no requirement for multiple devices. Moreover, the top view light emitting device package of the disclosure also provides depressions and reflectors formed on the surfaces of the silicon substrate to enhance the reflective efficiency and fix a specific light field.
摘要翻译：顶视图发光器件封装及其制造方法包括：双向电路，用于发射两个远光场，不需要多个器件。此外，本公开的顶视图发光器件封装还提供形成在硅衬底的表面上的凹陷和反射器，以增强反射效率并固定特定的光场。

13. 发明申请

US20130244355A1 METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20130244355A1
公开(公告)日：2013-09-19
申请号：US13653634
申请日：2012-10-17
申请人： LUNG-HSIN CHEN , WEN-LIANG TSENG
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG
IPC分类号： H01L33/58
CPC分类号： H01L33/486 , H01L33/501 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： An exemplary method for manufacturing an LED package includes following steps: providing a substrate; forming a reflector on the substrate with a receiving chamber defined in the reflector; providing an LED chip and mounting the LED chip on the substrate wherein the LED chip is received in the receiving chamber; providing a gelatinous phosphor layer and arranging the gelatinous phosphor layer on a top end of the reflector wherein the gelatinous phosphor layer covers the receiving chamber and phosphor powder is evenly distributed in the gelatinous phosphor layer; providing a pressing mold and arranging the pressing mold on a top end of the gelatinous phosphor layer; pressing the pressing mold toward the gelatinous phosphor layer to make the gelatinous phosphor layer fill in the receiving chamber; solidifying the gelatinous phosphor layer.
摘要翻译：制造LED封装的示例性方法包括以下步骤：提供衬底; 在所述基板上形成反射器，其中所述接收室限定在所述反射器中; 提供LED芯片并将LED芯片安装在基板上，其中LED芯片被容纳在接收室中; 提供凝胶状荧光体层，并将凝胶状磷光体层设置在反射器的顶端，其中，凝胶状磷光体层覆盖接收室，荧光体粉末均匀地分布在凝胶磷光体层中; 提供加压模具并将压模布置在凝胶磷光体层的顶端上; 将压模压向凝胶状磷光体层，使凝胶状磷光体层填充在接收室中; 凝胶化荧光体层。

14. 发明申请

US20130217160A1 METHOD FOR MANUFACTURING PHOSPHOR FILM AND METHOD FOR MAKING LED PACKAGE HAVING THE PHOSPHOR FILM 有权
标题翻译：用于制造磷光体膜的方法和制造具有磷光体膜的LED封装的方法
公开(公告)号：US20130217160A1
公开(公告)日：2013-08-22
申请号：US13600128
申请日：2012-08-30
申请人： LUNG-HSIN CHEN , WEN-LIANG TSENG , PIN-CHUAN CHEN
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG , PIN-CHUAN CHEN
IPC分类号： H01L33/50 , B44C1/22 , B29C45/02
CPC分类号： C09K11/02 , C09K11/08 , H01L33/50 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/92247 , H01L2933/0041 , H01L2924/00014 , H01L2924/00
摘要： A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.
摘要翻译：一种制造用于LED封装的荧光膜的方法，包括以下步骤：提供包括第一和第二成型部件的模具，第一模制部件和第二模制部件协同地形成模制室，第一模制部件限定与所述模制室连通的开口; 将荧光体颗粒和透明胶的混合物填充到第一开口中; 沿着从第一成型部到第二成型部的方向在第一开口中移动活塞，从而将混合物压入成型室; 使混合物固化形成荧光膜; 并从模具中去除荧光膜。荧光体膜用于与安装有LED芯片的基板相对的LED芯片的顶面附着。

15. 发明申请

US20140049955A1 LED ILLUMINATION DEVICE 审中-公开
标题翻译： LED照明装置
公开(公告)号：US20140049955A1
公开(公告)日：2014-02-20
申请号：US13663492
申请日：2012-10-30
申请人： LUNG-HSIN CHEN , WEN-LIANG TSENG
发明人： LUNG-HSIN CHEN , WEN-LIANG TSENG
IPC分类号： F21V21/00 , F21V9/16
CPC分类号： H01L25/0753 , F21K9/00 , F21Y2103/10 , F21Y2115/10 , H01L33/504 , H01L33/507 , H01L33/62 , H01L2224/48091 , H01L2224/48137 , H05K1/0274 , H05K2201/0108 , H05K2201/10106 , H01L2924/00014
摘要： An exemplary LED illumination device includes a lighting member and a supporting member. The lighting member includes a base plate allowing light passing therethrough and LEDs mounted on a top surface of the base plate. The supporting member includes a bottom wall allowing light passing therethrough and side walls extending upwardly from edges of the bottom wall. The side walls and the bottom plate cooperatively define a receiving chamber therebetween to receive the base plate therein. Light generated by the LEDs radiates upwardly, downwardly and laterally from the LED illumination device.
摘要翻译：示例性的LED照明装置包括照明部件和支撑部件。照明构件包括允许穿过其中的光的基板和安装在基板的顶表面上的LED。支撑构件包括允许光穿过的底壁和从底壁的边缘向上延伸的侧壁。侧壁和底板协同地在其间限定接收室，以在其中容纳基板。由LED产生的光从LED照明装置向上，向下和向外辐射。

16. 发明申请

US20100232179A1 PRINTED CIRCUIT BOARD AND BACK LIGHT MODULE USING THE SAME 审中-公开
标题翻译：打印电路板和使用相同的背光模组
公开(公告)号：US20100232179A1
公开(公告)日：2010-09-16
申请号：US12713178
申请日：2010-02-26
申请人： JIAN-SHIHN TSANG , LUNG-HSIN CHEN , CHIH-YUNG LIN
发明人： JIAN-SHIHN TSANG , LUNG-HSIN CHEN , CHIH-YUNG LIN
IPC分类号： F21V7/04 , H05K1/00 , H05K1/16 , F21V19/00
CPC分类号： H05K1/111 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H05K3/3421 , H05K2201/09381 , H05K2201/10106 , H05K2201/10462 , H05K2201/10651 , Y02P70/611 , H01L2924/00014 , H01L2924/00012
摘要： A back light module includes a printed circuit board and a plurality of surface mounting elements mounted on the printed circuit board. Each surface mounting element is an LED lighting element. The printed circuit board has a plurality of pads. Each of the pads includes a first bar and two second bars extending respectively from two ends of the first bar. The surface mounting element includes a plurality of pins. The pins are placed on two sides of the surface mounting element. The pins are soldered on the pads.
摘要翻译：背光模块包括印刷电路板和安装在印刷电路板上的多个表面安装元件。每个表面安装元件是LED照明元件。印刷电路板具有多个焊盘。每个垫包括分别从第一杆的两端延伸的第一杆和两个第二杆。表面安装元件包括多个销。销被放置在表面安装元件的两侧。引脚焊接在焊盘上。

17. 发明申请

US20130217159A1 METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE 有权
标题翻译：制造发光二极管封装的方法
公开(公告)号：US20130217159A1
公开(公告)日：2013-08-22
申请号：US13571361
申请日：2012-08-10
申请人： HSIN-CHIANG LIN , PIN-CHUAN CHEN , LUNG-HSIN CHEN
发明人： HSIN-CHIANG LIN , PIN-CHUAN CHEN , LUNG-HSIN CHEN
IPC分类号： H01L33/60
CPC分类号： H01L33/60 , H01L24/97 , H01L33/486 , H01L2224/16245 , H01L2924/12041 , H01L2924/181 , H01L2933/0058 , H01L2924/00
摘要： A method for manufacturing an LED package comprising steps of: providing a substrate and forming spaced electrode structures on the substrate; providing a mold on the top surface of the substrate wherein the mold defines spaced annular grooves which cooperate with the top surface of the substrate to define cavities; filling the cavities with metal material; removing the mold and hardening the metal material to form reflection cups wherein each reflection cup surrounds a corresponding electrode structure and defines a recess; polishing surfaces of the reflection cups and the electrode structures; arranging LED chips in the recesses with each LED chip electrically connected to the electrode structure; injecting an encapsulation layer in the recesses to seal the LED chips; and cutting the substrate to obtain individual LED packages.
摘要翻译：一种制造LED封装的方法，包括以下步骤：提供衬底并在衬底上形成间隔开的电极结构; 在基板的顶表面上提供模具，其中模具限定间隔开的环形槽，其与基板的顶表面配合以限定空腔; 用金属材料填充空腔; 去除模具并硬化金属材料以形成反射杯，其中每个反射杯围绕相应的电极结构并限定凹部; 抛光反射杯和电极结构的表面; 将LED芯片布置在凹陷中，每个LED芯片电连接到电极结构; 在所述凹部中注入密封层以密封所述LED芯片; 并切割基板以获得单独的LED封装。

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