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11. 发明授权

US06091498A Semiconductor processing apparatus having lift and tilt mechanism 失效
标题翻译：具有升降机构的半导体处理装置
公开(公告)号：US06091498A
公开(公告)日：2000-07-18
申请号：US991062
申请日：1997-12-15
申请人： Kyle Hanson , Mark Dix , Vladimir Zila , Daniel J. Woodruff
发明人： Kyle Hanson , Mark Dix , Vladimir Zila , Daniel J. Woodruff
IPC分类号： B65G49/07 , B25J9/06 , C25D7/12 , H01L21/00 , H01L21/677 , H01L21/68 , H01L21/687 , G01B11/14 , G01N21/00
CPC分类号： H01L21/67259 , H01L21/67173 , H01L21/6719 , H01L21/67196 , H01L21/67742 , H01L21/67769 , H01L21/67781
摘要： A lift/tilt assembly for use in a semiconductor wafer processing device is set forth. The lift/tilt assembly includes a linear guide/actuator comprising a fixed frame and a movable frame. A nest for accepting a plurality of semiconductor wafers is rotatably connected to the movable frame. The nest rotates between a wafer-horizontal orientation and a wafer-vertical orientation as it is driven with the movable frame by a motor that is coupled to the linear way. A lever connected to the nest provides an offset from true vertical for the nest when the nest is in the wafer-vertical orientation.
摘要翻译：阐述了用于半导体晶片处理装置的提升/倾斜组件。提升/倾斜组件包括具有固定框架和可移动框架的线性导向/致动器。用于接收多个半导体晶片的嵌套可旋转地连接到可移动框架。当它由与可线性方式耦合的电动机用可移动框架驱动时，嵌套在晶片水平取向和晶片垂直取向之间旋转。当嵌套处于晶片垂直方向时，连接到嵌套的杠杆提供与巢的真垂直的偏移。

12. 发明申请

US20130043762A1 Wound Field Rotating Machine with Capacitive Power Transfer 有权
标题翻译：具有电容式电力传输的绕线场旋转机
公开(公告)号：US20130043762A1
公开(公告)日：2013-02-21
申请号：US13210928
申请日：2011-08-16
申请人： Daniel Colin Ludois , Justin Kyle Reed , Kyle Hanson
发明人： Daniel Colin Ludois , Justin Kyle Reed , Kyle Hanson
IPC分类号： H02K13/00
CPC分类号： H02K13/00 , B60L2220/14 , H02K11/21 , H02K13/003 , H02K19/12 , H02K19/26 , Y02E10/725 , Y02T10/641 , Y02T90/16
摘要： An electrical rotating machine, such as a generator or motor, communicates power from a stationary location to the rotating rotor of the rotating machine via opposed pairs of capacitor plates, one plate of each pair rotating with the rotor and one plate of each pair fixed not to rotate. In one embodiment, separation between the plates of the pair is provided by a cushion of entrapped air.
摘要翻译：诸如发电机或电动机的旋转电机通过相对的电容器板将电力从静止位置传递到旋转机械的旋转转子，每对电容器板的一对板与转子一起旋转，并且每对的一个板不固定旋转在一个实施例中，一对板之间的间隔由夹带空气的缓冲垫提供。

13. 发明申请

US20080217167A9 APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSING OF MICROELECTRONIC WORKPIECES 审中-公开
标题翻译：微电子工作电化学处理的装置和方法
公开(公告)号：US20080217167A9
公开(公告)日：2008-09-11
申请号：US11096630
申请日：2005-03-29
申请人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
发明人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
IPC分类号： C25C7/00
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , H01L21/67103 , H01L21/6723
摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.
摘要翻译：用于反应容器中微电子工件的电化学处理的装置和方法。在一个实施例中，反应容器包括：具有外壁的外容器; 分配器，其耦合到所述外部容器，所述分配器具有构造成将主流引入所述外部容器中的第一出口和构造成将二次流引导到与所述主流分离的所述外部容器中的至少一个第二出口; 外部容器中的主要流动引导件联接到分配器以接收来自第一出口的主流并将其引导到工件加工位置; 所述外容器中的电介质场成形单元联接到所述分配器以接收来自所述第二出口的二次流，所述场整形单元构造成容纳所述次流与所述主流分离通过所述外容器的至少一部分，以及所述场成形单元具有至少一个电极室，所述二次流可以通过所述至少一个电极室，而所述二次流与所述主流分离; 电极室中的电极; 以及由所述场成形单元承载在所述电极的下游的界面构件，所述界面构件与所述电极室中的所述次流体流体连通，并且所述界面构件被构造成防止所述二次流的选定物质通过所述主流流。

14. 发明申请

US20080217166A9 APPARATUS AND METHODS FOR ELECTROCHEMICAL PROCESSSING OF MICROELECTRONIC WORKPIECES 审中-公开
公开(公告)号：US20080217166A9
公开(公告)日：2008-09-11
申请号：US11096495
申请日：2005-03-29
申请人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
发明人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
IPC分类号： C25C7/00
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , H01L21/67103 , H01L21/6723
摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

15. 发明申请

US20070261964A1 Reactors, systems, and methods for electroplating microfeature workpieces 审中-公开
标题翻译：用于电镀微型工件的电抗器，系统和方法
公开(公告)号：US20070261964A1
公开(公告)日：2007-11-15
申请号：US11432164
申请日：2006-05-10
申请人： Gregory Wilson , Paul McHugh , Kyle Hanson , Rajesh Baskaran
发明人： Gregory Wilson , Paul McHugh , Kyle Hanson , Rajesh Baskaran
IPC分类号： C25D5/20 , C25B9/00
CPC分类号： C25D5/08 , C25D17/002
摘要： Reactors, systems and methods for electroplating and/or electro-etching microfeature workpieces. Reactors in accordance with the invention have a first chamber configured to direct a first processing solution to a processing zone, a second chamber configured to contain a second processing solution different than the first processing solution, and an ion exchange membrane between the first chamber and the second chamber. The reactors also include (a) a support member in the first chamber that contacts the ion exchange membrane across the surface of the membrane, and (b) a counter electrode in the second chamber. The ion exchange membrane enables a low conductivity catholyte to be used in the first chamber and an inert counter electrode in the second chamber. More specifically, the ion exchange membrane prevents nascent oxygen that evolves from the inert counter electrode from reaching the catholyte to reduce oxidation of constituents of the catholyte, consumption of organic additives in the anolyte, and/or accumulation of bubbles and particulates at the workpiece.
摘要翻译：用于电镀和/或电蚀蚀微型工件的反应器，系统和方法。根据本发明的反应器具有被配置为将第一处理溶液引导到处理区的第一室，被配置为容纳不同于第一处理溶液的第二处理溶液的第二室以及第一室与第一室之间的离子交换膜第二室。反应器还包括（a）在第一室中的与膜的表面接触离子交换膜的支撑构件，和（b）第二室中的对电极。离子交换膜使得能够在第一室中使用低导电性阴极电解液，并且在第二室中使用惰性对电极。更具体地，离子交换膜防止从惰性对电极逸出的新生氧气到达阴极电解液，以减少阴极电解液的组分的氧化，阳极电解液中的有机添加剂的消耗和/或工件上的气泡和微粒的积聚。

16. 发明申请

US20070175759A1 Apparatus and method for deposition of an electrophoretic emulsion 审中-公开
标题翻译：用于沉积电泳乳液的装置和方法
公开(公告)号：US20070175759A1
公开(公告)日：2007-08-02
申请号：US11644788
申请日：2006-12-22
申请人： John Klocke , Kyle Hanson
发明人： John Klocke , Kyle Hanson
IPC分类号： C25B7/00
CPC分类号： G03F7/164 , C25D7/12 , C25D13/00 , C25D13/12 , C25D13/22 , C25D17/001
摘要： The present invention provides a system that enables the use of electrophoretic resists in the microfabrication industry for the production of microelectronic devices and is of sufficiently high quality to be used as a replacement for, or supplement to, current photoresist deposition technology. This system enables the application of electrophoretic resists in automated equipment that meets the standards for cleanliness and production throughput desired by the microelectronic fabrication industry. The system, apparatus and method, for providing electrophoretic resist (“EPR”) layers on microelectronic workpieces for the microfabrication of microelectronic devices comprises a deposition station for receiving a microelectronic workpiece and depositing a layer of electrophoretic photoresist (EPR) thereon, a workpiece handling apparatus, and a control unit coupled to the workpiece handling apparatus and the deposition station for coordinating the processing of the workpiece in accordance with a predetermined sequence and set of processing parameters.
摘要翻译：本发明提供了一种能够在微细加工工业中使用电泳抗蚀剂用于生产微电子器件的系统，并且具有足够高的质量以用作当前光致抗蚀剂沉积技术的替代或补充。该系统能够在符合微电子制造业所需的清洁度和生产吞吐量的标准的自动化设备中应用电泳抗蚀剂。用于在微电子工件上提供用于微电子器件的微细加工的电泳抗蚀剂（“EPR”）层的系统，装置和方法包括用于接收微电子工件并在其上沉积一层电泳光致抗蚀剂（EPR）的沉积站，工件处理装置和耦合到工件处理装置和沉积站的控制单元，用于根据预定的顺序和一组处理参数来协调工件的处理。

17. 发明申请

US20060163072A1 Electrolytic process using anion permeable barrier 审中-公开
公开(公告)号：US20060163072A1
公开(公告)日：2006-07-27
申请号：US11296574
申请日：2005-12-07
申请人： Rajesh Baskaran , Robert Batz , Bioh Kim , Tom Ritzdorf , John Klocke , Kyle Hanson
发明人： Rajesh Baskaran , Robert Batz , Bioh Kim , Tom Ritzdorf , John Klocke , Kyle Hanson
IPC分类号： C25D1/00
CPC分类号： C25D21/12 , C25D17/00 , C25D17/001 , C25D17/002 , C25D17/12
摘要： Processes and systems for electrolytically processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and an anion permeable barrier layer. The anion permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain anionic species to transfer between the two fluids. The described processes produce deposits over repeated plating cycles that exhibit resistivity values within desired ranges.

18. 发明申请

US20050205419A1 Apparatus and methods for electrochemical processsing of microelectronic workpieces 审中-公开
公开(公告)号：US20050205419A1
公开(公告)日：2005-09-22
申请号：US11096495
申请日：2005-03-29
申请人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
发明人： Kyle Hanson , Thomas Ritzdorf , Gregory Wilson , Paul McHugh
IPC分类号： C25D7/12 , C10B1/00 , C25C7/00 , C25D3/00 , C25D5/00 , C25D17/00 , C25D21/00 , H01L21/00
CPC分类号： H01L21/6719 , C25D7/123 , C25D17/001 , H01L21/67103 , H01L21/6723
摘要： An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having a first outlet configured to introduce a primary flow into the outer container and at least one second outlet configured to introduce a secondary flow into the outer container separate from the primary flow; a primary flow guide in the outer container coupled to the distributor to receive the primary flow from the first outlet and direct it to a workpiece processing site; a dielectric field shaping unit in the outer container coupled to the distributor to receive the secondary flow from the second outlet, the field shaping unit being configured to contain the secondary flow separate from the primary flow through at least a portion of the outer container, and the field shaping unit having at least one electrode compartment through which the secondary flow can pass while the secondary flow is separate from the primary flow; an electrode in the electrode compartment; and an interface member carried by the field shaping unit downstream from the electrode, the interface member being in fluid communication with the secondary flow in the electrode compartment, and the interface member being configured to prevent selected matter of the secondary flow from passing to the primary flow.

19. 发明申请

US20050161336A1 Electroplating apparatus with segmented anode array 审中-公开
公开(公告)号：US20050161336A1
公开(公告)日：2005-07-28
申请号：US11083439
申请日：2005-03-17
申请人： Daniel Woodruff , Kyle Hanson
发明人： Daniel Woodruff , Kyle Hanson
IPC分类号： C25D7/12 , C25D17/12 , C25D5/02 , C25D17/00
CPC分类号： C25D17/12 , C25D7/123 , C25D17/001
摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

20. 发明申请

US20050161320A1 Electroplating apparatus with segmented anode array 审中-公开
公开(公告)号：US20050161320A1
公开(公告)日：2005-07-28
申请号：US11083707
申请日：2005-03-17
申请人： Daniel Woodruff , Kyle Hanson
发明人： Daniel Woodruff , Kyle Hanson
IPC分类号： C25D7/12 , C25D17/12 , C25D17/00
CPC分类号： C25D17/12 , C25D7/123 , C25D17/001
摘要： An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are preferably positioned in concentric, coplanar relationship with each other. The anode segments can be independently operated to create varying electrical potentials with the associated workpiece to promote uniform deposition of electroplated metal on the surface of the workpiece.

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