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    • 13. 发明授权
    • Curable composition
    • 可固化组合物
    • US5122436A
    • 1992-06-16
    • US514776
    • 1990-04-26
    • Scott E. TunneyJohn J. Fitzgerald
    • Scott E. TunneyJohn J. Fitzgerald
    • C08F283/12C08L79/08C08L83/10C09D179/08C09D183/10
    • C08L83/10C08F283/12C08L79/08C09D179/08C09D183/10Y10S430/107
    • A curable composition which comprises a homogeneous blend of (a) a solvent soluble polyimidesiloxane containing about 0.2-30 weight percent silicon and (b) an ethylenically unsaturated multifunctional monomer. The siloxane units in the polyimide-siloxane have from 10 to about 200 ##STR1## linkages per unit, more preferably from about 15 to about 100 linkages, and most preferably from about 40 to about 60 ##STR2## linkages per siloxane unit. Another embodiment provides the composition produced by curing the above-described composition. The curable compositions of this invention can be cured by either actinic radiation, e.g., uv light, or thermal radiation. In the cured composition, the polymer produced upon polymerization of the monomer, and the polyimide portion of the polyimide-siloxane form a homogeneous blend, in which the siloxane portion of the polyimide-siloxane is phase separated. The cured composition is a polymer network, and is particularly useful as a negative-working resist in the fabrication of electronic devices such as integrated circuit (IC) chips. The cured composition reduced stress at the polymer/metal interface of coated objects, thereby reducing curl in thin, coated objects.
    • 一种可固化组合物,其包含(a)含有约0.2-30重量%硅的溶剂可溶性聚酰亚胺硅烷和(b)烯键式不饱和多官能单体的均匀混合物。 聚酰亚胺硅氧烷中的硅氧烷单元每单位具有10至约200个键,更优选约15至约100个键,最优选约40至约60个键。 另一个实施方案提供通过固化上述组合物制备的组合物。 本发明的可固化组合物可通过光化辐射例如紫外线或热辐射来固化。 在固化的组合物中,在单体聚合时产生的聚合物和聚酰亚胺 - 硅氧烷的聚酰亚胺部分形成均匀的共混物,其中聚酰亚胺 - 硅氧烷的硅氧烷部分相分离。 固化的组合物是聚合物网络,并且特别可用作制造诸如集成电路(IC)芯片的电子器件的负极抗蚀剂。 固化的组合物在涂覆物体的聚合物/金属界面处减少应力,从而减少薄的涂覆物体的卷曲。