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11. 发明申请

US20080099910A1 Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip 审中-公开
标题翻译：带封装保持结构和带的倒装芯片半导体封装
公开(公告)号：US20080099910A1
公开(公告)日：2008-05-01
申请号：US11847813
申请日：2007-08-30
申请人： Neil McLellan , Vincent Chan , Roden Topacio
发明人： Neil McLellan , Vincent Chan , Roden Topacio
IPC分类号： H01L21/00 , H01L23/34
CPC分类号： H01L21/563 , H01L23/16 , H01L23/24 , H01L23/3128 , H01L23/3185 , H01L24/97 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/1433 , H01L2924/15153 , H01L2924/1517 , H01L2924/15311 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H01L2924/3511 , H01L2224/81 , H01L2924/00 , H01L2224/0401
摘要： An integrated circuit package includes an encapsulant retention structure located adjacent to a die on a substrate. The structure allows for the placement and retention of a larger quantity of encapsulant to seep under the die. The retention structure placed on the substrate may also serve as a substrate stiffener to maintain mechanical properties of the substrate, allowing use of a more desirable thinner substrate. In one embodiment, the use of openings and recesses in a stiffener allows passive electronic components to maintain mechanical properties when a thinner substrate is used. The use of either a retention wall or a stiffener allows for the manufacture of these integrated circuit package using strip, matrix, where a larger strip with a plurality of integrated circuit packages is produced industrially and then singulated.
摘要翻译：集成电路封装包括邻近衬底上的管芯的密封剂保留结构。该结构允许更大量的密封剂的放置和保持在模具下渗出。放置在基板上的保持结构也可以用作基板加强件，以保持基板的机械性能，允许使用更理想的更薄的基板。在一个实施例中，在加强件中使用开口和凹槽允许无源电子部件在使用更薄的衬底时保持机械性能。使用保留壁或加强件允许使用条带，矩阵来制造这些集成电路封装，其中具有多个集成电路封装的较大条带在工业上制造然后被分割。

12. 发明申请

US20060030397A1 Video gaming machine with player-selectable banner 审中-公开
标题翻译：具有播放器选择横幅的视频游戏机
公开(公告)号：US20060030397A1
公开(公告)日：2006-02-09
申请号：US10913849
申请日：2004-08-06
申请人： Vincent Chan
发明人： Vincent Chan
IPC分类号： A63F9/24
CPC分类号： G07F17/3227 , G07F17/3211
摘要： A video gaming machine having a player-selectable banner is disclosed wherein the banner is displayable simultaneously with display of a wagering game. The video gaming machine includes a touch screen having a soft button which activates a change in information displayed in the banner. A method for displaying information to a player of a wagering game wherein the player may select the information displayed is disclosed.
摘要翻译：公开了一种具有播放器选择的横幅的视频游戏机，其中横幅可以与投注游戏的显示同时显示。视频游戏机包括具有软按钮的触摸屏，其激活横幅中显示的信息的变化。公开了一种向游戏玩家显示信息的方法，其中玩家可以选择所显示的信息。

13. 发明授权

US4190792A Positioning control system 失效
标题翻译：定位控制系统
公开(公告)号：US4190792A
公开(公告)日：1980-02-26
申请号：US884754
申请日：1978-03-09
申请人： Vincent Chan
发明人： Vincent Chan
IPC分类号： G05D3/16 , G05B1/06
CPC分类号： G05D3/16
摘要： A position control system capable of relatively great positioning accuracy includes a universal electric motor and a gear box for transferring the motion of the motor and an object being positioned. The position control system includes a conductive brush which moves with the object being positioned and which slides on a plurality of electrical contacts which are part of a control circuit the control circuit includes a plurality switches for selection of the desired position of the object and resistance networks which serve to apply various values of voltage to voltage sensitive motor speed and direction controls which in turn control the speed direction and stopping of the motor hereby controlling the position of the object.
摘要翻译：能够具有相对较高的定位精度的位置控制系统包括通用电动机和用于传递电动机的运动和被定位的物体的齿轮箱。所述位置控制系统包括导电刷，所述导电刷随着被定位的物体移动，并且在作为控制电路的一部分的多个电触点上滑动，所述控制电路包括用于选择物体和电阻网络的期望位置的多个开关其用于对电压敏感的电动机速度和方向控制施加各种电压值，所述电压速度和方向控制依次控制电动机的速度方向和停止，从而控制对象的位置。

14. 发明申请

US20100320599A1 DIE STACKING APPARATUS AND METHOD 有权
标题翻译： DIE堆叠装置和方法
公开(公告)号：US20100320599A1
公开(公告)日：2010-12-23
申请号：US12868339
申请日：2010-08-25
申请人： Vincent Chan , Neil McLellan , Kevin O'Neil
发明人： Vincent Chan , Neil McLellan , Kevin O'Neil
IPC分类号： H01L23/48
CPC分类号： H01L24/11 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05169 , H01L2224/05571 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/16145 , H01L2224/73253 , H01L2225/06513 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30107 , H01L2924/00014
摘要： Various stacked semiconductor devices and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor die that has a first bulk semiconductor side and a first opposite side. A second semiconductor die is provided that has a second bulk semiconductor side and a second opposite side. The second opposite side of the second semiconductor die is coupled to the first opposite side of the first semiconductor die. Electrical connections are formed between the first semiconductor die and the second semiconductor die.
摘要翻译：提供各种叠层半导体器件及其制造方法。一方面，提供一种制造方法，其包括提供具有第一体半导体侧和第一相对侧的第一半导体管芯。提供了具有第二体半导体侧和第二相对侧的第二半导体管芯。第二半导体管芯的第二相对侧耦合到第一半导体管芯的第一相对侧。在第一半导体管芯和第二半导体管芯之间形成电连接。

15. 发明申请

US20090032971A1 Die Stacking Apparatus and Method 有权
标题翻译：模具堆叠设备和方法
公开(公告)号：US20090032971A1
公开(公告)日：2009-02-05
申请号：US11832519
申请日：2007-08-01
申请人： Vincent Chan , Neil McLellan , Kevin O'Neil
发明人： Vincent Chan , Neil McLellan , Kevin O'Neil
IPC分类号： H01L23/48 , H01L21/58
CPC分类号： H01L24/11 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05169 , H01L2224/05571 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/16145 , H01L2224/73253 , H01L2225/06513 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30107 , H01L2924/00014
摘要： Various stacked semiconductor devices and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor die that has a first bulk semiconductor side and a first opposite side. A second semiconductor die is provided that has a second bulk semiconductor side and a second opposite side. The second opposite side of the second semiconductor die is coupled to the first opposite side of the first semiconductor die. Electrical connections are formed between the first semiconductor die and the second semiconductor die.
摘要翻译：提供各种叠层半导体器件及其制造方法。一方面，提供一种制造方法，其包括提供具有第一体半导体侧和第一相对侧的第一半导体管芯。提供了具有第二体半导体侧和第二相对侧的第二半导体管芯。第二半导体管芯的第二相对侧耦合到第一半导体管芯的第一相对侧。在第一半导体管芯和第二半导体管芯之间形成电连接。

16. 发明授权

US07215022B2 Multi-die module 有权
标题翻译：多模模块
公开(公告)号：US07215022B2
公开(公告)日：2007-05-08
申请号：US09886741
申请日：2001-06-21
申请人： Vincent Chan , Samuel Ho
发明人： Vincent Chan , Samuel Ho
IPC分类号： H01L23/34
CPC分类号： H05K1/141 , H01L24/73 , H01L25/03 , H01L25/0655 , H01L25/18 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2224/92125 , H01L2224/92247 , H01L2225/1005 , H01L2924/01067 , H01L2924/01079 , H01L2924/15311 , H05K1/181 , H05K3/3436 , H05K2201/10734 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die module to be interchangeable with conventional multi-die packages. In one embodiment, the unpackaged die is a graphics processor, and the packaged die is a standard memory that has been burned in, functionally tested, and speed rated.
摘要翻译：如本文所公开的，多管芯模块电连接到未封装的管芯和封装的管芯。多模模块具有与不包括封装模具的常规多管芯封装相同的覆盖区，从而允许多模模块可与常规多管芯封装互换。在一个实施例中，未封装的裸片是图形处理器，并且封装的裸片是已被烧录，功能测试和速度评估的标准存储器。

17. 发明申请

US20060051912A1 Method and apparatus for a stacked die configuration 审中-公开
标题翻译：用于堆叠管芯配置的方法和装置
公开(公告)号：US20060051912A1
公开(公告)日：2006-03-09
申请号：US10938439
申请日：2004-09-09
申请人： Vincent Chan
发明人： Vincent Chan
IPC分类号： H01L21/84
CPC分类号： H01L25/50 , H01L25/0657 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2225/06527 , H01L2225/06555 , H01L2924/15311 , H01L2924/00014 , H01L2924/00012
摘要： A stacked die configuration for use in an IC package includes a first IC die mechanically coupled to a substrate material. Mechanically coupled to the first IC die is an interposer having an aperture adapted to receive a second IC die. Mechanically coupled to the first IC die and fitting within the aperture of the interposer is a second IC die. As a result, both the overall height of the IC package and the length of the bond wires connecting each of the members of the stacked die configuration may be reduced.
摘要翻译：用于IC封装的堆叠管芯配置包括机械耦合到衬底材料的第一IC裸片。机械地耦合到第一IC裸片是具有适于接收第二IC裸片的孔的插入器。机械地耦合到第一IC管芯并且插入插入件的孔内的是第二IC管芯。结果，可以减小IC封装的整体高度和连接每个堆叠管芯构造的构件的接合线的长度。

18. 发明授权

US08177644B2 Wagering game with fantasy-sports feature 有权
标题翻译：投注游戏与幻想运动功能
公开(公告)号：US08177644B2
公开(公告)日：2012-05-15
申请号：US12377531
申请日：2007-08-15
申请人： Peter R. Anderson , Rory L. Block , Joel R. Jaffe , Shridhar P. Joshi , Vincent Chan , Patrick H. Kelley , Richard T. Schwartz , Byron A. Uytiepo
发明人： Peter R. Anderson , Rory L. Block , Joel R. Jaffe , Shridhar P. Joshi , Vincent Chan , Patrick H. Kelley , Richard T. Schwartz , Byron A. Uytiepo
IPC分类号： A63F9/24
CPC分类号： G07F17/32
摘要： A gaming system and method of conducting a wagering game having a fantasy-sports feature on a gaming system is disclosed. A wager is received from a user to play the wagering game. A roster having one or more player is created, via user selection. A projected team score and an actual team score for the created roster are determined. A ratio is calculated for the actual team score to the projected team score. An award is provided to the user if the calculated ratio meets a predetermined criterion.
摘要翻译：公开了一种在游戏系统上进行具有幻想运动特征的投注游戏的游戏系统和方法。从用户那里收到下注来玩下注游戏。通过用户选择创建具有一个或多个播放器的花名册。确定了创建的名单的预计团队得分和实际团队得分。计算出实际团队得分与预计团队得分的比率。如果计算的比率满足预定标准，则向用户提供奖励。

19. 发明授权

US07969020B2 Die stacking apparatus and method 有权
标题翻译：模具堆垛装置及方法
公开(公告)号：US07969020B2
公开(公告)日：2011-06-28
申请号：US12868339
申请日：2010-08-25
申请人： Vincent Chan , Neil McLellan , Kevin O'Neil
发明人： Vincent Chan , Neil McLellan , Kevin O'Neil
IPC分类号： H01L23/48 , H01L23/52
CPC分类号： H01L24/11 , H01L25/0652 , H01L25/0657 , H01L25/18 , H01L2224/05001 , H01L2224/05022 , H01L2224/05026 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05169 , H01L2224/05571 , H01L2224/05639 , H01L2224/05644 , H01L2224/05655 , H01L2224/05669 , H01L2224/1132 , H01L2224/11334 , H01L2224/1147 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13169 , H01L2224/16145 , H01L2224/73253 , H01L2225/06513 , H01L2924/01006 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1532 , H01L2924/30107 , H01L2924/00014
摘要： Various stacked semiconductor devices and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a first semiconductor die that has a first bulk semiconductor side and a first opposite side. A second semiconductor die is provided that has a second bulk semiconductor side and a second opposite side. The second opposite side of the second semiconductor die is coupled to the first opposite side of the first semiconductor die. Electrical connections are formed between the first semiconductor die and the second semiconductor die.
摘要翻译：提供各种叠层半导体器件及其制造方法。一方面，提供一种制造方法，其包括提供具有第一体半导体侧和第一相对侧的第一半导体管芯。提供了具有第二体半导体侧和第二相对侧的第二半导体管芯。第二半导体管芯的第二相对侧耦合到第一半导体管芯的第一相对侧。在第一半导体管芯和第二半导体管芯之间形成电连接。

20. 发明申请

US20100285857A1 Wagering Game With Fantasy-Sports Feature 有权
标题翻译：投注游戏与幻想体育功能
公开(公告)号：US20100285857A1
公开(公告)日：2010-11-11
申请号：US12377531
申请日：2007-08-15
申请人： Peter R. Anderson , Rory L. Block , Joel R. Jaffe , Shridhar P. Joshi , Vincent Chan , Patrick H. Kelley , Richard T. Schwartz
发明人： Peter R. Anderson , Rory L. Block , Joel R. Jaffe , Shridhar P. Joshi , Vincent Chan , Patrick H. Kelley , Richard T. Schwartz
IPC分类号： A63F9/24 , A63F13/00
CPC分类号： G07F17/32
摘要： A gaming system and method of conducting a wagering game having a fantasy-sports feature on a gaming system is disclosed. A wager is received from a user to play the wagering game. A roster having one or more player is created, via user selection. A projected team score and an actual team score for the created roster are determined. A ratio is calculated for the actual team score to the projected team score. An award is provided to the user if the calculated ratio meets a predetermined criterion.
摘要翻译：公开了一种在游戏系统上进行具有幻想运动特征的投注游戏的游戏系统和方法。从用户那里收到下注来玩下注游戏。通过用户选择创建具有一个或多个播放器的花名册。确定了创建的名单的预计团队得分和实际团队得分。计算出实际团队得分与预计团队得分的比率。如果计算的比率满足预定标准，则向用户提供奖励。

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