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    • 11. 发明申请
    • Printed wiring board and method for manufacturing the same
    • 印刷电路板及其制造方法
    • US20070128855A1
    • 2007-06-07
    • US11634970
    • 2006-12-07
    • Hye ChoJae JoungSung Oh
    • Hye ChoJae JoungSung Oh
    • H01L21/4763
    • H05K3/4664H05K3/125H05K3/4647H05K2201/0154H05K2201/09881H05K2203/013
    • Provided is a method for manufacturing a printed wiring board, which can enhance the peel strength between an insulating layer and a conductive pattern by a two-step process, that is, a semi-hardening and full-hardening of the insulating layer. In the method for manufacturing the printed wiring board having one or more layers of a conductive pattern and an insulating pattern, an insulating pattern is formed on an insulating substrate, and at least one of the insulating substrate and the insulating pattern is semi-hardened. A conductive pattern is formed on the insulating substrate and/or the insulating pattern, thereby providing a stack structure. Then, a thermal treatment is performed on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern, and the conductive pattern is fired.
    • 提供一种印刷电路板的制造方法,其可以通过两步法(即,绝缘层的半硬化和全硬化)来提高绝缘层和导电图案之间的剥离强度。 在制造具有一层或多层导电图案和绝缘图案的印刷线路板的方法中,在绝缘基板上形成绝缘图案,绝缘基板和绝缘图案中的至少一个被半硬化。 在绝缘基板和/或绝缘图案上形成导电图案,从而提供堆叠结构。 然后,对堆叠结构进行热处理,以使半硬化绝缘基板和/或绝缘图案完全硬化,并且导电图案被烧制。