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11. 发明申请

US20100066230A1 HEAT DISSIPATING STRUCTURE OF LED CIRCUIT BOARD AND LED LAMP TUBE COMPRISED THEREOF 有权
标题翻译： LED电路板的散热结构及其包含的LED灯管
公开(公告)号：US20100066230A1
公开(公告)日：2010-03-18
申请号：US12211965
申请日：2008-09-17
申请人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： H01J7/24
CPC分类号： F21S4/003 , B82Y30/00 , B82Y99/00 , F21K9/27 , F21S8/031 , F21V3/02 , F21V5/04 , F21V29/506 , F21V29/83 , F21V29/85 , F21Y2105/10 , F21Y2115/10 , H05K1/0209 , H05K3/285 , H05K3/3447 , H05K2201/0209 , H05K2201/0257 , H05K2201/10106 , H05K2201/10977
摘要： A heat dissipating structure of an LED circuit board and a device applied in an LED tube which comprises an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered a coating layer including Nanoparticles and a bonding agent. Accommodating the LED circuit board covering the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board by the coating layer having the characters of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, for the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to accelerate dissipating the heat.
摘要翻译： LED电路板的散热结构和应用在LED管中的装置，其包括具有多个焊接点的LED电路板。 LED电路板的焊接点覆盖有包括纳米颗粒和粘合剂的涂层。容纳在LED灯管中覆盖涂层的LED电路板，以通过具有高发射率，耐温性和导电绝缘性的涂层加速散发LED电路板的热量。另一方面，对于涂层，可以增加焊接点与空气的接触面积，以扩大LED电路板的散热面积，从而加速散热。

12. 发明申请

US20100051236A1 PROCESS AND ASSEMBLY FOR FLUSH CONNECTING EVAPORATOR SECTIONS OF JUXTAPOSED HEAT PIPES TO A FIXING BASE 审中-公开
标题翻译：用于将连接热管的蒸发器部分连接到固定基座的过程和组件
公开(公告)号：US20100051236A1
公开(公告)日：2010-03-04
申请号：US12202723
申请日：2008-09-02
申请人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： F28D5/00 , B21D53/06
CPC分类号： F28D15/0275 , B21D53/06 , Y10T29/49353
摘要： A process for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane includes the steps of: providing a fixing base with its bottom surface having an accommodating trough; providing at least two heat pipes each having an evaporator section and a condenser section; disposing the evaporator sections of the heat pipes in the accommodating trough; and machining the evaporator sections of the juxtaposed heat pipes, thereby forming a plane on the evaporator sections of the heat pipe. Via the above process, the evaporator sections of the heat pipes can be juxtaposed in and flush connected to the fixing base, thereby increasing the contact area between the evaporator sections of the heat pipes and a heat-generating element. It further provides an assembly for flush connecting evaporator sections of juxtaposed heat pipes to a fixing base and forming a plane.
摘要翻译：将并列的热管的蒸发器部分与固定基座并形成平面的冲洗连接的过程包括以下步骤：提供固定底座，其底面具有容纳槽; 提供至少两个各自具有蒸发器部分和冷凝器部分的热管; 将热管的蒸发器部分设置在容纳槽中; 并且对并置的热管的蒸发器部进行加工，从而在热管的蒸发器部分上形成一个平面。通过上述处理，热管的蒸发器部分可以并置并与固定基座齐平，从而增加热管的蒸发器部分与发热元件之间的接触面积。它还提供了用于将并置的热管的蒸发器部分冲洗连接到固定基座并形成平面的组件。

13. 发明申请

US20100083500A1 LEVELING METHOD FOR BURYING EVAPORATING SECTION OF HEAT PIPE INTO THERMALLY CONDUCTIVE SEAT 有权
标题翻译：将热管蒸发蒸发到热导阀座的水平方法
公开(公告)号：US20100083500A1
公开(公告)日：2010-04-08
申请号：US12477471
申请日：2009-06-03
申请人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： B21D53/02
CPC分类号： B21D39/00 , B21D53/02 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F2275/12 , Y10T29/4935 , Y10T29/49353 , Y10T29/49373 , Y10T29/49391
摘要： A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.
摘要翻译：提供一种用于将热管的蒸发部分埋入导热座中的调平方法，用于通过将热管的蒸发部分形成为平坦表面的同时使热管和导热座的蒸发部分形成为平坦表面，热管正在埋入导热座中。此外，与冲压机配合使用，调平方法是在不需要改变冲压模具的条件下，对热管的蒸发部进行多次压配。

14. 发明授权

US08092043B2 LED lamp tube with heat distributed uniformly 有权
标题翻译： LED灯管散热均匀
公开(公告)号：US08092043B2
公开(公告)日：2012-01-10
申请号：US12166552
申请日：2008-07-02
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Wen-Jung Liu , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Wen-Jung Liu , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： F21S4/00 , F21V21/00
CPC分类号： H05K1/141 , F21K9/278 , F21V23/006 , F21Y2103/10 , F21Y2115/10 , H01L2924/19107 , H05K3/222 , H05K2201/1003 , H05K2201/10106 , H05K2201/10287 , Y10S362/80
摘要： A LED lamp tube which includes a hollow transparent tube, a LED lamp assembly disposed in the transparent tube, two conductive caps provided on both ends of the transparent tube respectively, and a circuit control unit. The circuit control unit includes a plurality of separated sub-portions. The respective sub-portions of the circuit control unit are distributed uniformly on the circuit board of the LED lamp assembly. Via the uniform arrangement of respective sub-portions of the circuit control unit, the heat within the LED lamp tube can be distributed uniformly, thereby lowering the temperature and facilitating the heat dissipation.
摘要翻译：一种LED灯管，其包括中空透明管，设置在透明管中的LED灯组件，分别设置在透明管两端的两个导电盖和电路控制单元。电路控制单元包括多个分离的子部分。电路控制单元的各个子部分均匀分布在LED灯组件的电路板上。通过电路控制单元的各个子部分的均匀布置，可以均匀地分配LED灯管内的热量，从而降低温度并促进散热。

15. 发明申请

US20100265708A1 HEAT-DISSIPATING ASSEMBLY OF LED LAMP HOLDER 审中-公开
标题翻译： LED灯座散热组件
公开(公告)号：US20100265708A1
公开(公告)日：2010-10-21
申请号：US12425768
申请日：2009-04-17
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Chiao-Li Huang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Chiao-Li Huang , Ken Hsu , Chih-Hung Cheng
IPC分类号： F21V21/00
CPC分类号： F21V29/83 , F21V29/717 , F21V29/763 , F21Y2115/10 , F28D15/0275
摘要： A LED lamp holder includes a lamp cover and a heat-dissipating device provided in the lamp cover. An accommodating inlet is provided on the lamp cover. A LED unit is provided below the lamp cover. A cover plate covers the accommodating inlet. The heat-dissipating device includes a heat-absorbing plate, a heat-dissipating plate and a heat pipe connected between the heat-absorbing plate and the heat-dissipating plate. The heat-absorbing plate is brought into contact with the LED unit, while the heat-dissipating plate is brought into contact with the cover plate. The cover plate is penetrated by a plurality of screw elements. Each of the screw elements is screwed to the heat-absorbing plate. The length of each screw element exactly makes the heat-absorbing plate to abut and contact the LED unit.
摘要翻译： LED灯座包括灯罩和设置在灯罩中的散热装置。在灯罩上设置容纳入口。在灯罩下面提供一个LED单元。盖板覆盖容纳入口。散热装置包括吸热板，散热板和连接在吸热板和散热板之间的热管。吸热板与LED单元接触，同时散热板与盖板接触。盖板被多个螺丝元件贯穿。每个螺丝元件都拧到吸热板上。每个螺丝元件的长度准确地使吸热板与LED单元抵接并接触。

16. 发明申请

US20100127657A1 PORTABLE SOLAR CELL CHARGING DEVICE 有权
标题翻译：便携式太阳能电池充电装置
公开(公告)号：US20100127657A1
公开(公告)日：2010-05-27
申请号：US12277377
申请日：2008-11-25
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： H02J7/00
CPC分类号： H02J7/355
摘要： A solar cell charging device includes a base shown as a shell shape, a light-converging lens arranged at a top face of the base, a solar collector correspondingly located under the light-converging lens and a photoelectric converting unit. A plurality of charging troughs arranged on the base are recessed inwardly from circumferential faces thereof. The photoelectric converting unit is connected between each charging trough and the solar collector, converting the light energy absorbed by the solar collector into electric energy provided to be input into each charging trough, after the light-converging lens focuses the solar energy onto the solar collector.
摘要翻译：一种太阳能电池充电装置，包括：壳体形状的基座，配置在基座的顶面的聚光透镜，位于聚光透镜的下方的太阳能收集体和光电转换单元。布置在基座上的多个充电槽从其周面向内凹入。光电转换单元连接在每个充电槽和太阳能收集器之间，在聚光透镜将太阳能聚焦到太阳能收集器上之后，将由太阳能收集器吸收的光能转换成要输入到每个充电槽中的电能。

17. 发明申请

US20100108120A1 MULTI-STAGE FOLDING PORTABLE SOLAR CHARGING APPARATUS 审中-公开
标题翻译：多级折叠便携式太阳能充电装置
公开(公告)号：US20100108120A1
公开(公告)日：2010-05-06
申请号：US12265857
申请日：2008-11-06
申请人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len LIN , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： H01L31/042
CPC分类号： H02S30/20
摘要： A multi-stage folding portable solar charging apparatus includes first, second and third photoelectric conversion modules. The second photoelectric conversion module is pivotally connected to a side of the first photoelectric conversion module and folded/unfolded with respect to an upper surface of the first photoelectric conversion module, and the third photoelectric conversion module is pivotally connected to another side of the first photoelectric conversion module and can be folded/unfolded with respect to a lower surface of the first photoelectric conversion module, such that the photoelectric conversion modules are electrically connected with each other. A connector is fixed and electrically connected to one of the photoelectric conversion modules. The second and third photoelectric conversion modules are unfolded from the stacked first photoelectric conversion module to increase an electric power generation area of charging apparatus when unfolded to enhance the electric power generation, and reduce the volume of the charging apparatus when folded.
摘要翻译：多级折叠便携式太阳能充电装置包括第一，第二和第三光电转换模块。第二光电转换模块可枢转地连接到第一光电转换模块的一侧，并相对于第一光电转换模块的上表面折叠/展开，第三光电转换模块可枢转地连接到第一光电转换模块的另一侧转换模块，并且可以相对于第一光电转换模块的下表面折叠/展开，使得光电转换模块彼此电连接。连接器固定并电连接到一个光电转换模块。第二和第三光电转换模块从堆叠的第一光电转换模块展开，以在展开时增加充电装置的发电区域以增强发电，并且当折叠时减小充电装置的体积。

18. 发明授权

US08684563B2 Heat dissipating structure of LED lamp cup made of porous material 有权
标题翻译： LED灯杯散热结构由多孔材料制成
公开(公告)号：US08684563B2
公开(公告)日：2014-04-01
申请号：US12345976
申请日：2008-12-30
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Chiao-Li Huang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Chiao-Li Huang , Ken Hsu , Chih-Hung Cheng
IPC分类号： F21V29/00 , F21V5/00 , F21V3/00 , B60Q1/06
CPC分类号： F21V29/89 , F21K9/233 , F21V29/507 , F21V29/773 , F21V29/83 , F21V29/86 , F21Y2103/10 , F21Y2115/10
摘要： A heat dissipating structure of a lightweight lamp cup 10 made of a porous material includes a containing cavity 11 at an end of the lamp cup 10, a lamp holder 30 at another end of the containing cavity 11, a metal hood 60 sheathed with the lamp holder 30 and covered onto an external side of the lamp cup 10, a heat conduction medium 50 between the lamp cup 10 and the metal hood 60, and a light emitting unit 20 contained in the containing cavity 11 of the lamp cup 10, such that the heat produced by the light emitting unit 20 can be conducted form the lamp cup 10 to the metal hood 60 and dissipated from the metal hood 60 to the outside.
摘要翻译：由多孔材料制成的轻型灯杯10的散热结构包括在灯杯10的一端的容纳腔11，在容纳腔11的另一端的灯座30，与灯罩相配的金属罩60 保持器30并且覆盖在灯杯10的外侧，灯杯10和金属罩60之间的导热介质50以及容纳在灯杯10的容纳腔11中的发光单元20，使得由发光单元20产生的热量可以从灯杯10传导到金属罩60并从金属罩60散发到外部。

19. 发明授权

US08344600B2 Heat dissipating structure of LED circuit board and LED lamp tube comprised thereof 有权
标题翻译： LED电路板的散热结构及其组成的LED灯管
公开(公告)号：US08344600B2
公开(公告)日：2013-01-01
申请号：US12211965
申请日：2008-09-17
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： H01J1/02
CPC分类号： F21S4/003 , B82Y30/00 , B82Y99/00 , F21K9/27 , F21S8/031 , F21V3/02 , F21V5/04 , F21V29/506 , F21V29/83 , F21V29/85 , F21Y2105/10 , F21Y2115/10 , H05K1/0209 , H05K3/285 , H05K3/3447 , H05K2201/0209 , H05K2201/0257 , H05K2201/10106 , H05K2201/10977
摘要： A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The LED circuit board is covered by the coating layer in an LED lamp tube to accelerate dissipating the heat of the LED circuit board. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board to, thereby accelerating dissipating the heat.
摘要翻译： LED电路板的散热结构包括具有多个焊接点的LED电路板。 LED电路板的焊接点由包括纳米颗粒和粘合剂的涂层覆盖。 LED电路板被LED灯管中的涂层覆盖，以加速LED电路板的散热。涂层具有发光率高，耐温性和导电性绝缘性高的特点。另一方面，涂层可以增加焊接点与空气的接触面积，以扩大LED电路板的散热面积，从而加速散热。

20. 发明授权

US08161644B2 Leveling method for burying evaporating section of heat pipe into thermally conductive seat 有权
标题翻译：将热管的蒸发段埋入导热座中的调平方法
公开(公告)号：US08161644B2
公开(公告)日：2012-04-24
申请号：US12477471
申请日：2009-06-03
申请人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
发明人： Kuo-Len Lin , Chen-Hsiang Lin , Hwai-Ming Wang , Ken Hsu , Chih-Hung Cheng
IPC分类号： B21D21/00 , B21D39/06 , B21D53/02 , B23P6/00
CPC分类号： B21D39/00 , B21D53/02 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F2275/12 , Y10T29/4935 , Y10T29/49353 , Y10T29/49373 , Y10T29/49391
摘要： A leveling method for burying an evaporating section of a heat pipe into a thermally conductive seat is provided for an assembly of heat pipe and heat-conducting seat by simultaneously making the evaporating section of heat pipe partially formed into a flat surface when the evaporating section of heat pipe is being burying into the thermally conductive seat. Furthermore, in cooperation with a stamping machine, the leveling method is to make a multiple steps of press-fitting process to an evaporating section of heat pipe under a condition that there is no need to change the stamping die.
摘要翻译：提供一种用于将热管的蒸发部分埋入导热座中的调平方法，用于通过将热管的蒸发部分形成为平坦表面的同时使热管和导热座的蒸发部分形成为平坦表面，热管正在埋入导热座中。此外，与冲压机配合使用，调平方法是在不需要改变冲压模具的条件下，对热管的蒸发部进行多次压配。

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