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    • 12. 发明申请
    • METHOD FOR FORMING SEMICONDUCTOR FILM AND METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE
    • 形成半导体膜的方法和制造光电转换装置的方法
    • US20120052619A1
    • 2012-03-01
    • US13318259
    • 2010-04-28
    • Yasuaki IshikawaShinya HondaMakoto Higashikawa
    • Yasuaki IshikawaShinya HondaMakoto Higashikawa
    • H01L31/18H01L21/20
    • H01L31/204C23C16/22C23C16/515H01L31/1812Y02E10/50Y02P70/521
    • A method for forming a semiconductor film suitable for a practical photoelectric conversion device having favorable photoelectric conversion efficiency and adapted to volume production and increased substrate area, and a method for manufacturing a photoelectric conversion device including the semiconductor film are provided. The method for forming a semiconductor film manufactures the semiconductor film including amorphous structure by a plasma CVD method. The semiconductor film is an amorphous film of SiGe-based compound or a microcrystalline film of SiGe-based compound. The plasma CVD method controls bandgap in thickness direction of the semiconductor film by varying the ON or OFF time of electric power applied to generate a plasma and intermittently supplying the power. The ON time and OFF time of the power fall in a range where the duty ratio ON time/(ON time+OFF time)×100(%) is 10% or more and 50% or less.
    • 一种形成适合于具有良好的光电转换效率并且适于批量生产和增加的衬底面积的实用光电转换装置的半导体膜的方法,以及一种制造包括该半导体膜的光电转换装置的方法。 形成半导体膜的方法通过等离子体CVD法制造包括非晶结构的半导体膜。 半导体膜是SiGe系化合物的非晶质膜或SiGe系化合物的微晶膜。 等离子体CVD法通过改变施加的电力的导通或截止时间来产生等离子体并间歇地供电,来控制半导体膜的厚度方向的带隙。 功率的ON时间和OFF时间落在占空比ON时间/(ON时间+ OFF时间)×100(%)为10%以上且50%以下的范围内。
    • 16. 发明申请
    • REFLECTION TYPE DISPLAY APPARATUS
    • 反射型显示装置
    • US20100020386A1
    • 2010-01-28
    • US12500288
    • 2009-07-09
    • Hajime IkedaMakoto Higashikawa
    • Hajime IkedaMakoto Higashikawa
    • G02F1/19
    • G02F1/1506
    • A reflection type display apparatus wherein an electroplating is used to modulate light, at least one of a reflectance and an absorptance of a first surface, which contacts the first electrode, of an electroplating film 10 formed on the first electrode 2 and that of a second surface, which does not contact the second electrode, of the electroplating film 10 formed on the second electrode 4 are different. When the electroplating film 10 is formed on the first electrode 2, reflection light from the first surface is used for displaying. When the electroplating film 10 is formed on the second electrode 4, reflection light from the second surface is used for displaying.
    • 一种反射型显示装置,其中使用电镀来调制光,形成在第一电极2上的电镀膜10的第一表面的接触第一电极的第一表面的反射率和吸收率中的至少一个, 形成在第二电极4上的电镀膜10不接触第二电极的表面是不同的。 当电镀膜10形成在第一电极2上时,来自第一表面的反射光被用于显示。 当电镀膜10形成在第二电极4上时,来自第二表面的反射光被用于显示。
    • 17. 发明授权
    • Method of forming semiconductor device
    • 半导体器件形成方法
    • US07071081B2
    • 2006-07-04
    • US10834836
    • 2004-04-30
    • Makoto Higashikawa
    • Makoto Higashikawa
    • H01L21/20
    • H01L31/206H01L31/076H01L31/202Y02E10/548Y02P70/521
    • The present invention provides a method of forming a semiconductor device that has a plurality of pin junctions comprising silicon films formed on a substrate by using a radio-frequency plasma CVD method, including: forming a first semiconductor layer; covering a surface of the first semiconductor layer with a member containing water with a content of 0.01 to 0.5 wt % so as to contact each other; removing the member; and forming a second semiconductor layer on the first semiconductor layer. According to the present invention, it is possible to efficiently form a semiconductor device having a multi-layer structure where a number of silicon thin films are laminated, to form a semiconductor device having less variation in characteristics among lots and having more excellent uniformity and characteristics, and to provide a semiconductor device excelling in adhesion and environmental resistance.
    • 本发明提供了一种形成半导体器件的方法,该半导体器件具有通过使用射频等离子体CVD法在衬底上形成的包含硅膜的多个引脚接头,包括:形成第一半导体层; 用含有0.01〜0.5重量%含水量的构件覆盖第一半导体层的表面,以便彼此接触; 删除该成员; 以及在所述第一半导体层上形成第二半导体层。 根据本发明,可以有效地形成具有层叠多个硅薄膜的多层结构的半导体器件,以形成具有较少的批次之间的变化的半导体器件,并具有更优异的均匀性和特性 并且提供了优异的粘合性和耐环境性的半导体器件。
    • 20. 发明授权
    • Reflection type display apparatus
    • 反射型显示装置
    • US07876490B2
    • 2011-01-25
    • US12500288
    • 2009-07-09
    • Hajime IkedaMakoto Higashikawa
    • Hajime IkedaMakoto Higashikawa
    • G02F1/03G09G3/38B28B7/36
    • G02F1/1506
    • A reflection type display apparatus using an electroplating for modulating light includes a first electrode, a second electrode, and an electrolyte solution arranged between the first and second electrodes. A first electroplating is formed from the electrolyte solution onto the first electrode by setting a first direction of current flowing between the first and second electrodes, and a second electroplating is formed from the electrolyte solution onto the second electrode by setting a second direction of current flowing between the first and second electrodes. A first surface of the first electroplating is formed on the first electrode such that the first electroplating contacts the first electrode through the first surface and is different in at least one of a light reflectance and a light absorptance from a second surface of the second electroplating formed on the second electrode such that the second electroplating does not contact the second electrode through the second surface. Displaying is performed by a reflection light from the first surface in case that the first electroplating is formed on the first electrode, while a displaying is performed by a reflection light from the second surface in case that the second electroplating is formed on the second electrode.
    • 使用用于调制光的电镀的反射型显示装置包括第一电极,第二电极和布置在第一和第二电极之间的电解质溶液。 通过设置在第一和第二电极之间流动的电流的第一方向,通过设置电流流过第二电流方向的电解液将电解液形成第一电镀到第一电极上。 在第一和第二电极之间。 第一电镀的第一表面形成在第一电极上,使得第一电镀通过第一表面接触第一电极,并且在形成的第二电镀的第二表面的光反射率和光吸收率中的至少一个方面不同 在第二电极上使得第二电镀不通过第二表面接触第二电极。 在第一电镀形成在第一电极上的情况下,来自第一表面的反射光进行显示,而在第二电极上形成第二电镀的情况下,来自第二表面的反射光进行显示。