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    • 11. 发明授权
    • Nonvolatile semiconductor memory device and method of manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • US08546872B2
    • 2013-10-01
    • US13072366
    • 2011-03-25
    • Kiwamu SakumaAtsuhiro Kinoshita
    • Kiwamu SakumaAtsuhiro Kinoshita
    • H01L29/792
    • H01L29/792H01L27/11524H01L27/11551H01L29/7881
    • According to one embodiment, a memory device includes a semiconductor substrate, first, second, third and fourth fin-type stacked layer structures, each having memory strings stacked in a first direction perpendicular to a surface of the semiconductor substrate, and each extending to a second direction parallel to the surface of the semiconductor substrate, a first part connected to first ends in the second direction of the first and second fin-type stacked layer structures each other, a second part connected to first ends in the second direction of the third and fourth fin-type stacked layer structures each other, a third part connected to second ends in the second direction of the first and third fin-type stacked layer structures each other, and a fourth part connected to second ends in the second direction of the second and fourth fin-type stacked layer structures each other.
    • 根据一个实施例,存储器件包括半导体衬底,第一,第二,第三和第四鳍式堆叠层结构,每个具有堆叠在垂直于半导体衬底的表面的第一方向上的存储串,并且每个延伸到 第二方向平行于半导体衬底的表面,第一部分连接到第一和第二鳍式堆叠层的第二方向上的第一端彼此结合,第二部分连接到第三端的第二端 第四鳍状堆叠层结构,第三部分与第一和第三鳍状堆叠层的第二方向的第二端部连接,第四部分与第二鳍片状堆叠层的第二方向的第二端部连接, 第二和第四鳍式堆叠层结构。
    • 12. 发明授权
    • Nonvolatile semiconductor memory device and method of manufacturing the same
    • 非易失性半导体存储器件及其制造方法
    • US08513725B2
    • 2013-08-20
    • US13236734
    • 2011-09-20
    • Kiwamu SakumaAtsuhiro Kinoshita
    • Kiwamu SakumaAtsuhiro Kinoshita
    • H01L29/78H01L21/28
    • H01L27/11578H01L27/11519H01L27/11524H01L27/11551H01L27/11565H01L29/785H01L29/792
    • According to one embodiment, a memory device includes first and second fin type stacked structures each includes first to i-th memory strings (i is a natural number except 1) that are stacked in a first direction, the first and second fin type stacked structures which extend in a second direction and which are adjacent in a third direction, a first portion connected to one end in the second direction of the first fin type stacked structure, a width in the third direction of the first portion being greater than a width in the third direction of the first fin type stacked structure, and a second portion connected to one end in the second direction of the second fin type stacked structure, a width in the third direction of the second portion being greater than a width in the third direction of the second fin type stacked structure.
    • 根据一个实施例,存储器件包括第一和第二鳍式堆叠结构,每个第一和第二鳍式堆叠结构每个包括沿第一方向堆叠的第一至第i存储器串(i是除1之外的自然数),第一和第二鳍式堆叠结构 其在第二方向上延伸并且在第三方向上相邻,第一部分连接到第一鳍式堆叠结构的第二方向上的一端,第一部分的第三方向上的宽度大于第一方向上的宽度 第一鳍式堆叠结构的第三方向和与第二鳍式堆叠结构的第二方向的一端连接的第二部分,第二部分的第三方向上的宽度大于第三方向上的宽度 的第二鳍式堆叠结构。
    • 18. 发明授权
    • Nonvolatile programmable switches
    • 非易失性可编程开关
    • US08829594B2
    • 2014-09-09
    • US13469867
    • 2012-05-11
    • Kosuke TatsumuraKiwamu SakumaKoichiro ZaitsuMari Matsumoto
    • Kosuke TatsumuraKiwamu SakumaKoichiro ZaitsuMari Matsumoto
    • H01L29/792
    • H01L29/792G11C16/0441H01L27/11568H01L29/66833
    • A nonvolatile programmable switch according to an embodiment includes: a first nonvolatile memory transistor including a first to third terminals connected to a first to third interconnects respectively; a second nonvolatile memory transistor including a fourth terminal connected to a fourth interconnect, a fifth terminal connected to the second interconnect, and a sixth terminal connected to the third interconnect, the first and second nonvolatile memory transistors having the same conductivity type; and a pass transistor having a gate electrode connected to the second interconnect. When the first and fourth interconnects are connected to a first power supply while the third interconnect is connected to a second power supply having a higher voltage than that of the first power supply, a threshold voltage of the first nonvolatile memory transistor increases, and a threshold voltage of the second nonvolatile memory transistor decreases.
    • 根据实施例的非易失性可编程开关包括:第一非易失性存储晶体管,包括分别连接到第一至第三互连的第一至第三端子; 第二非易失性存储晶体管,包括连接到第四互连的第四端子,连接到第二互连的第五端子和连接到第三互连件的第六端子,具有相同导电类型的第一和第二非易失性存储器晶体管; 以及具有连接到第二互连的栅电极的传输晶体管。 当第一和第四互连连接到第一电源,而第三互连连接到具有比第一电源的电压更高的电压的第二电源时,第一非易失性存储晶体管的阈值电压增加,阈值 第二非易失性存储晶体管的电压降低。
    • 20. 发明申请
    • NONVOLATILE PROGRAMMABLE SWITCHES
    • 非易失性可编程开关
    • US20130134499A1
    • 2013-05-30
    • US13469867
    • 2012-05-11
    • Kosuke TATSUMURAKiwamu SakumaKoichiro ZaitsuMari Matsumoto
    • Kosuke TATSUMURAKiwamu SakumaKoichiro ZaitsuMari Matsumoto
    • H01L29/792
    • H01L29/792G11C16/0441H01L27/11568H01L29/66833
    • A nonvolatile programmable switch according to an embodiment includes: a first nonvolatile memory transistor including a first to third terminals connected to a first to third interconnects respectively; a second nonvolatile memory transistor including a fourth terminal connected to a fourth interconnect, a fifth terminal connected to the second interconnect, and a sixth terminal connected to the third interconnect, the first and second nonvolatile memory transistors having the same conductivity type; and a pass transistor having a gate electrode connected to the second interconnect. When the first and fourth interconnects are connected to a first power supply while the third interconnect is connected to a second power supply having a higher voltage than that of the first power supply, a threshold voltage of the first nonvolatile memory transistor increases, and a threshold voltage of the second nonvolatile memory transistor decreases.
    • 根据实施例的非易失性可编程开关包括:第一非易失性存储晶体管,包括分别连接到第一至第三互连的第一至第三端子; 第二非易失性存储晶体管,包括连接到第四互连的第四端子,连接到第二互连的第五端子和连接到第三互连件的第六端子,具有相同导电类型的第一和第二非易失性存储器晶体管; 以及具有连接到第二互连的栅电极的传输晶体管。 当第一和第四互连连接到第一电源,而第三互连连接到具有比第一电源的电压更高的电压的第二电源时,第一非易失性存储晶体管的阈值电压增加,阈值 第二非易失性存储晶体管的电压降低。