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11. 发明申请

US20090084602A1 AUTOMOTIVE ELECTRIC/ELECTRONIC PACKAGE 审中-公开
标题翻译：汽车电子/电子包装
公开(公告)号：US20090084602A1
公开(公告)日：2009-04-02
申请号：US12236858
申请日：2008-09-24
申请人： Kenichi Fukuda , Mikio Shiono
发明人： Kenichi Fukuda , Mikio Shiono
IPC分类号： H05K5/03
CPC分类号： H01L23/26 , C08G65/007 , C08G65/336 , C08G2650/48 , C08L71/02 , C09J171/02 , G01D11/245 , H01L23/10 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/16195 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： In an automotive electric/electronic package comprising an electronic component, a case for receiving the electronic component therein, and a lid covering an open top of the case, the case and the lid are joined together with a fluorochemical adhesive capable of chemically and/or physically adsorbing a corrosive gas. The package has highly reliable corrosion resistance in that the electronic component is protected from corrosion by corrosive acidic or basic gases such as sulfur compound and nitrogen oxide gases.
摘要翻译：在包括电子部件的汽车电气/电子包装，用于在其中接收电子部件的壳体和覆盖壳体的开口顶部的盖子中，壳体和盖子与能够化学和/或物理吸附腐蚀性气体。该封装具有高度可靠的耐腐蚀性，因为电子元件不受腐蚀性酸性或碱性气体如硫化合物和氮氧化物气体的腐蚀。

12. 发明授权

US07083684B2 Method of removing sealant used for the protection of electric or electronic part 失效
标题翻译：去除用于保护电气或电子部件的密封剂的方法
公开(公告)号：US07083684B2
公开(公告)日：2006-08-01
申请号：US10834262
申请日：2004-04-29
申请人： Kenichi Fukuda , Mikio Shiono
发明人： Kenichi Fukuda , Mikio Shiono
IPC分类号： B08B3/00
CPC分类号： H01L21/31133 , G01R31/2898 , H01L2224/48091 , H01L2224/48471 , H01L2224/8592 , H01L2924/00014
摘要： A sealant used for the protection of an electric or electronic part is removed by contacting the sealant with tetramethylammonium hydroxide, tetrabutylammonium fluoride or the like for thereby dissolving the sealant. The method is capable of removing only the protective sealant from the electric or electronic part without causing damage to other components of the part.
摘要翻译：通过使密封剂与四甲基氢氧化铵，四丁基氟化铵等接触以除去用于保护电气或电子部件的密封剂，从而溶解密封剂。该方法只能从电气或电子部件中除去保护性密封剂，而不会损坏部件的其他部件。

13. 发明授权

US06844632B2 Semiconductor pressure sensor device protected with perfluoropolyether gel 有权
标题翻译：用全氟聚醚凝胶保护的半导体压力传感器装置
公开(公告)号：US06844632B2
公开(公告)日：2005-01-18
申请号：US10614983
申请日：2003-07-09
申请人： Mikio Shiono , Kenichi Fukuda
发明人： Mikio Shiono , Kenichi Fukuda
IPC分类号： C08K3/36 , C08K5/541 , C08L71/02 , C08L83/05 , G01L9/00 , H01L29/84 , H01L23/29
CPC分类号： G01L19/147 , H01L2224/48091 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014
摘要： In a semiconductor pressure sensor device comprising a housing (1) having a cavity (3), a semiconductor sensor chip (2) mounted within the cavity, leads (4) for conveying pressure detection signals, and bonding wires (6) electrically connecting the sensor chip and the leads, a sensitive portion (2a) of sensor chip (2), leads (4) and bonding wires (6) are covered with an electrically insulating fluorochemical gel material which has a penetration of 30-60 according to JIS K2220, a Tg of up to −45° C., and a degree of saturation swelling in gasoline at 23° C. of up to 7% by weight. The sensor device is improved in operation reliability and durability life.
摘要翻译：在包括具有空腔（3）的壳体（1）和安装在腔体内的半导体传感器芯片（2）的半导体压力传感器装置中，用于输送压力检测信号的引线（4）和电连接传感器芯片和引线，传感器芯片（2）的敏感部分（2a），引线（4）和接合线（6）被根据JIS K2220的渗透率为30-60的电绝缘含氟凝胶材料覆盖，Tg高达-45℃，在23℃下汽油饱和度达7％（重量）。传感器装置的运行可靠性和耐用寿命得到改善。

14. 发明授权

US06828360B2 Thixotropic fluorinated curable compositions and articles sealed therewith 有权
标题翻译：触变性氟化可固化组合物和用其密封的制品
公开(公告)号：US06828360B2
公开(公告)日：2004-12-07
申请号：US10322454
申请日：2002-12-19
申请人： Kenichi Fukuda , Mikio Shiono
发明人： Kenichi Fukuda , Mikio Shiono
IPC分类号： C08K906
CPC分类号： C09D151/003 , C08F259/08 , C08F283/00 , C08F290/06 , C08G65/007 , C08G65/336 , C08K3/36 , C08L51/003 , C08L2666/02 , C08L2666/14 , C09J151/003
摘要： In fluorinated curable compositions comprising alkenyl group-bearing perfluoropolyethers as the base polymer to ensure chemical resistance and solvent resistance together with an organohydrogensiloxane and a platinum group metal catalyst, a hydrophobized silica fine powder is used in combination therewith to render the compositions thixotropic.
摘要翻译：在包含含烯基的全氟聚醚作为基础聚合物的含氟可固化组合物中，与有机氢硅氧烷和铂族金属催化剂一起确保耐化学性和耐溶剂性，与其组合使用疏水化二氧化硅细粉以使组合物触变。

15. 发明授权

US08119760B2 Curable perfluoropolyether compositions and rubber or gel articles comprising the same 有权
标题翻译：可固化的全氟聚醚组合物和包含其的橡胶或凝胶制品
公开(公告)号：US08119760B2
公开(公告)日：2012-02-21
申请号：US12468721
申请日：2009-05-19
申请人： Kenichi Fukuda , Mikio Shiono , Hirofumi Kishita
发明人： Kenichi Fukuda , Mikio Shiono , Hirofumi Kishita
IPC分类号： C08G77/24
CPC分类号： C08K5/5406 , C08K3/36 , C08L71/02 , C08L83/00
摘要： Perfluoropolyether compositions are provided comprising: (A) a linear perfluoropolyether compound containing at least two alkenyl groups, having a perfluoropolyether structure comprising recurring units —CaF2aO— in its backbone, and having a molecular weight of 10,000 to 100,000; (B) an organosilicon compound containing at least two silicon atom-bonded hydrogen atoms; (C) a reinforcing filler; (D) a hydrosilylation catalyst; and (E) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone. The compositions cure into rubber or gel products having improved acid resistance.
摘要翻译：提供了全氟聚醚组合物，其包含：（A）包含至少两个烯基的直链全氟聚醚化合物，其全氟聚醚结构在其主链中包含重复单元-CaF 2，其分子量为10,000至100,000; （B）含有至少两个与硅原子键合的氢原子的有机硅化合物; （C）增强填料; （D）氢化硅烷化催化剂; 和（E）在其主链中含有一个烯基并具有全氟聚醚结构的多氟单链烯基化合物。组合物固化成具有改善的耐酸性的橡胶或凝胶产品。

16. 发明申请

US20090292096A1 CURABLE PERFLUOROPOLYETHER COMPOSITIONS AND RUBBER OR GEL ARTICLES COMPRISING THE SAME 有权
标题翻译：可固化的全氟聚醚组合物和包含其的橡胶或凝胶制品
公开(公告)号：US20090292096A1
公开(公告)日：2009-11-26
申请号：US12468721
申请日：2009-05-19
申请人： Kenichi FUKUDA , Mikio Shiono , Hirofumi Kishita
发明人： Kenichi FUKUDA , Mikio Shiono , Hirofumi Kishita
IPC分类号： C08G77/12
CPC分类号： C08K5/5406 , C08K3/36 , C08L71/02 , C08L83/00
摘要： Perfluoropolyether compositions are provided comprising: (A) a linear perfluoropolyether compound containing at least two alkenyl groups, having a perfluoropolyether structure comprising recurring units —CaF2aO— in its backbone, and having a molecular weight of 10,000 to 100,000; (B) an organosilicon compound containing at least two silicon atom-bonded hydrogen atoms; (C) a reinforcing filler; (D) a hydrosilylation catalyst; and (E) a polyfluoromonoalkenyl compound containing one alkenyl group and having a perfluoropolyether structure in its backbone. The compositions cure into rubber or gel products having improved acid resistance.
摘要翻译：提供了全氟聚醚组合物，其包含：（A）含有至少两个烯基的直链全氟聚醚化合物，其全氟聚醚结构包含其主链中的重复单元-CaF 2，其分子量为10,000至100,000; （B）含有至少两个与硅原子键合的氢原子的有机硅化合物; （C）增强填料; （D）氢化硅烷化催化剂; 和（E）在其主链中含有一个烯基并具有全氟聚醚结构的多氟单链烯基化合物。组合物固化成具有改善的耐酸性的橡胶或凝胶产品。

17. 发明申请

US20050077533A1 Semiconductor package 审中-公开
标题翻译：半导体封装
公开(公告)号：US20050077533A1
公开(公告)日：2005-04-14
申请号：US10959133
申请日：2004-10-07
申请人： Kenichi Fukuda , Mikio Shiono
发明人： Kenichi Fukuda , Mikio Shiono
IPC分类号： C08L71/00 , C08F290/06 , C08K5/54 , C08L83/04 , H01L23/29 , H01L23/31 , H01L29/24 , H01L21/00
CPC分类号： C08L71/02 , C08G77/12 , C08G77/14 , C08G77/18 , C08L83/04 , H01L23/296 , H01L23/3121 , H01L23/3157 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48992 , H01L2224/73265 , H01L2224/8592 , H01L2924/00014 , H01L2924/01012 , H01L2924/01019 , H01L2924/0102 , H01L2924/01046 , H01L2924/01055 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , C08L83/00 , C08L2666/14 , H01L2924/00 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor package comprises a semiconductor chip, leads, and bonding wires wherein at least portions of the chip, bonding wires and leads are covered and protected with an electrically insulating fluorochemical material which is a cured product of a curable composition comprising (A) a polyfluorodialkenyl compound comprising —(CF(CF3)—CF2—O)— units and having alkenyl groups at both ends of its molecular chain, (B) an organohydrogenpolysiloxane having at least two Si—H groups, and (C) a platinum group metal catalyst.
摘要翻译：半导体封装包括半导体芯片，引线和接合线，其中芯片，接合线和引线的至少一部分被电绝缘含氟化合物材料覆盖和保护，所述电绝缘含氟材料是可固化组合物的固化产物，其包含（A）多氟二烯基包含 - （CF（CF 3）-CF 2 -O） - 单元并且在其分子链的两端具有烯基的化合物，（B）具有至少两个Si-H基团的有机氢聚硅氧烷，和（C）铂族金属催化剂。

18. 发明授权

US06673876B2 Fluorinated curable compositions 有权
标题翻译：氟化可固化组合物
公开(公告)号：US06673876B2
公开(公告)日：2004-01-06
申请号：US10077989
申请日：2002-02-20
申请人： Kenichi Fukuda , Mikio Shiono
发明人： Kenichi Fukuda , Mikio Shiono
IPC分类号： C08L8305
CPC分类号： C08G65/007 , C08G65/336
摘要： A fluorinated curable composition in which a fluorinated organohydrogensiloxane as the curing agent is well compatible with a linear polyfluoro compound as the base yields a cured gel having good adhesion to substrates and improved chemical and solvent resistance.
摘要翻译：其中作为固化剂的氟化有机氢硅氧烷与作为碱的线性多氟化合物良好相容的氟化可固化组合物产生具有对基材的良好粘附性和改善的耐化学性和耐溶剂性的固化凝胶。

19. 发明授权

US06500976B2 Organosilicon compounds 有权
标题翻译：有机硅化合物
公开(公告)号：US06500976B2
公开(公告)日：2002-12-31
申请号：US09970685
申请日：2001-10-05
申请人： Takashi Matsuda , Mikio Shiono , Kenichi Fukuda
发明人： Takashi Matsuda , Mikio Shiono , Kenichi Fukuda
IPC分类号： C07F708
CPC分类号： C07F7/0896
摘要： Organosilicon compounds each having in a molecule (A) a perfluoroalkyl group of at least 3 carbon atoms which may be separated by an etheric oxygen atom, (B) a monovalent hydrocarbon group containing a carboxylic acid anhydride structure, and (C) a hydrosilyl (SiH) group are novel and added to thermosetting elastomer compositions as adhesion aids whereby the compositions are improved in adhesion to various materials including metals, alloys, plastics, and ceramics.
摘要翻译：在（A）分子中具有至少3个碳原子的全氟烷基的有机硅化合物可以被醚性氧原子分离，（B）含有羧酸酐结构的一价烃基，和（C）氢化硅烷基（ SiH）基团是新型的，并且添加到热固性弹性体组合物中作为粘合助剂，由此组合物对包括金属，合金，塑料和陶瓷在内的各种材料的粘合性提高。

20. 发明授权

US06425294B1 Pressure sensor unit 有权
标题翻译：压力传感器单元
公开(公告)号：US06425294B1
公开(公告)日：2002-07-30
申请号：US09574259
申请日：2000-05-19
申请人： Mikio Shiono , Kenichi Fukuda
发明人： Mikio Shiono , Kenichi Fukuda
IPC分类号： G01L700
CPC分类号： G01L19/147 , G01L19/0038 , G01L19/0627 , H01L2224/48091 , H01L2224/73265 , H01L2924/181 , Y10T428/31511 , Y10T428/3154 , Y10T428/31544 , Y10T428/31663 , H01L2924/00012 , H01L2924/00014
摘要： A pressure sensor unit which comprises (i) a housing, (ii) pressure sensor members installed therein including a mount, the bottom of which is fixed to the inner base of the housing by means of an adhesive, a sensor chip firmly bonded to the top of the mount, terminals disposed on the inner base of the housing and bonding wires connecting the sensor chip to their respective terminals, and (iii) a sealant filling the housing so that all the pressure sensor members are completely buried therein; with the terminals being covered with a fluorinated polymer-containing composition functioning as adhesive in at least an upper part thereof and with the sealant being a fluorinated polymer-containing gel material, wherein the composition as adhesive is similar in fluorinated polymer to the gel material.
摘要翻译：一种压力传感器单元，包括（i）壳体，（ii）安装在其中的压力传感器构件，其包括安装件，其底部通过粘合剂固定到壳体的内部基座，传感器芯片牢固地结合到安装座的顶部，设置在壳体的内底部的端子和将传感器芯片连接到它们各自的端子的接合线，以及（iii）填充壳体的密封剂，使得所有的压力传感器构件完全埋入其中; 端子被至少在其上部作为粘合剂起作用的含氟聚合物的组合物覆盖，并且密封剂是含氟聚合物的凝胶材料，其中作为粘合剂的组合物在氟化聚合物中与凝胶材料相似。

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