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11. 发明申请

US20050051437A1 Plating apparatus and plating method 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20050051437A1
公开(公告)日：2005-03-10
申请号：US10932126
申请日：2004-09-02
申请人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Tsutomu Nakada
发明人： Keiichi Kurashina , Mizuki Nagai , Satoru Yamamoto , Hiroyuki Kanda , Koji Mishima , Tsutomu Nakada
IPC分类号： B05D5/12 , C25D5/00 , C25D7/12 , C25D17/00 , H01L21/288 , H01L21/768
CPC分类号： C25D7/123 , C25D5/003 , C25D17/001 , C25D17/002 , H01L21/2885 , H01L21/76877
摘要： A plating apparatus is used for filling a fine interconnect pattern formed in the substrate with metal to form interconnects. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a sealing member for contacting a peripheral portion of a surface, to be plated, of the substrate held by said substrate holder to seal said peripheral portion water-tightly, and a cathode for contacting the substrate to supply current to the substrate, an anode vertically movably disposed so as to face the surface, to be plated, of the substrate, and a porous member disposed between said anode and the surface, to be plated, of the substrate, said porous member being made of a water-retentive material, wherein said porous member has at least a hydrophilic substrate-facing surface which faces the surface, to be plated, of the substrate.
摘要翻译：电镀装置用于用金属填充形成在衬底中的精细互连图案以形成互连。电镀装置包括用于保持基板的基板保持件，阴极部分，其包括用于接触由所述基板保持器保持的基板的要被电镀的表面的周边部分的密封构件，以密封所述周边部分的水密性;以及阴极，用于接触基板以向基板提供电流;阳极，其可垂直移动地设置成面对要被电镀的基板;以及多孔构件，设置在所述阳极和要被电镀的表面之间，所述多孔构件由保水材料制成，其中所述多孔构件至少具有面向要被电镀的表面的亲水性基底面向表面。

12. 发明申请

US20050023149A1 Plating apparatus, plating method and substrate processing apparatus 审中-公开
标题翻译：电镀装置，电镀方法和基板处理装置
公开(公告)号：US20050023149A1
公开(公告)日：2005-02-03
申请号：US10860115
申请日：2004-06-04
申请人： Tsutomu Nakada , Junji Kunisawa , Hiroyuki Kanda , Mizuki Nagai , Satoru Yamamoto , Koji Mishima , Shinya Morisawa , Seiji Katsuoka , Natsuki Makino , Yukio Fukunaga
发明人： Tsutomu Nakada , Junji Kunisawa , Hiroyuki Kanda , Mizuki Nagai , Satoru Yamamoto , Koji Mishima , Shinya Morisawa , Seiji Katsuoka , Natsuki Makino , Yukio Fukunaga
IPC分类号： C25D5/00 , C25D7/12 , C25D17/06
CPC分类号： C25D17/001 , C25D7/123 , C25D17/06
摘要： The present invention provides a plating apparatus which uses an insoluble anode and which can perform plating of a substrate stably while preventing oxygen gas, generated due to the use of the insoluble anode, from causing defects in the substrate. The plating apparatus includes: a substrate holder for holding a substrate; a cathode section including a seal ring for contacting a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder to seal the peripheral portion water-tightly, and a cathode for contacting the substrate to supply current to the substrate; a vertically-movable electrode head provided above the cathode section, including an anode chamber housing an anode made of an insoluble material and having a bottom opening closed with a water-permeable porous member; a plating solution injection section for injecting a plating solution between the anode and the surface, to be plated, of the substrate held by the substrate holder; a power source for applying a plating voltage between the cathode and the anode; and a gas discharge line for discharging a gas from the anode chamber.
摘要翻译：本发明提供一种电镀装置，其使用不溶性阳极，并且可以在防止由于使用不溶性阳极而产生的氧气导致基板中的缺陷的同时稳定地进行基板的电镀。电镀装置包括：用于保持基板的基板保持件; 阴极部分，包括用于接触被基板保持器保持的基板的周边部分的密封环，以密封周边部分，以及用于接触基板以向基板供应电流的阴极 ; 设置在所述阴极部分上方的可垂直移动的电极头，包括容纳由不溶性材料制成的阳极并且具有用透水性多孔构件封闭的底部开口的阳极室; 电镀溶液注入部，用于在被基板保持器保持的基板的阳极和要被电镀的表面之间注入电镀液; 用于在阴极和阳极之间施加电镀电压的电源; 以及用于从阳极室排出气体的气体排出管线。

13. 发明授权

US08029653B2 Electroplating apparatus and electroplating method 有权
标题翻译：电镀设备和电镀方法
公开(公告)号：US08029653B2
公开(公告)日：2011-10-04
申请号：US11708548
申请日：2007-02-21
申请人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
发明人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
IPC分类号： C25D17/00
CPC分类号： C25D17/001 , C25D5/18 , C25D7/123 , C25D17/004 , C25D17/008 , C25D17/12 , H01L21/6723
摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.
摘要翻译：电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的电镀电流。

14. 发明申请

US20090020434A1 Substrate processing method and substrate processing apparatus 审中-公开
标题翻译：基板处理方法和基板处理装置
公开(公告)号：US20090020434A1
公开(公告)日：2009-01-22
申请号：US12216224
申请日：2008-07-01
申请人： Akira Susaki , Tsutomu Nakada , Satoru Yamamoto , Keiichi Kurashina , Hiroyuki Kanda
发明人： Akira Susaki , Tsutomu Nakada , Satoru Yamamoto , Keiichi Kurashina , Hiroyuki Kanda
IPC分类号： C25D3/58 , C25D3/38 , C25D17/00
CPC分类号： C25D3/38 , C25D5/10 , C25D5/34 , C25D17/001 , C25D21/00 , C25D21/12 , H01L21/2885 , H01L21/67005 , H01L21/67051 , H01L21/6715 , H01L21/68728 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： A substrate processing method makes it possible to fill interconnect recesses, such as trenches, with a defect-free interconnect material by carrying out electroplating directly on a surface of a ruthenium film as a barrier layer. The substrate processing method comprises: providing a substrate having interconnect recesses formed in a substrate surface and having a ruthenium film formed in the entire substrate surface including interior surfaces of the interconnect recesses; keeping the substrate surface in contact with a plating solution for a predetermined time to adsorb an additive in the plating solution onto the ruthenium film, and then carrying out electroplating to form a conductive film on a surface of the ruthenium film.
摘要翻译：基板处理方法可以通过在作为阻挡层的钌膜的表面上直接进行电镀而用无缺陷的互连材料填充诸如沟槽的互连凹槽。基板处理方法包括：提供具有形成在基板表面中的互连凹槽并且在包括互连凹槽的内表面的整个基板表面中形成的钌膜的基板; 保持基板表面与电镀液接触预定的时间，以将镀液中的添加剂吸附到钌膜上，然后进行电镀以在钌膜的表面上形成导电膜。

15. 发明申请

US20080029398A1 Electroplating apparatus and electroplating method 有权
标题翻译：电镀设备和电镀方法
公开(公告)号：US20080029398A1
公开(公告)日：2008-02-07
申请号：US11708548
申请日：2007-02-21
申请人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
发明人： Satoru Yamamoto , Keiichi Kurashina , Takashi Kawakami , Tsutomu Nakada , Hiroyuki Kanda , Junji Kunisawa , Kunihito Ide
IPC分类号： C25D5/00 , C25D17/00
CPC分类号： C25D17/001 , C25D5/18 , C25D7/123 , C25D17/004 , C25D17/008 , C25D17/12 , H01L21/6723
摘要： An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper. The electroplating apparatus includes: a substrate holder for holding a substrate; a sealing member for contact with a peripheral portion of a surface of a substrate, held by the substrate holder, to seal the peripheral portion; a cathode contact for contact with a conductive layer formed in the surface of the substrate, held by the substrate holder, to feed electricity to the conductive layer; and a housing having therein an anode to be immersed in a plating solution, and a porous structure disposed at an open end facing the substrate held by the substrate holder, said porous structure defining a plating chamber in the housing; wherein the plating chamber is divided into rooms by a partition plate and the porous structure, and the anode is comprised of a plurality of divided anodes, each divided anode being disposed in each room of the plating chamber so that each divided anode can pass an independent plating current.
摘要翻译：电镀装置可以在具有等于或高于铜的导电层（种子层）的基板的整个表面上形成具有更均匀的厚度和更好的膜质量的镀膜。电镀装置包括：用于保持基板的基板保持件; 密封构件，其与由所述基板保持件保持的基板的表面的周边部接触，以密封所述周边部; 阴极接触件，用于与由衬底保持器保持的衬底表面中形成的导电层接触，以将电力馈送到导电层; 以及壳体，其中具有要浸入电镀溶液中的阳极，以及设置在面向由所述基板保持件保持的所述基板的开口端的多孔结构，所述多孔结构在所述壳体中限定电镀室; 其特征在于，通过分隔板和多孔结构将电镀室分为室，阳极由多个分开的阳极组成，每个分隔的阳极设置在电镀室的每个房间中，使得每个分隔的阳极可以通过独立的电镀电流。

16. 发明申请

US20050051434A1 Method and apparatus for controlling electrolytic solution 审中-公开
标题翻译：电解液控制方法及装置
公开(公告)号：US20050051434A1
公开(公告)日：2005-03-10
申请号：US10933353
申请日：2004-09-03
申请人： Koji Mishima , Masao Hodai , Hiroyuki Kanda , Kunihito Ide , Satoru Yamamoto , Seiji Katsuoka , Masaaki Kinbara , Masaji Akahori , Sota Nakagawa
发明人： Koji Mishima , Masao Hodai , Hiroyuki Kanda , Kunihito Ide , Satoru Yamamoto , Seiji Katsuoka , Masaaki Kinbara , Masaji Akahori , Sota Nakagawa
IPC分类号： C25D21/16 , C25D21/12 , C25D21/18 , C25D21/22 , C25D21/06 , C25C7/00
CPC分类号： C25D21/12 , C25D21/22
摘要： An electrolytic solution control method can control the composition of an electrolytic solution efficiently with high precision, and can remove a partially decomposed product of an organic component from an electrolytic solution. The electrolytic solution control method includes storing an electrolytic solution containing an organic component and an inorganic component in an electrolytic solution storage tank while controlling and keeping the electrolytic solution at a predetermined composition, adjusting an inorganic component of the waste electrolytic solution after use in electrolytic processing in an electrolytic processing apparatus, and then returning the waste electrolytic solution to the electrolytic solution storage tank.
摘要翻译：电解液控制方法能够高精度地有效地控制电解液的组成，能够从电解液中除去有机成分的部分分解产物。电解液控制方法包括将电解液储存罐中含有有机成分和无机成分的电解液同时控制并保持电解液为规定的组成，在电解处理后调整废电解液的无机成分在电解处理装置中，然后将废电解液返回到电解液储罐。

17. 发明申请

US20070238265A1 Plating apparatus and plating method 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20070238265A1
公开(公告)日：2007-10-11
申请号：US11396572
申请日：2006-04-04
申请人： Keiichi Kurashina , Tsutomu Nakada , Takashi Kawakami , Satoru Yamamoto , Keisuke Hayabusa
发明人： Keiichi Kurashina , Tsutomu Nakada , Takashi Kawakami , Satoru Yamamoto , Keisuke Hayabusa
IPC分类号： C25D3/00 , B05C9/08 , B32B15/04
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution.
摘要翻译：电镀装置可以在基板的整个表面上形成具有更均匀厚度的镀膜，并且即使当基板在表面中具有高的薄层电阻时，也可以牢固地填充与金属的互连凹槽，而不会在嵌入的金属中形成空隙。电镀装置包括用于保持基板的基板保持器，包括用于与由基板保持器保持的基板接触的阴极以向基板供电的阴极部分，以及部分或全部具有高电阻的阳极，由衬底保持器保持的衬底的表面，其中在用电镀溶液填充阳极和由衬底保持器保持的衬底之间进行衬底的表面的电镀。

18. 发明申请

US20100163408A1 Plating apparatus and plating method 审中-公开
标题翻译：电镀装置及电镀方法
公开(公告)号：US20100163408A1
公开(公告)日：2010-07-01
申请号：US12659334
申请日：2010-03-04
申请人： Keiichi Kurashina , Tsutomu Nakada , Takashi Kawakami , Satoru Yamamoto , Keisuke Hayabusa
发明人： Keiichi Kurashina , Tsutomu Nakada , Takashi Kawakami , Satoru Yamamoto , Keisuke Hayabusa
IPC分类号： C25B9/00
CPC分类号： C25D7/123 , C25D17/001 , H01L21/2885 , H01L21/7684 , H01L21/76877
摘要： A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution.
摘要翻译：电镀装置可以在基板的整个表面上形成具有更均匀厚度的镀膜，并且即使当基板在表面中具有高的薄层电阻时，也可以牢固地填充与金属的互连凹槽，而不会在嵌入的金属中形成空隙。电镀装置包括用于保持基板的基板保持器，包括用于与由基板保持器保持的基板接触的阴极以向基板供电的阴极部分，以及部分或全部具有高电阻的阳极，由衬底保持器保持的衬底的表面，其中在用电镀溶液填充阳极和由衬底保持器保持的衬底之间进行衬底的表面的电镀。

19. 发明授权

US07947156B2 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US07947156B2
公开(公告)日：2011-05-24
申请号：US11907187
申请日：2007-10-10
申请人： Hiroyuki Kanda , Akira Susaki , Satoru Yamamoto , Tsutomu Nakada
发明人： Hiroyuki Kanda , Akira Susaki , Satoru Yamamoto , Tsutomu Nakada
IPC分类号： C25D17/00
CPC分类号： C25D5/34 , C25D7/12 , C25D17/001 , H01L21/02068 , H01L21/76861 , H01L21/76873
摘要： A substrate processing apparatus can carry out removal of a passive layer (ruthenium oxide) present on a surface of a ruthenium film and electroplating successively, and can reduce the terminal effect at the time of the removal of the passive layer (ruthenium oxide) from the ruthenium film. The substrate processing apparatus includes: an electrolytic processing apparatus for electrochemically removing a passive layer, formed on a surface of a ruthenium film on a substrate, by electrolytic processing with the ruthenium film as a cathode; a copper electroplating apparatus for carrying out copper electroplating on the surface of the ruthenium film on the substrate; and an apparatus frame housing the electrolytic processing apparatus and the copper electroplating apparatus.
摘要翻译：基板处理装置可以执行存在于钌膜表面上的钝化层（氧化钌）并依次电镀，并且可以降低在从钝化层（氧化钌）中除去时的终端效应钌膜。基板处理装置包括：电解处理装置，用于通过用钌膜作为阴极的电解处理在基板上的钌膜的表面上电化学去除钝化层; 用于在基板上的钌膜的表面上进行铜电镀的铜电镀装置; 以及容纳电解处理装置和铜电镀装置的装置框架。

20. 发明申请

US20080099340A1 Substrate processing apparatus and substrate processing method 有权
标题翻译：基板加工装置及基板处理方法
公开(公告)号：US20080099340A1
公开(公告)日：2008-05-01
申请号：US11907187
申请日：2007-10-10
申请人： Hiroyuki Kanda , Akira Susaki , Satoru Yamamoto , Tsutomu Nakada
发明人： Hiroyuki Kanda , Akira Susaki , Satoru Yamamoto , Tsutomu Nakada
IPC分类号： C25D5/34 , C25D17/00
CPC分类号： C25D5/34 , C25D7/12 , C25D17/001 , H01L21/02068 , H01L21/76861 , H01L21/76873
摘要： A substrate processing apparatus can carry out removal of a passive layer (ruthenium oxide) present on a surface of a ruthenium film and electroplating successively, and can reduce the terminal effect at the time of the removal of the passive layer (ruthenium oxide) from the ruthenium film. The substrate processing apparatus includes: an electrolytic processing apparatus for electrochemically removing a passive layer, formed on a surface of a ruthenium film on a substrate, by electrolytic processing with the ruthenium film as a cathode; a copper electroplating apparatus for carrying out copper electroplating on the surface of the ruthenium film on the substrate; and an apparatus frame housing the electrolytic processing apparatus and the copper electroplating apparatus.
摘要翻译：基板处理装置可以执行存在于钌膜表面上的钝化层（氧化钌）并依次电镀，并且可以降低在从钝化层（氧化钌）中除去时的终端效应钌膜。基板处理装置包括：电解处理装置，用于通过用钌膜作为阴极的电解处理在基板上的钌膜的表面上电化学去除钝化层; 用于在基板上的钌膜的表面上进行铜电镀的铜电镀装置; 以及容纳电解处理装置和铜电镀装置的装置框架。

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