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    • 12. 发明授权
    • Solid-state color-image sensor and process for fabricating the same
    • 固态彩色图像传感器及其制造方法
    • US4388128A
    • 1983-06-14
    • US242578
    • 1981-03-11
    • Kazufumi OgawaShigeru KondoYoshiko YasudaTaketoshi YonezawaIsamu Kitahiro
    • Kazufumi OgawaShigeru KondoYoshiko YasudaTaketoshi YonezawaIsamu Kitahiro
    • G03F7/00H01L31/0216B29C27/10B32B31/20H01L31/18
    • G03F7/0007H01L31/02162Y10T156/1074
    • In a step for bonding a color filter to a solid-state color-image sensor chip with an adhesive which is curable not only by light or more particularly ultraviolet-ray irradiation but also by heating, pre-curing or partial curing is effected by irradiating light rays after the color filter and the chip has been pressed against each other and correctly aligned with each other in a bonding device and then the chip with the partially-bonded color filter is removed from the bonding device and complete curing of the adhesive is accomplished by heating. According to one embodiment of the present invention the bonding step is carried out in an atmosphere containing the oxygen so that the adhesive which has been squeezed out from the space between the color filter and the clip may be prevented from being cured and subsequently removed in a simple manner. According to a further embodiment of the present invention, prior to the bonding step, the color filter and chip are covered with protective layers or films so that surface flaws may be avoided. Thus, the color filters can be bonded to the chips with a higher degree of accuracy and a higher degree of adhesive strength and the mass production of solid-state color-image sensors can be much facilitated.
    • 在将滤色器与固态彩色图像传感器芯片接合的步骤中,不仅可以通过光线或更具体的紫外线照射而固化,而且通过加热固化,固化或部分固化可以通过照射 在滤色器之后的光线和芯片已经在接合装置中彼此压靠并且彼此正确地对准,然后将具有部分粘合的滤色器的芯片从接合装置移除并完成粘合剂的完全固化 通过加热。 根据本发明的一个实施方案,粘合步骤在含有氧的气氛中进行,从而可以防止从滤色器和夹子之间的空间挤出的粘合剂被固化并随后在 简单的方式。 根据本发明的另一实施例,在接合步骤之前,滤色器和芯片被保护层或膜覆盖,从而可以避免表面缺陷。 因此,可以以更高的准确度和更高的粘合强度将滤色器结合到芯片,并且可以大大方便固态彩色图像传感器的批量生产。
    • 13. 发明授权
    • Polishing method
    • 抛光方法
    • US4358295A
    • 1982-11-09
    • US134635
    • 1980-03-27
    • Yoshiharu NambaTaketoshi Yonezawa
    • Yoshiharu NambaTaketoshi Yonezawa
    • B24B37/04B24B37/10B24B37/16C09K3/14G11B5/193G11B5/23
    • B24B37/107B24B37/048B24B37/16C09K3/1463G11B5/193G11B5/232
    • A polishing method suitable for use in working a surface of a magnetic material such as materials of magnetic head into a mirror-finished surface. The work is placed in a treating liquid cell such that its surface to be worked is opposed by the surface of a lap. The treating liquid contains fine polishing grains of magnesium oxide as the polishing agent, by an amount less than 4 wt %, and may contain 10 to 30 wt % of glycerol for increasing the viscosity. As a relative movement occurs between the work and the lap, the treating liquid forms a state of a dynamic-pressure bearing between the opposing surfaces of the work and lap, so that the surface of the work is polished into mirror surface by the action of the magnesium oxide without contacting the lap directly.
    • 一种适用于将诸如磁头材料的磁性材料的表面加工成镜面抛光表面的抛光方法。 工作被放置在处理液体池中,使得其被加工的表面与搭接的表面相对。 处理液含有作为抛光剂的氧化镁的精细抛光颗粒,其量小于4重量%,并且可以含有10-30重量%的甘油以提高粘度。 当工作和搭接之间发生相对运动时,处理液体在工件和搭接件的相对表面之间形成动态压力轴承的状态,使得工件的表面通过 氧化镁不直接接触圈。