会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 13. 发明授权
    • Solder paste for fastening semiconductors onto ceramic bases
    • 用于将半导体紧固到陶瓷基底上的焊膏
    • US4962066A
    • 1990-10-09
    • US483219
    • 1990-02-21
    • Karl-Anton StarzMathias MetznerWolfgang Weber
    • Karl-Anton StarzMathias MetznerWolfgang Weber
    • B23K35/22B23K35/30C03C8/24
    • C03C8/245B23K35/22B23K35/3006
    • A solder paste for fastening semiconductors onto ceramic bases in a temperature range below 380.degree. C., consisting essentially of (1) 75 to 90% by weight of a mixture of silver powder and a low-melting glass powder with the weight ratio of silver to glass being between 2:1 and 9:1 and (2) 10 to 25% by weight of an organic solvent which contains 1 to 10% by weight of a thermally readily decomposable resin, the glass powder consisting essentially of 75 to 85% by weight lead oxide, 8 to 15% by weight boron oxide, 0.5 to 10% by weight silver (I) oxide 0.5 to 10% by weight bismuth (III) oxide, 0 to 5% by weight silicon dioxide, 0 to 2% by weight aluminum oxide 0 to 2% by weight tin oxide, 0 to 2% by weight zinc oxide, the glass powder having a glass transition temperature (Tg) of 250.degree. to 300.degree. C.
    • 一种用于在380℃以下的温度范围内将半导体紧固到陶瓷基底上的焊膏,其基本上由(1)75至90重量%的银粉和低熔点玻璃粉末的混合物与银的重量比 至2:1至9:1之间的玻璃和(2)10至25重量%的含有1至10重量%热分解性树脂的有机溶剂,所述玻璃粉末基本上由75至85重量% 氧化铅为8〜15重量%,氧化硼为0.5〜10重量%,氧化银(I)0.5〜10重量%,氧化铋(III),0〜5重量%的二氧化硅,0〜2重量% 的氧化铝0〜2重量%,氧化锡0〜2重量%,玻璃化转变温度(Tg)为250〜300℃的玻璃粉末。