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11. 发明申请

US20120264489A1 PORTABLE COMMUNICATION DEVICE HAVING FLEXIBLE DISPLAY UNIT 有权
标题翻译：具有灵活显示单元的便携式通信设备
公开(公告)号：US20120264489A1
公开(公告)日：2012-10-18
申请号：US13447739
申请日：2012-04-16
申请人： Jeong-Seok CHOI , Byung-Jik Kim , Young-Min Lee , Kang-Ho Byun
发明人： Jeong-Seok CHOI , Byung-Jik Kim , Young-Min Lee , Kang-Ho Byun
IPC分类号： H04W88/02
CPC分类号： H04M1/0268 , G06F1/1641 , G06F1/1652 , H04M1/0216 , H04M1/0247
摘要： A portable communication device having a flexible display unit to form a predetermined curvature or be unfolded includes a first housing, second and third housings rotatably coupled to both ends of the first housing, first and second hinge modules provided between the first, second, and third housings to enable the second and third housings to rotate. The flexible display unit is provided on the first, second, and third housings to form a curvature or be unfolded on the first, second, and third housings through rotation together with the second and third housings, first and second curvature space portions formed between the first, second, and third housings allow formation of the curvature of the flexible display unit.
摘要翻译：具有形成预定曲率或展开的柔性显示单元的便携式通信装置包括可旋转地联接到第一壳体的两端的第一壳体，第二和第三壳体，设置在第一，第二和第三之间的第一和第二铰链模块壳体以使第二和第三壳体能够旋转。柔性显示单元设置在第一，第二和第三壳体上以形成曲率或通过与第二和第三壳体一起旋转而在第一壳体，第二壳体和第三壳体上展开，第一和第二曲率空间部分形成在第一，第一，第二和第三壳体允许形成柔性显示单元的曲率。

12. 发明授权

US08547197B2 Bending sensor and method for fabricating the same 有权
标题翻译：弯曲传感器及其制造方法
公开(公告)号：US08547197B2
公开(公告)日：2013-10-01
申请号：US13173781
申请日：2011-06-30
申请人： Kang-Ho Byun , Byung-Jik Kim
发明人： Kang-Ho Byun , Byung-Jik Kim
IPC分类号： G01L1/22
CPC分类号： H01C17/281 , G01B7/18 , G01L1/20 , G01L1/205 , G06F2203/04102 , H01C10/10 , H01C17/065 , Y10T29/49103
摘要： A bend-detecting (bending) sensor is provided, including a flexible substrate, at least a pair of electrode patterns spaced apart from each other provided on the flexible substrate, and a paste layer containing conductive particles. The paste layer is coated onto the flexible substrate where the electrode patterns are formed, such that when the flexible substrate is bent, the density of the conductive particles between the electrode patterns changes and an electric resistance between the electrode patterns also changes, thereby sensing deformation of the flexible substrate, and eventually, a target to which the flexible display element or the flexible substrate is attached. When the bending sensor is applied to the flexible display device, the electrode patterns and the paste layer may be formed on the flexible substrate which is to form the flexible display element, thus forming a bending sensing structure with a thickness of the flexible display element or less.
摘要翻译：提供弯曲检测（弯曲）传感器，包括柔性基板，设置在柔性基板上的彼此间隔开的至少一对电极图案和包含导电颗粒的糊状层。膏形层被涂覆到形成有电极图案的柔性基板上，使得当柔性基板弯曲时，电极图案之间的导电颗粒的密度改变，并且电极图案之间的电阻也改变，从而感测变形的柔性基板，最后是柔性显示元件或柔性基板所附着的目标。当弯曲传感器被应用于柔性显示装置时，电极图案和糊状层可以形成在柔性基板上，以形成柔性显示元件，从而形成具有柔性显示元件的厚度的弯曲感测结构或减。

13. 发明申请

US20110165734A1 MANUFACTURING METHOD OF SEMI-CONDUCTOR CHIP PACKAGE 审中-公开
标题翻译：半导体芯片封装的制造方法
公开(公告)号：US20110165734A1
公开(公告)日：2011-07-07
申请号：US12985900
申请日：2011-01-06
申请人： Seung-Woo Han , Jea-Hyuck Lee , Kyu-Sub Kwak , Kang-Ho Byun , Joon-II Kim , Duck-Hwan Kim , Kyung-Ho Park , Se-Mi Park
发明人： Seung-Woo Han , Jea-Hyuck Lee , Kyu-Sub Kwak , Kang-Ho Byun , Joon-II Kim , Duck-Hwan Kim , Kyung-Ho Park , Se-Mi Park
IPC分类号： H01L21/56
CPC分类号： H01L23/3128 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/5389 , H01L24/24 , H01L2224/12105 , H01L2224/24195 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/014 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/00
摘要： A manufacturing method of a semiconductor chip package includes molding a semiconductor chip and a number of passive devices after arranging on a film the semiconductor chip and the passive devices located in a vacant space around the periphery of the semiconductor chip; removing the film, forming an adhesive layer in a film-removed area, and attaching a conductive layer to the adhesive layer; etching a conductive layer to thereby form a conductive circuit pattern; and providing one or more conductive pads, which electrically connect the conductive circuit pattern to the semiconductor chip and to the passive devices.
摘要翻译：半导体芯片封装的制造方法包括在半导体芯片和位于半导体芯片周围的空白空间中的无源器件的膜上配置半导体芯片和多个无源器件之后，去除膜，在除膜区域中形成粘合剂层，并将导电层附着到粘合剂层上; 蚀刻导电层从而形成导电电路图案; 以及提供将导电电路图案电连接到半导体芯片和无源器件的一个或多个导电焊盘。

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