会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 11. 发明授权
    • Magnetic heads having a graded domain control film and methods of manufacture thereof
    • 具有梯度域控制膜的磁头及其制造方法
    • US08284527B2
    • 2012-10-09
    • US12957229
    • 2010-11-30
    • Nobuo YoshidaMasato ShiimotoKenichi AkitaKan Yasui
    • Nobuo YoshidaMasato ShiimotoKenichi AkitaKan Yasui
    • G11B5/39
    • H01L43/08B82Y25/00G01R33/093G01R33/098G11B5/3912G11B5/398
    • A magnetic head, according to one embodiment, includes a sensor film, a sensor cap film provided above the sensor film, a pair of shields including an upper magnetic shield and a lower magnetic shield which serve as electrodes that pass current in a film thickness direction of the sensor film, a track insulating film contacting both sides of the sensor film in the track width direction, a graded domain control film arranged on both sides in the track width direction of the sensor film adjacent the track insulating film, and an element height direction insulating film positioned on an opposite side of the sensor film relative to an air-bearing surface, wherein an edge position of the element height direction insulating film adjacent the sensor film on the air-bearing surface side is substantially the same as an edge position of the sensor cap film in the element height direction.
    • 根据一个实施例的磁头包括传感器膜,设置在传感器膜上方的传感器盖膜,包括上磁屏蔽和下磁屏蔽的一对屏蔽件,其用作使电流在膜厚度方向上通过的电极 传感器膜的传感器膜的两侧接触的轨道绝缘膜,布置在邻近轨道绝缘膜的传感器膜的轨道宽度方向两侧的梯度控制膜和元件高度 相对于空气轴承表面定位在传感器膜的相对侧上的方向绝缘膜,其中与空气轴承表面侧相邻的传感器膜的元件高度方向绝缘膜的边缘位置与边缘位置基本相同 传感器盖膜在元件高度方向上。
    • 13. 发明授权
    • Nonvolatile semiconductor memory device
    • 非易失性半导体存储器件
    • US08076709B2
    • 2011-12-13
    • US12873679
    • 2010-09-01
    • Tetsuya IshimaruDigh HisamotoKan YasuiShinichiro Kimura
    • Tetsuya IshimaruDigh HisamotoKan YasuiShinichiro Kimura
    • H01L29/792G11C16/04
    • G11C16/0466H01L21/28282H01L29/66833H01L29/792
    • In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.
    • 在存储单元包括ONO膜的情况下,其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极,其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域,通过将BTBT产生的空穴注入氮化硅膜,同时向源极区域施加正电位,向存储栅极施加负电位,向选择栅极施加正电位,进行擦除操作,以及 使电流从漏极区域流向源极区域,从而改善非易失性半导体存储器件的特性。
    • 15. 发明授权
    • Semiconductor device and manufacturing method for semiconductor device to reduce the lithography masks
    • 用于半导体器件的半导体器件和制造方法来减少光刻掩模
    • US07863131B2
    • 2011-01-04
    • US11189078
    • 2005-07-26
    • Kan YasuiDigh HisamotoTetsuya Ishimaru
    • Kan YasuiDigh HisamotoTetsuya Ishimaru
    • H01L21/336
    • H01L29/792G11C16/0466H01L27/115H01L27/11519H01L27/11568H01L29/42344
    • Semiconductor device and manufacturing method for reducing the number of required lithography masks added to the nonvolatile memory in the standard CMOS process to shorten the production period and reduce costs. In a split-gate memory cell with silicided gate electrodes utilizing a sidewall structure, a separate auxiliary pattern is formed adjoining the selected gate electrodes. A contact is set on a wiring layer self-aligned by filling side-wall gates of polysilicon in the gap between the electrodes and auxiliary pattern. The contact may overlap onto the auxiliary pattern and device isolation region, in an optimal design considering the size of the occupied surface area. If the distance to the selected gate electrode is x, the ONO film deposit thickness is t, and the polysilicon film deposit thickness is d, then the auxiliary pattern may be separated just by a distance x such that x
    • 用于减少在标准CMOS工艺中添加到非易失性存储器中的所需光刻掩模的数量的半导体器件和制造方法,以缩短生产周期并降低成本。 在具有利用侧壁结构的硅化栅电极的分裂栅极存储单元中,形成邻接所选择的栅电极的单独辅助图案。 通过填充电极和辅助图案之间的间隙中的多晶硅的侧壁栅极,将接触设置在自对准的布线层上。 考虑到占用的表面积的大小,接触可以以最佳设计重叠在辅助图案和设备隔离区域上。 如果与选定的栅电极的距离为x,则ONO膜沉积厚度为t,多晶硅膜沉积厚度为d,则辅助图案可以仅分开距离x,使得x <2×(t + d )。