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11. 发明申请

US20100267413A1 COMMUNICATION TERMINAL AND METHOD FOR USE IN RADIO COMMUNICATION SYSTEM 有权
标题翻译：通信终端和无线电通信系统中使用的方法
公开(公告)号：US20100267413A1
公开(公告)日：2010-10-21
申请号：US12760918
申请日：2010-04-15
申请人： Yousuke Iizuka , Masato Maeda
发明人： Yousuke Iizuka , Masato Maeda
IPC分类号： H04B7/00
CPC分类号： H04W52/44 , H04W52/146 , H04W52/286
摘要： A disclosed communication terminal includes a determination unit analyzing a received downlink control signal and determining an allowable maximum uplink transmission power level, a measurement unit performing different frequency measurement in a transmission gap period, a threshold determination unit determining whether the allowable maximum level is higher than or equal to a threshold within a predefined period before the start and/or after the end of the transmission gap period, a transmission power control unit setting an uplink transmission power level, and a transmission unit transmitting an uplink signal at the determined power level. If the allowable maximum level is higher than or equal to the threshold, the transmission power control unit sets the uplink transmission power level to or below a predefined level lower than the allowable maximum level within the predefined period before the start and/or after the end of the transmission gap period.
摘要翻译：所公开的通信终端包括：判断单元，对接收到的下行链路控制信号进行分析，并确定允许的最大上行链路发送功率电平;测量单元，在发送间隙期间进行不同的频率测量;阈值判定单元，判定容许最大电平是否高于或者等于发送间隙周期结束之前和/或之后的预定时间段内的阈值，设定上行链路发送功率电平的发送功率控制单元以及以所确定的功率电平发送上行链路信号的发送单元。如果允许的最大电平高于或等于阈值，发射功率控制单元将上行链路发射功率电平设置为低于在启动前和/或结束后的预定时间段内允许的最大电平的预定义电平的传输间隙期间。

12. 发明授权

US07474006B2 Package board and semiconductor device 失效
标题翻译：封装板和半导体器件
公开(公告)号：US07474006B2
公开(公告)日：2009-01-06
申请号：US11542220
申请日：2006-10-04
申请人： Masato Maeda
发明人： Masato Maeda
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L24/16 , H01L2224/10175 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00
摘要： A package board for flip-chip packaging on whose one surface an element is mounted in a facedown manner is provided. The package board has: an interconnection provided on the one surface; a bump formation region in which a bump electrically connecting the interconnection with an electrode pad of the element is provided; and an insulating film covering a part of the one surface outside of the bump formation region. The insulating film includes a girdle-shaped insulating film that is provided around a region and along a side of the bump formation region opposite to an edge of the package board. The insulating film further has an opening section formed within the region.
摘要翻译：提供了一种用于倒装芯片封装的封装板，其一个表面上的元件以面对的方式安装。包装板具有：在一个表面上提供的互连; 凸块形成区域，其中设置将所述互连件与所述元件的电极焊盘电连接的凸块; 以及覆盖凸起形成区域外的一个表面的一部分的绝缘膜。该绝缘膜包括一带状绝缘膜，该带状绝缘膜设置在与包装板的边缘相对的凸起形成区域的区域周围。绝缘膜还具有形成在该区域内的开口部。

13. 发明申请

US20060011706A1 Bonding method and bonding apparatus 失效
标题翻译：接合方法和接合装置
公开(公告)号：US20060011706A1
公开(公告)日：2006-01-19
申请号：US11181861
申请日：2005-07-15
申请人： Yoichiro Kurita , Jun Nogawa , Masato Maeda , Teruji Inomata
发明人： Yoichiro Kurita , Jun Nogawa , Masato Maeda , Teruji Inomata
IPC分类号： B23K1/06
CPC分类号： B23K20/10 , H01L24/75 , H01L24/81 , H01L2224/05568 , H01L2224/05573 , H01L2224/1134 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16 , H01L2224/75 , H01L2224/759 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082 , H01L2924/00014 , H01L2224/13099 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647
摘要： Disclosed are a bonding method for a semiconductor chip, which employs an ultrasonic bonding scheme that prevents wear-out of the top surface of a mount tool and ensures both high reliability and high productivity, and a bonding apparatus which is used to carry out the method. The bonding apparatus and method are provided with means for suppressing generation of a sliding friction. The apparatus and method execute a bonding process by controlling vibration-axial directional holding force and inertial force based on information given from control management means to thereby maintain a relationship of (vibration-axial directional holding force)>(die shear strength)+(inertial force) while applying an ultrasonic vibration to a region which is subjected to bonding.
摘要翻译：公开了一种半导体芯片的接合方法，其采用防止安装工具的上表面磨损的超声波接合方式，并且确保高可靠性和高生产率，以及用于执行该方法的接合装置。接合装置和方法设置有用于抑制滑动摩擦的产生的装置。该装置和方法通过基于从控制管理装置给出的信息来控制振动轴向方向保持力和惯性力来执行接合处理，从而保持<？in-line-formula description =“In-line Formulas”end = （振动 - 轴向方向保持力）>（模具剪切强度）+（惯性力）<？在线公式描述=“在线公式”结束=“尾”→>同时施加超声波振动到经受接合的区域。

14. 发明授权

US09008663B2 Mobile station and method for mobile communication system 有权
公开(公告)号：US09008663B2
公开(公告)日：2015-04-14
申请号：US13639046
申请日：2011-03-30
申请人： Hidetoshi Ebara , Masato Maeda
发明人： Hidetoshi Ebara , Masato Maeda
IPC分类号： H04W36/36 , H04W36/32 , H04W24/10 , H04W36/30
摘要： A mobile station includes a measurement unit that measures radio qualities for a serving cell and a candidate switching target cell; a cell switching determination unit that determines whether the radio quality of the serving cell is less than a reference quality corresponded in advance with a predetermined throughput, wherein, when the radio quality of the serving cell is less than the reference quality, the cell switching determination unit determines whether the serving cell is to be switched to the candidate switching target cell by comparing the radio quality of the serving cell with that of the candidate switching target cell; and a radio communication unit that transmits a signal for requesting the switching of the serving cell, and that receives a signal for instructing the switching of the serving cell from a network apparatus.

15. 发明授权

US08391172B2 Communication method and communication terminal for radio communication system 失效
标题翻译：无线电通信系统的通信方式和通信终端
公开(公告)号：US08391172B2
公开(公告)日：2013-03-05
申请号：US12761794
申请日：2010-04-16
申请人： Yousuke Iizuka , Masato Maeda
发明人： Yousuke Iizuka , Masato Maeda
IPC分类号： H04W72/04
CPC分类号： H04W52/325 , H04W52/143 , H04W52/16 , H04W52/20 , H04W52/286
摘要： A communication method for a radio communication system employing an enhanced uplink scheme includes the steps of determining a transmission power control bit for controlling transmission power of a downlink control channel; generating an uplink control signal including the transmission power control bit; and transmitting the uplink control signal to a base station. In the determining step, whether an indicator channel indicating acknowledgement or negative acknowledgement for an uplink data channel is receivable at a quality level better than a predetermined value is evaluated, and the transmission power control bit of the indicator channel is determined based on the evaluation result.
摘要翻译：一种采用增强上行链路方式的无线电通信系统的通信方法包括以下步骤：确定用于控制下行链路控制信道的发射功率的发射功率控制比特; 产生包括所述发送功率控制位的上行链路控制信号; 以及将所述上行链路控制信号发送到基站。在确定步骤中，评估指示对于上行链路数据信道的确认或否定确认的指示符信道是否能够以比预定值更好的质量水平接收，并且基于评估结果来确定指示符信道的发送功率控制位。

16. 发明申请

US20120220302A1 MOBILE STATION, NETWORK, AND HANDOVER CONTROL METHOD 有权
标题翻译：移动站，网络和切换控制方法
公开(公告)号：US20120220302A1
公开(公告)日：2012-08-30
申请号：US13505478
申请日：2010-09-17
申请人： Hidetoshi Ebara , Masato Maeda
发明人： Hidetoshi Ebara , Masato Maeda
IPC分类号： H04W36/30 , H04W36/32
CPC分类号： H04W64/006 , H04W24/10 , H04W28/18 , H04W36/0083 , H04W36/0094 , H04W36/06 , H04W36/30 , H04W36/32
摘要： In a parameter storage device, an offset value corresponding to a moving state (moving speed) and a serving frequency are stored. A parameter identifier reads from the parameter storage device an offset value corresponding to a serving frequency and a moving state. A measuring unit measures a radio communication quality of an inter-frequency cell. A measurement controller adds the offset value to the radio communication quality, to generate control information. The control information is transmitted via a transmitter to a network.
摘要翻译：在参数存储装置中，存储对应于移动状态（移动速度）和服务频率的偏移值。参数标识符从参数存储设备读取与服务频率和移动状态对应的偏移值。测量单元测量频率间小区的无线电通信质量。测量控制器将偏移值与无线电通信质量相加，以产生控制信息。控制信息通过发射机发送到网络。

17. 发明申请

US20100271969A1 COMMUNICATION METHOD AND COMMUNICATION TERMINAL FOR RADIO COMMUNICATION SYSTEM 失效
标题翻译：无线电通信系统的通信方法和通信终端
公开(公告)号：US20100271969A1
公开(公告)日：2010-10-28
申请号：US12761794
申请日：2010-04-16
申请人： Yousuke IIZUKA , Masato Maeda
发明人： Yousuke IIZUKA , Masato Maeda
IPC分类号： H04L12/26 , H04W72/04
CPC分类号： H04W52/325 , H04W52/143 , H04W52/16 , H04W52/20 , H04W52/286
摘要： A communication method for a radio communication system employing an enhanced uplink scheme includes the steps of determining a transmission power control bit for controlling transmission power of a downlink control channel; generating an uplink control signal including the transmission power control bit; and transmitting the uplink control signal to a base station. In the determining step, whether an indicator channel indicating acknowledgement or negative acknowledgement for an uplink data channel is receivable at a quality level better than a predetermined value is evaluated, and the transmission power control bit of the indicator channel is determined based on the evaluation result.
摘要翻译：一种采用增强上行链路方式的无线电通信系统的通信方法包括以下步骤：确定用于控制下行链路控制信道的发射功率的发射功率控制比特; 产生包括所述发送功率控制位的上行链路控制信号; 以及将所述上行链路控制信号发送到基站。在确定步骤中，评估指示对于上行链路数据信道的确认或否定确认的指示符信道是否能够以比预定值更好的质量水平接收，并且基于评估结果来确定指示符信道的发送功率控制位。

18. 发明申请

US20070075438A1 Package board and semiconductor device 失效
标题翻译：封装板和半导体器件
公开(公告)号：US20070075438A1
公开(公告)日：2007-04-05
申请号：US11542220
申请日：2006-10-04
申请人： Masato Maeda
发明人： Masato Maeda
IPC分类号： H01L23/48
CPC分类号： H01L21/563 , H01L24/16 , H01L2224/10175 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/00
摘要： A package board for flip-chip packaging on whose one surface an element is mounted in a facedown manner is provided. The package board has: an interconnection provided on the one surface; a bump formation region in which a bump electrically connecting the interconnection with an electrode pad of the element is provided; and an insulating film covering a part of the one surface outside of the bump formation region. The insulating film includes a girdle-shaped insulating film that is provided around a region and along a side of the bump formation region opposite to an edge of the package board. The insulating film further has an opening section formed within the region.
摘要翻译：提供了一种用于倒装芯片封装的封装板，其一个表面上的元件以面对的方式安装。包装板具有：在一个表面上提供的互连; 凸块形成区域，其中设置将所述互连件与所述元件的电极焊盘电连接的凸块; 以及覆盖凸起形成区域外的一个表面的一部分的绝缘膜。该绝缘膜包括一带状绝缘膜，该带状绝缘膜设置在与包装板的边缘相对的凸起形成区域的区域周围。绝缘膜还具有形成在该区域内的开口部。

19. 发明授权

US06922136B2 Security method for vehicle safe driving support system 有权
标题翻译：车辆安全驾驶支持系统的安全方法
公开(公告)号：US06922136B2
公开(公告)日：2005-07-26
申请号：US10375405
申请日：2003-02-27
申请人： Makio Komada , Makoto Ishizaka , Masateru Suzuki , Ryoichi Kurata , Masato Maeda
发明人： Makio Komada , Makoto Ishizaka , Masateru Suzuki , Ryoichi Kurata , Masato Maeda
IPC分类号： B60R21/00 , G08G1/09 , G08G1/097 , G08G1/16 , B60Q1/00
CPC分类号： G08G1/164
摘要： A security method for a vehicle safe driving system provides drivers information for safe driving, that is, when a sensor does not detect any danger when there is a danger on the road, when there are some limits in the system operations, or when a portion of the system does not work.
摘要翻译：用于车辆安全驾驶系统的安全方法提供用于安全驾驶的驾驶员信息，即当在道路上存在危险时传感器没有检测到任何危险时，当系统操作有某些限制时，或者当部分的系统不起作用

20. 发明授权

US4860574A Paramagnetic oxygen analyzer 失效
标题翻译：顺磁氧分析仪
公开(公告)号：US4860574A
公开(公告)日：1989-08-29
申请号：US209431
申请日：1988-06-21
申请人： Masato Maeda , Hideo Takeuchi
发明人： Masato Maeda , Hideo Takeuchi
IPC分类号： G01N27/74
CPC分类号： G01N27/74
摘要： A closed loop-like measuring passage is provided with two openings at symmetrical positions, and a sample gas is introduced through on opening into the passage and discharged therefrom through the other opening. A bypass pipe is connected to the measuring passage midway therealong, and a stable purge gas of known composition is introduced into the pipe from the center thereof. A magnetic field is generated in one of the two connecting portions between the bypass pipe and the measuring passage, and the oxygen gas attracting action of the field results in a change in the ratio of the split of the purge gas stream introduced into the bypass pipe and split into two streams. This change is detected by a pair of purge gas stream detecting sensors provided inside the bypass pipe symmetrically with respect to the portion through which the purge gas is introduced, and the thus detected signals are processed to obtain the difference between them which gives the oxygen gas concentration in the sample gas.
摘要翻译：闭环状测量通道在对称位置处设置有两个开口，并且样品气体通过开口引入通道并通过另一个开口从其中排出。旁通管在其中途连接到测量通道，并且将已知组合物的稳定的吹扫气体从其中心引入到管道中。在旁通管和测量通道之间的两个连接部分中的一个中产生磁场，并且该场的氧气吸引作用导致引入旁通管的吹扫气流的分流比的变化并分成两个流。该变化通过设置在旁通管内部的一对吹扫气体流检测传感器来检测，该检测传感器相对于引入吹扫气体的部分对称地被对称地处理，并且将这些检测到的信号进行处理以获得它们之间的差异，样品气体中的浓度。

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