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    • 11. 发明授权
    • Light emitting device and method of manufacturing the same
    • 发光元件及其制造方法
    • US07977691B2
    • 2011-07-12
    • US12630370
    • 2009-12-03
    • Jong Lam LeeJae Ho LeeYeo Jin YoonEu Jin HwangDae Won Kim
    • Jong Lam LeeJae Ho LeeYeo Jin YoonEu Jin HwangDae Won Kim
    • H01L27/15
    • H01L27/15H01L27/153H01L27/3281H01L33/08H01L33/20H01L33/24H01L33/28H01L33/32H01L33/385H01L33/44H01L33/62H01L51/5253H01L2224/45144H01L2224/48095H01L2224/48137H01L2933/0066H01L2924/00
    • The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention is provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted.
    • 本发明涉及一种发光器件及其制造方法。 根据本发明,发光器件包括衬底,形成在衬底上的N型半导体层和形成在N型半导体层上的P型半导体层,其中包括N型半导体层的侧表面 或P型半导体层的水平面为20〜80°的斜率。 此外,本发明提供了一种发光器件,其包括形成有多个发光单元的衬底,每个发光单元包括形成在N型半导体层上的N型半导体层和P型半导体层,以及基座衬底翻转 芯片接合到基板上,其中一个发光单元的N型半导体层和另一个相邻的发光单元的P型半导体层彼此连接,并且至少包括P型半导体 发光单元的层与水平面的倾斜度为20〜80°。 此外,本发明提供一种制造发光器件的方法。 因此,具有发光效率,外部量子效率,提取效率等发光装置的特性得到提高,可靠性得到确保,能够发出高发光强度和亮度的光的优点。
    • 12. 发明授权
    • Light emitting device and method of manufacturing the same
    • 发光元件及其制造方法
    • US07951626B2
    • 2011-05-31
    • US12613275
    • 2009-11-05
    • Jong Lam LeeJae Ho LeeYeo Jin YoonEu Jin HwangDae Won Kim
    • Jong Lam LeeJae Ho LeeYeo Jin YoonEu Jin HwangDae Won Kim
    • H01L27/15
    • H01L27/15H01L27/153H01L27/3281H01L33/08H01L33/20H01L33/24H01L33/28H01L33/32H01L33/385H01L33/44H01L33/62H01L51/5253H01L2224/45144H01L2224/48095H01L2224/48137H01L2933/0066H01L2924/00
    • The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted.
    • 本发明涉及一种发光器件及其制造方法。 根据本发明,发光器件包括衬底,形成在衬底上的N型半导体层和形成在N型半导体层上的P型半导体层,其中包括N型半导体层的侧表面 或P型半导体层的水平面为20〜80°的斜率。 此外,本发明提供了一种发光器件,其包括形成有多个发光单元的衬底,每个发光单元包括形成在N型半导体层上的N型半导体层和P型半导体层,以及基座衬底翻转 芯片接合到基板上,其中一个发光单元的N型半导体层和另一个相邻的发光单元的P型半导体层彼此连接,并且至少包括P型半导体 发光单元的层与水平面的倾斜度为20〜80°。 此外,本发明提供一种制造发光器件的方法。 因此,具有发光效率,外部量子效率,提取效率等发光装置的特性得到提高,可靠性得到确保,能够发出高发光强度和亮度的光的优点。
    • 15. 发明授权
    • Light emitting diode having active region of multi quantum well structure
    • 具有多量子阱结构的有源区的发光二极管
    • US07626209B2
    • 2009-12-01
    • US12261627
    • 2008-10-30
    • Dong Seon LeeEu Jin Hwang
    • Dong Seon LeeEu Jin Hwang
    • H01L33/00
    • H01L33/32H01L33/06
    • Disclosed is a light emitting diode having an active region of a multi quantum well structure. The active region is positioned between GaN-based N-type and P-type compound semiconductor layers. At least one of barrier layers in the active region includes an undoped InGaN layer and a Si-doped GaN layer, and the Si-doped GaN layer is in contact with a well layer positioned at a side of the P-type compound semiconductor layer therefrom. Accordingly, carrier overflow and a quantum confined stark effect can be reduced, thereby improving an electron-hole recombination rate. Further, disclosed is an active region of a multi quantum well structure including relatively thick barrier layers and relatively thin barrier layers.
    • 公开了具有多量子阱结构的有源区的发光二极管。 有源区位于GaN基N型和P型化合物半导体层之间。 有源区中的至少一个势垒层包括未掺杂的InGaN层和Si掺杂的GaN层,并且掺杂Si的GaN层与位于其P型化合物半导体层侧面的阱层接触 。 因此,可以降低载流子溢出和量子限制的Stark效应,从而提高电子 - 空穴复合率。 此外,公开了包括相对较厚的阻挡层和相对薄的阻挡层的多量子阱结构的有源区。
    • 16. 发明申请
    • Light Emitting Device and Method of Manufacturing the Same
    • 发光装置及其制造方法
    • US20080251796A1
    • 2008-10-16
    • US11993965
    • 2006-06-22
    • Jong Lam LeeJae Ho LeeYeo Jin YoonEu Jin HwangDae Won Kim
    • Jong Lam LeeJae Ho LeeYeo Jin YoonEu Jin HwangDae Won Kim
    • H01L33/00
    • H01L27/15H01L27/153H01L27/3281H01L33/08H01L33/20H01L33/24H01L33/28H01L33/32H01L33/385H01L33/44H01L33/62H01L51/5253H01L2224/45144H01L2224/48095H01L2224/48137H01L2933/0066H01L2924/00
    • The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semi-conductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted.
    • 本发明涉及一种发光器件及其制造方法。 根据本发明,发光器件包括衬底,形成在衬底上的N型半导体层和形成在N型半导体层上的P型半导体层,其中包括N型半导体层的侧表面 或P型半导体层的水平面为20〜80°的斜率。 此外,本发明提供了一种发光器件,其包括形成有多个发光单元的衬底,每个发光单元包括形成在N型半导体层上的N型半导体层和P型半导体层,以及基座衬底翻转 芯片接合到基板上,其中一个发光单元的N型半导体层和另一个相邻发光单元的P型半导体层彼此连接,并且至少包括P- 发光单元的半导体层的类型与水平面的斜率为20〜80°。 此外,本发明提供一种制造发光器件的方法。 因此,具有发光效率,外部量子效率,提取效率等发光装置的特性得到提高,可靠性得到确保,能够发出高发光强度和亮度的光的优点。
    • 17. 发明授权
    • Light emitting device and method of manufacturing the same
    • 发光元件及其制造方法
    • US08476648B2
    • 2013-07-02
    • US11993965
    • 2006-06-22
    • Jong Lam LeeJae Ho LeeYeo Jin YoonEu Jin HwangDae Won Kim
    • Jong Lam LeeJae Ho LeeYeo Jin YoonEu Jin HwangDae Won Kim
    • H01L33/00
    • H01L27/15H01L27/153H01L27/3281H01L33/08H01L33/20H01L33/24H01L33/28H01L33/32H01L33/385H01L33/44H01L33/62H01L51/5253H01L2224/45144H01L2224/48095H01L2224/48137H01L2933/0066H01L2924/00
    • The present invention relates to a light emitting device and a method of manufacturing the light emitting device. According to the present invention, the light emitting device comprises a substrate, an N-type semiconductor layer formed on the substrate, and a P-type semiconductor layer formed on the N-type semiconductor layer, wherein a side surface including the N-type or P-type semiconductor layer has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a light emitting device comprising a substrate formed with a plurality of light emitting cells each including an N-type semiconductor layer and a P-type semiconductor layer formed on the N-type semiconductor layer, and a submount substrate flip-chip bonded onto the substrate, wherein the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer of another adjacent light emitting cell are connected to each other, and a side surface including at least the P-type semiconductor layer of the light emitting cell has a slope of 20 to 80° from a horizontal plane. Further, the present invention provides a method of manufacturing the light emitting device. Accordingly, there is an advantage in that the characteristics of a light emitting device such as luminous efficiency, external quantum efficiency and extraction efficiency are enhanced and the reliability is secured such that light with high luminous intensity and brightness can be emitted.
    • 本发明涉及一种发光器件及其制造方法。 根据本发明,发光器件包括衬底,形成在衬底上的N型半导体层和形成在N型半导体层上的P型半导体层,其中包括N型半导体层的侧表面 或P型半导体层的水平面为20〜80°的斜率。 此外,本发明提供了一种发光器件,其包括形成有多个发光单元的衬底,每个发光单元包括形成在N型半导体层上的N型半导体层和P型半导体层,以及基座衬底翻转 芯片接合到基板上,其中一个发光单元的N型半导体层和另一个相邻的发光单元的P型半导体层彼此连接,并且至少包括P型半导体 发光单元的层与水平面的倾斜度为20〜80°。 此外,本发明提供一种制造发光器件的方法。 因此,具有发光效率,外部量子效率,提取效率等发光装置的特性得到提高,可靠性得到确保,能够发出高发光强度和亮度的光的优点。
    • 20. 发明授权
    • Method of fabricating AC light emitting device having photonic crystal structure
    • 制造具有光子晶体结构的AC发光器件的方法
    • US07901964B2
    • 2011-03-08
    • US12546155
    • 2009-08-24
    • Jae-Ho LeeYeo Jin YoonEu Jin HwangJong Kyu KimJun Hee Lee
    • Jae-Ho LeeYeo Jin YoonEu Jin HwangJong Kyu KimJun Hee Lee
    • H01L33/00
    • H01L25/0753H01L33/007H01L33/20H01L2224/48137H01L2224/49107H01L2224/73265
    • Disclosed is an AC light emitting device having photonic crystal structures and a method of fabricating the same. The light emitting device includes a plurality of light emitting cells and metallic wirings electrically connecting the light emitting cells with one another. Further, each of the light emitting cells includes a first conductive type semiconductor layer, a second conductive type semiconductor layer disposed on one region of the first conductive type semiconductor layer, and an active layer interposed between the first and second conductive type semiconductor layers. In addition, a photonic crystal structure is formed in the second conductive type semiconductor layer. The photonic crystal structure prevents light emitted from the active layer from laterally propagating by means of a periodic array, such that light extraction efficiency of the light emitting device can be improved. Furthermore, the metallic wirings electrically connect a plurality of light emitting cells with one another such that an AC light emitting device can be provided.
    • 公开了具有光子晶体结构的AC发光器件及其制造方法。 发光器件包括多个发光单元和将发光单元彼此电连接的金属布线。 此外,每个发光单元包括第一导电类型半导体层,设置在第一导电类型半导体层的一个区域上的第二导电类型半导体层以及置于第一和第二导电类型半导体层之间的有源层。 此外,在第二导电型半导体层中形成光子晶体结构。 光子晶体结构防止从有源层发射的光通过周期性阵列横向传播,使得可以提高发光器件的光提取效率。 此外,金属配线将多个发光单元彼此电连接,从而可以提供交流发光装置。