专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20090058945A1 MICRO-FLUID EJECTION HEADS AND METHODS FOR BONDING SUBSTRATES TO SUPPORTS 有权
标题翻译：微流体喷射头和用于将基材粘合到支撑物上的方法
公开(公告)号：US20090058945A1
公开(公告)日：2009-03-05
申请号：US11848246
申请日：2007-08-31
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： B41J2/04 , C09J5/02
CPC分类号： C09J5/02 , B41J2/16 , B41J2/1623 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14491 , C09J2400/146 , Y10T29/42 , Y10T29/49002 , Y10T29/49401 , Y10T156/1056
摘要： A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.
摘要翻译：基本上平面的微流体喷射装置，其中微流体喷射头气密地密封并结合到支撑材料上，以及将硅装置（例如微流体喷射头）接合到支撑材料的方法。

12. 发明授权

US07938513B2 Heater chips with silicon die bonded on silicon substrate and methods of fabricating the heater chips 有权
标题翻译：具有硅芯片的加热芯片粘合在硅衬底上以及制造加热器芯片的方法
公开(公告)号：US07938513B2
公开(公告)日：2011-05-10
申请号：US12101215
申请日：2008-04-11
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05 , B21D53/76
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. By separate processing of carrier and device wafers, size and features of substrate and die can be tailored to provide a desired heater chip construction.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过对载体和器件晶片的单独处理，可以调整衬底和管芯的尺寸和特征以提供期望的加热器芯片结构。

13. 发明申请

US20090258322A1 METHODS FOR PLANARIZING UNEVENNESS ON SURFACE OF WAFER PHOTORESIST LAYER AND WAFERS PRODUCED BY THE METHODS 有权
标题翻译：在方法生产的波长光电子层和波长表面上平坦化的方法
公开(公告)号：US20090258322A1
公开(公告)日：2009-10-15
申请号：US12100716
申请日：2008-04-10
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： G03F7/20
CPC分类号： G03F7/094
摘要： A wafer has a substrate and a photoresist layer thereon with a surface that is planarized by positioning over a starting surface of the photoresist layer a gray-scale mask having a pattern that correlates with a gradient height profile of unevenness present on the starting surface, patterning the photoresist layer using the gray-scale mask to produce the pattern thereof in the photoresist layer which, in effect, produces a profile of evenness in the photoresist layer underlying the gradient height profile of unevenness, and developing the patterned photoresist layer such that only a three-dimensional portion thereof corresponding to the gradient height profile of unevenness located above the profile of evenness is removed which, in effect, leaves behind a resulting surface on the photoresist layer made substantially more even and thus substantially in a planarized condition.
摘要翻译：晶片具有基板及其上的光致抗蚀剂层，其表面通过在光致抗蚀剂层的起始表面上定位而形成平面化的灰度掩模，该灰度掩模具有与存在于起始表面上的不均匀性的梯度高度分布相关联的图案，图案化使用灰度掩模的光致抗蚀剂层在光致抗蚀剂层中产生其图案，其实际上在凹凸的梯度高度分布下的光致抗蚀剂层中产生均匀度的轮廓，并且显影图案化的光致抗蚀剂层，使得只有去除其对应于位于均匀轮廓之上的凹凸的梯度高度轮廓的三维部分，其实际上留在光致抗蚀剂层上形成的基本上更均匀且因此基本上处于平坦状态的所得表面之后。

14. 发明授权

US06902867B2 Ink jet printheads and methods therefor 有权
标题翻译：喷墨打印头及其方法
公开(公告)号：US06902867B2
公开(公告)日：2005-06-07
申请号：US10262827
申请日：2002-10-02
申请人： Eric Spencer Hall , Shauna Marie Leis , Andrew Lee McNees , James Michael Mrvos , James Harold Powers , Carl Edmond Sullivan
发明人： Eric Spencer Hall , Shauna Marie Leis , Andrew Lee McNees , James Michael Mrvos , James Harold Powers , Carl Edmond Sullivan
IPC分类号： B41J2/16 , B41J2/05
CPC分类号： B41J2/1623 , B41J2/1603 , B41J2/1628 , B41J2/1631 , B41J2/1634 , B41J2/1635 , B41J2/1645
摘要： The invention provides a method for making ink feed vias in semiconductor silicon substrate chips for an ink jet printhead and ink jet printheads containing silicon chips made by the method. The method includes applying a first photoresist material to a first surface side of the chip. The first photoresist material is patterned and developed to define at least one ink via location therein. An etch stop material is applied to a second surface side of the chip. At least one ink via is anisotropically etched with a dry etch process through the thickness of the silicon chip up to the etch stop layer from the first surface side of the chip. As opposed to conventional ink via formation techniques, the method significantly improves the throughput of silicon chip and reduces losses due to chip breakage and cracking. The resulting chips are more reliable for long term printhead use.
摘要翻译：本发明提供了一种在用于喷墨打印头的半导体硅衬底芯片中制造墨水供给通孔的方法，以及通过该方法制造的含有硅芯片的喷墨打印头。该方法包括将第一光致抗蚀剂材料施加到芯片的第一表面侧。第一光致抗蚀剂材料被图案化和显影以在其中限定至少一个墨通孔位置。将蚀刻停止材料施加到芯片的第二表面侧。通过干法蚀刻工艺将至少一个墨通孔从芯片的第一表面侧通过硅片的厚度直到蚀刻停止层。与传统的油墨通孔形成技术相反，该方法显着提高了硅芯片的生产量，并减少了由于断屑和破裂造成的损耗。所得到的芯片对于长期的打印头使用更可靠。

15. 发明授权

US08882221B2 Modular micro-fluid ejection head assembly 有权
标题翻译：模块化微流体喷射头组件
公开(公告)号：US08882221B2
公开(公告)日：2014-11-11
申请号：US12195451
申请日：2008-08-21
申请人： David Laurier Bernard , Paul William Dryer , David Golman King , Andrew Lee McNees , Timothy Lowell Strunk
发明人： David Laurier Bernard , Paul William Dryer , David Golman King , Andrew Lee McNees , Timothy Lowell Strunk
IPC分类号： B41J2/14 , B41J2/16
CPC分类号： B41J2/1623 , B41J2/14072 , B41J2/16 , Y10T29/49401
摘要： A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.
摘要翻译：微流体喷射头组件和使用单独制造的电气部件制造微流体喷射头的方法。微流体喷射头具有至少一个基底基板，至少一个附着在基底基板上的流体喷射致动器基板; 以及至少第一逻辑部件基板，其密封到基底基板。流体喷射器致动器基板和第一逻辑部件基板彼此电连通。

16. 发明授权

US08826502B2 Method for making a substantially planar micro-fluid ejection head 有权
标题翻译：制造基本上平面的微流体喷射头的方法
公开(公告)号：US08826502B2
公开(公告)日：2014-09-09
申请号：US12786457
申请日：2010-05-25
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： H04R17/00 , B41J2/16 , C09J5/02 , B41J2/14
CPC分类号： C09J5/02 , B41J2/16 , B41J2/1623 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14491 , C09J2400/146 , Y10T29/42 , Y10T29/49002 , Y10T29/49401 , Y10T156/1056
摘要： A process for making a substantially planar micro-fluid ejection head is disclosed, and includes depositing a basic solution on a first surface of a device substrate. The first surface having the basic solution deposited thereon is contacted together with a surface of a support material for a duration ranging from about 1 minute to about 15 minutes, at a temperature ranging from about 20° C. to about 90° C. so that the first surface having the basic solution deposited thereon and the surface of the support material form a bond therebetween to hermetically seal the support material and the device substrate to one another. Both the substrate and the at least one surface of the support comprise silicon, and at least one of the device substrate and the at least one surface of the support material is substantially composed of silicon.
摘要翻译：公开了一种用于制造基本上平面的微流体喷射头的方法，并且包括将碱性溶液沉积在器件衬底的第一表面上。将沉积有碱性溶液的第一表面与载体材料的表面在约20℃至约90℃的温度范围内从约1分钟至约15分钟的时间范围内接触一段时间，从而使得第一表面具有沉积在其上的基本溶液，并且支撑材料的表面在其间形成结合，以将支撑材料和器件基板彼此密封。衬底和支撑体的至少一个表面都包括硅，并且器件衬底和支撑材料的至少一个表面中的至少一个基本上由硅组成。

17. 发明授权

US08324076B2 Micro-fluid ejection heads and methods for bonding substrates to supports 有权
标题翻译：微流体喷射头和将基底粘合到支撑体上的方法
公开(公告)号：US08324076B2
公开(公告)日：2012-12-04
申请号：US12786462
申请日：2010-05-25
申请人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
发明人： David Laurier Bernard , Paul William Dryer , Andrew Lee McNees
IPC分类号： H01L21/30
CPC分类号： C09J5/02 , B41J2/16 , B41J2/1623 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14491 , C09J2400/146 , Y10T29/42 , Y10T29/49002 , Y10T29/49401 , Y10T156/1056
摘要： A substantially planar micro-fluid ejection device, where the micro-fluid ejection head is hermetically sealed and bonded to a support material, and a method of bonding a silicon device, such as a micro-fluid ejection head, to a support material.
摘要翻译：基本上平面的微流体喷射装置，其中微流体喷射头气密地密封并结合到支撑材料上，以及将硅装置（例如微流体喷射头）接合到支撑材料的方法。

18. 发明授权

US08087756B2 Heater chips with silicon die bonded on silicon substrate 有权
标题翻译：硅芯片加热芯片焊接在硅基板上
公开(公告)号：US08087756B2
公开(公告)日：2012-01-03
申请号：US13102091
申请日：2011-05-06
申请人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
发明人： Frank Edward Anderson , David Laurier Bernard , Paul William Dryer , Burton Lee Joyner, II , Andrew Lee McNees , Timothy Lowell Strunk , Carl Edmond Sullivan
IPC分类号： B41J2/05
CPC分类号： B41J2/1603 , B41J2/1629 , B41J2/1631 , B41J2/1632 , B41J2/164 , H01L21/6715 , Y10T29/49401
摘要： A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. The at least one die is superimposed on the substrate such that ink supply vias of the substrate align with ink flow vias of the die and portions of substrate front surface and die back surface are aligned, disposed adjacent and facing one another. The bond formed between substrate and die facing surface portions is hermetic and equal in strength to a Si—O bond. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die.
摘要翻译：加热器芯片具有基板和至少一个由硅制成的管芯，以及非粘合地连接的管芯。厚度足以抵抗弯曲的基材具有从后表面到前表面的墨水供应通孔。模具具有从背面到表面的墨水流通孔，以及包括与前述表面相邻的加热元件的电路，其中散布着墨水通孔。至少一个管芯叠加在衬底上，使得衬底的供墨通孔与管芯的墨流过孔对准，并且衬底前表面和管芯后表面的部分相邻并相对设置地排列。在衬底和面向芯片的表面部分之间形成的结合是密封的，并且与Si-O键的强度相等。通过模具的金属将基板前部的导体连接到模具前部的加热元件。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式