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11. 发明申请

US20090195294A1 Method and System for Signal Generation via a Temperature Sensing Crystal Integrated Circuit 有权
标题翻译：通过温度感应晶体集成电路产生信号的方法和系统
公开(公告)号：US20090195294A1
公开(公告)日：2009-08-06
申请号：US12364046
申请日：2009-02-02
申请人： Evan McCarthy , John Walley
发明人： Evan McCarthy , John Walley
IPC分类号： G01K11/22 , H01L35/00
CPC分类号： G01R19/2506 , G01K7/32
摘要： Aspects of a method and system for signal generation via a temperature sensing crystal integrated circuit are provided. In this regard, a temperature sensing crystal integrated circuit (TSCIC) comprising a memory and a crystal or crystal oscillator may generate a signal indicative of a measured temperature. The generated signal and data stored in the memory may be utilized to configure one or more circuits communicatively coupled to the TSCIC. The data stored in the memory may characterize behavior of the TSCIC as a function of temperature and/or time. The data characterizing the behavior of the TSCIC may indicate variations in frequency of the crystal or crystal oscillator as a function of temperature and/or time. The data characterizing the behavior of the TSCIC may comprise one or both of a frequency value and a frequency correction value.
摘要翻译：提供了通过温度感测晶体集成电路产生信号的方法和系统的方面。在这方面，包括存储器和晶体或晶体振荡器的温度感测晶体集成电路（TSCIC）可以产生指示测量温度的信号。存储在存储器中的产生的信号和数据可以用于配置通信地耦合到TSCIC的一个或多个电路。存储在存储器中的数据可以表征作为温度和/或时间的函数的TSCIC的行为。表征TSCIC行为的数据可以指示作为温度和/或时间的函数的晶体或晶体振荡器的频率的变化。表征TSCIC的行为的数据可以包括频率值和频率校正值中的一个或两个。

12. 发明授权

US08201995B2 Method and system for a temperature sensing crystal integrated circuit with digital temperature output 有权
标题翻译：具有数字温度输出的温度感应晶体集成电路的方法和系统
公开(公告)号：US08201995B2
公开(公告)日：2012-06-19
申请号：US12364064
申请日：2009-02-02
申请人： Evan McCarthy , John Walley , Todd L Brooks , Vinay Chandrasekhar , Josephus Van Engelen , Jared Welz
发明人： Evan McCarthy , John Walley , Todd L Brooks , Vinay Chandrasekhar , Josephus Van Engelen , Jared Welz
IPC分类号： H03L1/00
CPC分类号： G01R19/2506 , G01K7/32
摘要： Aspects of a method and system for a temperature sensing crystal Integrated circuit with digital temperature output are provided. In this regard, an indication of temperature may be generated in an integrated circuit (IC) comprising a memory, a crystal or crystal oscillator, and at least a portion of an analog-to-digital converter. The temperature indication may be digitized via the analog-to-digital converter. Operation of one or more circuits may be controlled based on the digital temperature indication. The digital temperature indication may be communicated over a communication bus. An analog portion of the analog-to-digital converter may be integrated in the IC and may comprise, for example, a delta-sigma modulator. A digital portion of the analog-to-digital converter may be external to the IC and may comprise, for example, a digital filter.
摘要翻译：提供了一种温度感应晶体的方法和系统。具有数字温度输出的集成电路。在这方面，可以在包括存储器，晶体或晶体振荡器的集成电路（IC）以及模数转换器的至少一部分中产生温度指示。温度指示可以通过模拟 - 数字转换器进行数字化。可以基于数字温度指示来控制一个或多个电路的操作。数字温度指示可以通过通信总线传送。模数转换器的模拟部分可以集成在IC中，并且可以包括例如Δ-Σ调制器。模数转换器的数字部分可以在IC的外部，并且可以包括例如数字滤波器。

13. 发明申请

US20120010839A1 METHOD AND SYSTEM FOR SIGNAL GENERATION VIA A TEMPERATURE SENSING CRYSTAL INTEGRATED CIRCUIT 有权
标题翻译：通过温度感测晶体集成电路进行信号生成的方法和系统
公开(公告)号：US20120010839A1
公开(公告)日：2012-01-12
申请号：US13237823
申请日：2011-09-20
申请人： Evan McCarthy , John Walley , Jeon Hyung-Gyu , Amir Ibrahim , Sunil Kanekal , Jared Welz
发明人： Evan McCarthy , John Walley , Jeon Hyung-Gyu , Amir Ibrahim , Sunil Kanekal , Jared Welz
IPC分类号： G06F19/00 , G01K13/00 , G01K11/00
CPC分类号： G01R19/2506 , G01K7/32
摘要： Aspects of the invention may comprise an integrated circuit comprising a memory, a temperature sensor, a crystal, and a communication module. Data stored in the memory may indicate a frequency of the crystal as a function of temperature and/or time. The memory may be writable via the communication module. Data stored in the memory of the integrated circuit may be updated based on an age and/or time of use of the integrated circuit. The time of use may be one or both of: how long the crystal has been oscillating since its most-recent start up, and how long the crystal has been in use over its lifetime. An electronic device may calculate a frequency of an oscillating signal output by the crystal based on a temperature indication from the temperature sensor and data read from the memory of the integrated circuit.
摘要翻译：本发明的方面可以包括包括存储器，温度传感器，晶体和通信模块的集成电路。存储在存储器中的数据可以指示晶体的频率作为温度和/或时间的函数。存储器可以通过通信模块写入。可以基于集成电路的使用年龄和/或使用时间来更新存储在集成电路的存储器中的数据。使用时间可以是以下之一或两者：自其最近启动以来晶体已经振荡多久，以及晶体在其使用寿命中多长时间。电子设备可以基于来自温度传感器的温度指示和从集成电路的存储器读取的数据来计算晶体输出的振荡信号的频率。

14. 发明授权

US08024145B2 Method and system for signal generation via a temperature sensing crystal integrated circuit 有权
标题翻译：通过温度感应晶体集成电路产生信号的方法和系统
公开(公告)号：US08024145B2
公开(公告)日：2011-09-20
申请号：US12364046
申请日：2009-02-02
申请人： Evan McCarthy , John Walley , Hyun-Gyu Jeon , Amir Ibrahim , Sunil Kanekal , Jared Welz
发明人： Evan McCarthy , John Walley , Hyun-Gyu Jeon , Amir Ibrahim , Sunil Kanekal , Jared Welz
IPC分类号： G06F19/00 , H03C1/62 , G01K1/00
CPC分类号： G01R19/2506 , G01K7/32
摘要： Aspects of a method and system for signal generation via a temperature sensing crystal integrated circuit are provided. In this regard, a temperature sensing crystal integrated circuit (TSCIC) comprising a memory and a crystal or crystal oscillator may generate a signal indicative of a measured temperature. The generated signal and data stored in the memory may be utilized to configure one or more circuits communicatively coupled to the TSCIC. The data stored in the memory may characterize behavior of the TSCIC as a function of temperature and/or time. The data characterizing the behavior of the TSCIC may indicate variations in frequency of the crystal or crystal oscillator as a function of temperature and/or time. The data characterizing the behavior of the TSCIC may comprise one or both of a frequency value and a frequency correction value.
摘要翻译：提供了通过温度感测晶体集成电路产生信号的方法和系统的方面。在这方面，包括存储器和晶体或晶体振荡器的温度感测晶体集成电路（TSCIC）可以产生指示测量温度的信号。存储在存储器中的产生的信号和数据可以用于配置通信地耦合到TSCIC的一个或多个电路。存储在存储器中的数据可以表征作为温度和/或时间的函数的TSCIC的行为。表征TSCIC行为的数据可以指示作为温度和/或时间的函数的晶体或晶体振荡器的频率的变化。表征TSCIC的行为的数据可以包括频率值和频率校正值中的一个或两个。

15. 发明申请

US20090224741A1 LOW POWER SUPPLY MAINTAINING CIRCUIT 审中-公开
标题翻译：低电源维护电路
公开(公告)号：US20090224741A1
公开(公告)日：2009-09-10
申请号：US12044726
申请日：2008-03-07
申请人： Bojko Marholev , Evan McCarthy
发明人： Bojko Marholev , Evan McCarthy
IPC分类号： G05F1/44 , G05F1/10
CPC分类号： G05F1/56
摘要： A circuit may include a load that is configured to enter a low power mode, a capacitor that is operably coupled to the load and that is configured to provide a minimum voltage and current for the load to maintain its state while in the low power mode, a finite state machine that is configured to receive a clock signal and to duty cycle on a periodic basis based on the clock signal and to enable a power-up signal on the periodic basis, and a low-dropout voltage regulator that is operably coupled to the finite state machine and to the capacitor and that is configured to receive the power-up signal from the finite state machine, to power on in response to receiving the power-up signal, to provide a voltage upon power on to the capacitor, and to regulate the voltage to charge the capacitor.
摘要翻译：电路可以包括配置为进入低功率模式的负载，可操作地耦合到负载的电容器，并且被配置为在负载低功率模式下为负载提供最小电压和电流以维持其状态，有限状态机，其被配置为基于时钟信号周期性地接收时钟信号和占空比，并且能够周期性地启用上电信号;以及低压差稳压器，其可操作地耦合到有限状态机和电容器，并且被配置为从有限状态机接收上电信号，响应于接收到上电信号而接通电源，以在电容器上电时提供电压，以及调节电压对电容充电。

16. 发明授权

US08360772B1 Dual arch adjustable dental impression tray 有权
标题翻译：双拱可调牙印模托盘
公开(公告)号：US08360772B1
公开(公告)日：2013-01-29
申请号：US13312943
申请日：2011-12-06
申请人： Evan McCarthy
发明人： Evan McCarthy
IPC分类号： A61C9/00
CPC分类号： A61C9/0006
摘要： The present invention relates to an adjustable dual arch dental impression tray which accommodates a wide range of upper and lower individual arch sizes.
摘要翻译：本发明涉及一种可调节的双拱牙印模托盘，其可容纳宽范围的上下单个拱形尺寸。

17. 发明授权

US06377464B1 Multiple chip module with integrated RF capabilities 有权
标题翻译：具有集成RF功能的多芯片模块
公开(公告)号：US06377464B1
公开(公告)日：2002-04-23
申请号：US09239617
申请日：1999-01-29
申请人： Hassan Hashemi , Shiaw Chang , Roger Forse , Evan McCarthy , Trang Trinh , Thuy Tran
发明人： Hassan Hashemi , Shiaw Chang , Roger Forse , Evan McCarthy , Trang Trinh , Thuy Tran
IPC分类号： H05K702
CPC分类号： H01L23/552 , H01L23/645 , H01L23/66 , H01L24/45 , H01L24/48 , H01L25/16 , H01L2223/6688 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/05599
摘要： A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.
摘要翻译：用于基带，RF或IF应用的多芯片模块（MCM）包括多个具有多个不同功能的有源电路芯片。有源电路芯片安装在基板上，该基板被配置为在单个MCM封装中提供集成子系统。 MCM包括许多功能，使其能够满足电气性能，大批量制造和低成本要求。 MCM可以采用分离接地平面来实现电子屏蔽和隔离，配置为散热片和接地连接的通孔，以及特别配置的管芯连接焊盘和暴露的接地导体焊盘。

18. 发明授权

US06885561B1 Multiple chip module with integrated RF capabilities 有权
标题翻译：具有集成RF功能的多芯片模块
公开(公告)号：US06885561B1
公开(公告)日：2005-04-26
申请号：US10020380
申请日：2001-10-30
申请人： Hassan Hashemi , Shiaw Chang , Roger Forse , Evan McCarthy , Trang Trinh , Thuy Tran
发明人： Hassan Hashemi , Shiaw Chang , Roger Forse , Evan McCarthy , Trang Trinh , Thuy Tran
IPC分类号： H01L23/12 , H01L23/552 , H01L23/64 , H01L23/66 , H01L25/04 , H01L25/16 , H01L25/18 , H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H01L23/552 , H01L23/645 , H01L23/66 , H01L24/45 , H01L24/48 , H01L25/16 , H01L2223/6688 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/48237 , H01L2924/00014 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/10253 , H01L2924/14 , H01L2924/15313 , H01L2924/181 , H01L2924/19041 , H01L2924/19107 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00 , H01L2224/05599
摘要： A multiple chip module (MCM) for use with baseband, RF, or IF applications includes a number of active circuit chips having a plurality of different functions. The active circuit chips are mounted on a substrate that is configured to provide an integrated subsystem in a single MCM package. The MCM includes a number of features that enable it to meet electrical performance, high-volume manufacturing, and low-cost requirements. The MCM may incorporate split ground planes to achieve electronic shielding and isolation, vias configured as both thermal sinks and grounding connections, and specifically configured die attach pads and exposed ground conductor pads.
摘要翻译：用于基带，RF或IF应用的多芯片模块（MCM）包括多个具有多个不同功能的有源电路芯片。有源电路芯片安装在基板上，该基板被配置为在单个MCM封装中提供集成子系统。 MCM包括许多功能，使其能够满足电气性能，大批量制造和低成本要求。 MCM可以采用分离接地平面来实现电子屏蔽和隔离，配置为散热片和接地连接的通孔，以及特别配置的管芯连接焊盘和暴露的接地导体焊盘。

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