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11. 发明授权

US08100012B2 MEMS sensor with cap electrode 有权
标题翻译：带有电极的MEMS传感器
公开(公告)号：US08100012B2
公开(公告)日：2012-01-24
申请号：US12013208
申请日：2008-01-11
申请人： John R. Martin , Xin Zhang
发明人： John R. Martin , Xin Zhang
IPC分类号： G01P15/125 , G01P1/02
CPC分类号： B81C1/00269 , B81B7/0077 , B81B2203/053 , B81C99/0045 , Y10T29/49002
摘要： A MEMS sensor includes a substrate having a MEMS structure movably attached to the substrate, a cap attached to the substrate and encapsulating the MEMS structure, and an electrode formed on the cap that senses movement of the MEMS structure.
摘要翻译： MEMS传感器包括具有可移动地附接到衬底的MEMS结构的衬底，附接到衬底并封装MEMS结构的帽以及形成在盖上的电极，其感测MEMS结构的运动。

12. 发明授权

US08076273B2 Slow release lubricant additives gel 有权
标题翻译：缓释润滑剂添加剂凝胶
公开(公告)号：US08076273B2
公开(公告)日：2011-12-13
申请号：US12861148
申请日：2010-08-23
申请人： James D. Burrington , Bruce H. Grasser , Herman F. George , John R. Martin , John K. Pudelski , James P. Roski , Barbara L. Soukup , Melinda E. Bartlett
发明人： James D. Burrington , Bruce H. Grasser , Herman F. George , John R. Martin , John K. Pudelski , James P. Roski , Barbara L. Soukup , Melinda E. Bartlett
IPC分类号： C10M141/00 , C10M169/06
CPC分类号： C10M165/00 , C10M175/0091 , C10M2207/028 , C10M2207/26 , C10M2207/262 , C10M2207/34 , C10M2215/02 , C10M2215/28 , C10M2217/043 , C10M2219/046 , C10N2210/02 , C10N2230/00 , C10N2240/10 , C10N2250/10 , F01M9/02 , F01M11/03 , F01M2001/1014
摘要： A lubricant additive gel formed by the gellation of two or more lubricant additives for the slow release of the additive components into a fluid. The lubricant additive gel slowly releases into its component lubricant additives when contacted with the fluid such as an oil thereby serving as a lubricant fluid such as an oil thereby.
摘要翻译：通过两种或多种润滑剂添加剂凝胶形成的润滑剂添加剂凝胶，用于将添加剂组分缓慢释放到流体中。润滑剂添加剂凝胶在与诸如油的流体接触时缓慢地释放到其组分润滑剂添加剂中，从而用作润滑剂流体，例如油。

13. 发明申请

US20110241176A1 Substrate Bonding with Bonding Material Having Rare Earth Metal 有权
标题翻译：具有稀土金属的接合材料的基板粘合
公开(公告)号：US20110241176A1
公开(公告)日：2011-10-06
申请号：US13161102
申请日：2011-06-15
申请人： John R. Martin , Christine H. Tsau , Timothy J. Frey
发明人： John R. Martin , Christine H. Tsau , Timothy J. Frey
IPC分类号： H01L29/02
CPC分类号： H01L23/10 , B81C1/00269 , B81C2203/0118 , H01L2924/0002 , H01L2924/01079 , H01L2924/00
摘要： A microchip has a bonding material that bonds a first substrate to a second substrate. The bonding material has, among other things, a rare earth metal and other material.
摘要翻译：微芯片具有将第一基板结合到第二基板的接合材料。接合材料尤其具有稀土金属和其它材料。

14. 发明申请

US20100317553A1 Slow Release Lubricant Additives Gel 有权
标题翻译：缓释润滑剂添加剂凝胶
公开(公告)号：US20100317553A1
公开(公告)日：2010-12-16
申请号：US12861148
申请日：2010-08-23
申请人： James D. Burrington , Bruce H. Grasser , Herman F. George , John R. Martin , John K. Pudelski , James P. Roski , Barbara L. Soukup , Melinda E. Bartlett
发明人： James D. Burrington , Bruce H. Grasser , Herman F. George , John R. Martin , John K. Pudelski , James P. Roski , Barbara L. Soukup , Melinda E. Bartlett
IPC分类号： C10M107/40
CPC分类号： C10M165/00 , C10M175/0091 , C10M2207/028 , C10M2207/26 , C10M2207/262 , C10M2207/34 , C10M2215/02 , C10M2215/28 , C10M2217/043 , C10M2219/046 , C10N2210/02 , C10N2230/00 , C10N2240/10 , C10N2250/10 , F01M9/02 , F01M11/03 , F01M2001/1014
摘要： A lubricant additive gel formed by the gellation of two or more lubricant additives for the slow release of the additive components into a fluid. The lubricant additive gel slowly releases into its component lubricant additives when contacted with the fluid such as an oil thereby serving as a lubricant fluid such as an oil thereby.
摘要翻译：通过两种或多种润滑剂添加剂凝胶形成的润滑剂添加剂凝胶，用于将添加剂组分缓慢释放到流体中。润滑剂添加剂凝胶在与诸如油的流体接触时缓慢地释放到其组分润滑剂添加剂中，从而用作润滑剂流体，例如油。

15. 发明申请

US20080315334A1 Packaged chip devices with atomic layer deposition protective films 有权
标题翻译：具有原子层沉积保护膜的封装芯片器件
公开(公告)号：US20080315334A1
公开(公告)日：2008-12-25
申请号：US12143391
申请日：2008-06-20
申请人： John R. Martin
发明人： John R. Martin
IPC分类号： H01L23/00
CPC分类号： H01L23/3107 , H01L23/291 , H01L23/3135 , H01L23/3157 , H01L2924/0002 , H01L2924/09701 , H01L2924/3025 , H01L2924/00
摘要： A low-temperature inorganic dielectric ALD film (e.g., Al2O3 and TiO2) is deposited on a packaged or unpackaged chip device so as to coat the device including any exposed electrical contacts. Such a low-temperature ALD film generally can be deposited without damaging the packaged chip device. The ALD film is typically deposited at a sufficient thickness to provide desired qualities (e.g., hermeticity for the entire packaged chip device, passivation for the electrical contacts, biocompatibility, etc.) but still allow for electrical connections to be made to the electrical contacts (e.g., by soldering or otherwise) directly through the ALD film without having to expose the electrical contacts.
摘要翻译：将低温无机介电ALD膜（例如Al 2 O 3和TiO 2）沉积在封装或未封装的芯片器件上，以便涂覆包括任何暴露的电触点的器件。这样的低温ALD膜通常可以沉积而不损坏封装的芯片器件。 ALD膜通常以足够的厚度沉积以提供期望的质量（例如，整个封装的芯片器件的气密性，电触点的钝化，生物相容性等），但仍然允许电连接到电触头（例如，通过焊接或其他方式）直接通过ALD膜而不必暴露电触头。

16. 发明授权

US07364942B2 Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor 有权
标题翻译：用于晶片级处理以减少静摩擦和钝化微加工表面和用于其的化合物的方法
公开(公告)号：US07364942B2
公开(公告)日：2008-04-29
申请号：US11786515
申请日：2007-04-12
申请人： John R. Martin
发明人： John R. Martin
IPC分类号： H01L21/00
CPC分类号： H01L21/3122 , B81B3/0005 , B81C1/0096 , B81C2201/0176 , B81C2201/112 , H01L21/02126 , H01L21/02216 , H01L21/02263 , H01L24/05 , H01L24/45 , H01L2224/05624 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48624 , H01L2224/73265 , H01L2924/01079 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/16152 , H01L2924/3025 , H01L2924/00 , H01L2924/00014
摘要： This invention discloses a process for forming durable anti-stiction surfaces on micromachined structures while they are still in wafer form (i.e., before they are separated into discrete devices for assembly into packages). This process involves the vapor deposition of a material to create a low stiction surface. It also discloses chemicals which are effective in imparting an anti-stiction property to the chip. These include polyphenylsiloxanes, silanol terminated phenylsiloxanes and similar materials.
摘要翻译：本发明公开了一种在微加工结构上形成持久的抗静电表面的方法，同时它们仍然是晶片形式（即，在它们被分离成用于组装成包装的分立装置之前）。该方法涉及材料的气相沉积以产生低粘度表面。它还公开了有效赋予芯片抗静电性能的化学品。这些包括聚苯基硅氧烷，硅烷醇封端的苯基硅氧烷和类似的材料。

17. 外观设计

USD512249S1 Desk 失效
公开(公告)号：USD512249S1
公开(公告)日：2005-12-06
申请号：US29202164
申请日：2004-03-26
申请人： John R. Martin
设计人： John R. Martin

18. 发明授权

US06911727B1 Package for sealing an integrated circuit die 失效
公开(公告)号：US06911727B1
公开(公告)日：2005-06-28
申请号：US10662895
申请日：2003-09-15
申请人： John R. Martin , Carl M. Roberts, Jr.
发明人： John R. Martin , Carl M. Roberts, Jr.
IPC分类号： G01P1/02 , H01L23/02 , H01L23/12
CPC分类号： B81C1/00269 , B81B7/0051 , G01P1/023 , G01P15/125 , G01P2015/0814 , H01L23/10 , H01L23/49503 , H01L23/49513 , H01L24/48 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01019 , H01L2924/01079 , H01L2924/07802 , H01L2924/10157 , H01L2924/10253 , H01L2924/14 , H01L2924/1461 , H01L2924/16235 , H01L2924/181 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A die has a part that is sealed with a cap. The seal can be hermetic or non-hermetic. If hermetic, a layer of glass or metal is formed in the surface of the die, and the cap has a layer of glass or metal at a peripheral area so that, when heated, the layers form a hermetic seal. A non-hermetic seal can be formed by bonding a cap with a patterned adhesive. The cap, which can be silicon or can be a metal paddle, is electrically coupled to a fixed voltage to shield the part of the die.

19. 发明授权

US06526686B1 Power storage unit charging system for firearm 失效
标题翻译：火器蓄电单元充电系统
公开(公告)号：US06526686B1
公开(公告)日：2003-03-04
申请号：US09999337
申请日：2001-11-01
申请人： Charles Richard Poff, Jr. , John R. Martin , David C. Nethercot
发明人： Charles Richard Poff, Jr. , John R. Martin , David C. Nethercot
IPC分类号： F41A1900
CPC分类号： F41A19/62
摘要： An electric charging system for a firearm includes a port in operable communication with a chamber adapted to receive an amount of expanding gas created by an ignited charge, and a cavity in operable communication with the port and adapted to receive an amount of the expanding gas therefrom. The charging system also includes a charging assembly in operable communication with the cavity, wherein the charging assembly creates an electric charge when impinged by the expanding gas located within the cavity, and a conductor in electrical communication with the charging assembly, wherein the conductor receives the electrical charge from the charging assembly. The charging system further includes a power storage unit in electrical communication with the conductor, wherein the storage unit stores the electrical charge received from the conductor.
摘要翻译：用于枪支的充电系统包括与适于接收由点燃电荷产生的一定量的膨胀气体的室可操作地连通的端口，以及与端口可操作地连通并适于从其接收一定量的膨胀气体的空腔。充电系统还包括与空腔可操作地连通的充电组件，其中充电组件在由位于空腔内的膨胀气体冲击时产生电荷，以及与充电组件电连通的导体，其中导体接收充电组件的电荷。充电系统还包括与导体电连通的蓄电单元，其中存储单元存储从导体接收的电荷。

20. 发明授权

US06358771B1 Low oxygen assembly of glass sealed packages 失效
标题翻译：玻璃密封包装的低氧组装
公开(公告)号：US06358771B1
公开(公告)日：2002-03-19
申请号：US09109434
申请日：1998-07-02
申请人： John R. Martin
发明人： John R. Martin
IPC分类号： H01L2144
CPC分类号： H01L23/10 , H01L21/50 , H01L24/48 , H01L2224/05599 , H01L2224/45099 , H01L2224/48091 , H01L2224/48247 , H01L2224/85399 , H01L2924/00014 , H01L2924/01012 , H01L2924/09701 , H01L2924/16152 , H01L2224/45015 , H01L2924/207
摘要： A micromachined accelerometer is hermetically sealed in a reduced oxygen environment to allow organics to survive high temperature sealing processes.
摘要翻译：微机加速度计密封在减氧环境中，以使有机物能够经受高温密封过程。

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