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    • 15. 发明申请
    • Direct contact cooling liquid embedded package for a central processor unit
    • 直接接触式冷却液嵌入式封装,用于中央处理器单元
    • US20070177352A1
    • 2007-08-02
    • US11345957
    • 2006-02-02
    • Ali MonfaradJi Yang
    • Ali MonfaradJi Yang
    • H05K7/20
    • H01L23/473H01L2224/16H01L2224/73204H01L2924/16152
    • A direct contact cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The direct contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and direct contact cooling liquid of the heat-generating portion of the CPU. A direct contact cooling liquid embedded packaged CPU removes higher levels of heat directly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serve to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inlet and outletting cooling liquid into and out of the CPU package.
    • 与计算机中央处理器单元一起使用的直接接触冷却液嵌入式封装设计适用于诸如服务器处理器之类的高散热电子元件的热管理。 直接接触冷却液嵌入式封装式CPU具有机械耦合和嵌入式管道,其连接到板的泵送液体供应和CPU的发热部分的直接接触冷却液体。 直接接触式冷却液嵌入式封装的CPU通过对流冷却直接从处理器的核心移除更高水平的热量。 冷却液通过插座互连机械地将CPU机械地连接到电路板而被引入到服务器CPU的封装中。 插座的引脚用于在电路板和CPU之间提供电气连接,而几个引脚设计用于将冷却液入口和出口进出CPU组件。
    • 16. 发明申请
    • Embedded microchannel cooling package for a central processor unit
    • 用于中央处理器单元的嵌入式微通道冷却封装
    • US20070177351A1
    • 2007-08-02
    • US11345722
    • 2006-02-02
    • Ali MonfaradJi Yang
    • Ali MonfaradJi Yang
    • H05K7/20
    • H01L23/473H01L2924/0002H01L2924/00
    • An indirect cooling liquid embedded package design for use with a computer central processor unit is suitable for thermal management of high heat dissipation electronic components such as server processors. The indirect contact cooling liquid embedded packaged CPU has mechanical coupling and embedded plumbing that attaches to the board pumped liquid supply and indirect cooling of the heat-generating portion of the CPU with an embedded microchannel heat exchanger. The coolant package system for the CPU removes higher levels of heat indirectly from the core of the processors by convective cooling. Cooling liquid is introduced into the package of the server CPU by mechanically attaching the CPU to the board through a socket interconnect. Pins of the socket serves to provide electrical connection between the board and the CPU, while a few pins are designed for the purpose of inletting and outletting cooling liquid into and out of the CPU package.
    • 与计算机中央处理器单元一起使用的间接冷却液嵌入式封装设计适用于高散热电子元件(如服务器处理器)的热管理。 间接接触冷却液嵌入式封装CPU具有机械耦合和嵌入式管道,其利用嵌入式微通道热交换器连接到板上泵送液体供应和间接冷却CPU的发热部分。 用于CPU的冷却剂包装系统通过对流冷却从处理器的核心间接地除去较高水平的热量。 冷却液通过插座互连机械地将CPU机械地连接到电路板而被引入到服务器CPU的封装中。 插座的引脚用于在板和CPU之间提供电气连接,而几个引脚设计用于将冷却液引入和流出CPU封装的入口和出口。