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    • 11. 发明申请
    • VACUUM CARRIERS FOR SUBSTRATE BONDING
    • 用于基板结合的真空载体
    • US20150041524A1
    • 2015-02-12
    • US13959867
    • 2013-08-06
    • International Business Machines Corporation
    • Vijayeshwar D. KhannaSri M. Sri-Jayantha
    • B23K3/08B25B11/00
    • B23K3/087B23K1/0016B23K37/0408B23K37/0426B23K37/0435B23K37/0443B25B11/005
    • A vacuum carrier can be employed to provide a partial vacuum on a back side surface of a substrate thereby holding the substrate flat against a rigid surface of the carrier throughout the duration of a bonding process. The magnitude of vacuum can be optimized to limit the warping of the substrate during and after bonding with another substrate, and to limit the mechanical stress induced in the solder balls during cooling. The vacuum carrier can include a base plate, a seal plate with at least one opening configured to accommodate at least one substrate, and vacuum seal elements configured to create a vacuum environment that pushes the substrate against the base plate when the vacuum carrier is under vacuum. The configuration of the vacuum carrier is chosen to avoid distortion of the substrate due to the vacuum seal elements, while allowing adjustment of the magnitude of the partial vacuum.
    • 可以使用真空载体来在基板的背面提供部分真空,从而在粘合过程的整个持续时间期间将基板平坦地抵靠载体的刚性表面。 可以优化真空的大小以限制在与另一基板接合期间和之后的基板的翘曲,并且限制在冷却期间在焊球中引起的机械应力。 真空载体可以包括基板,密封板,其具有构造成容纳至少一个基板的至少一个开口,以及真空密封元件,其构造成当真空载体处于真空下时产生将基板推靠在基板上的真空环境 。 选择真空载体的构造以避免由于真空密封元件而引起的基板变形,同时允许调整部分真空的大小。