专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明授权

US09215805B2 Wiring board with built-in electronic component and method for manufacturing the same 有权
标题翻译：具有内置电子部件的接线板及其制造方法
公开(公告)号：US09215805B2
公开(公告)日：2015-12-15
申请号：US13749059
申请日：2013-01-24
申请人： IBIDEN CO., LTD.
发明人： Masahiro Zanma , Toshiki Furutani , Yukinobu Mikado
IPC分类号： H05K1/16 , H05K1/11 , H05K7/00 , H05K1/18 , H05K3/30 , H05K3/46
CPC分类号： H05K1/115 , H05K1/185 , H05K3/305 , H05K3/4602 , H05K3/4652 , H05K2201/0195 , H05K2201/10015 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/4913
摘要： A wiring board including a substrate having opening penetrating from first to second surfaces, an electronic component in the opening having first and second electrodes, a first insulation layer over the first surface, a second insulation layer over the second surface, a first via conductor in the first layer having bottom connected to the first electrode, a second via conductor in the first layer having bottom connected to the second electrode, a third via conductor in the second layer having bottom connected to the first electrode, and a fourth via conductor in the second layer having bottom connected to the second electrode. The first conductor is longer than the third conductor and has the bottom having greater width than the bottom of the third conductor, and the second conductor is longer than the fourth conductor and has the bottom having greater width than the bottom of the fourth conductor.
摘要翻译：一种布线基板，包括具有从第一至第二表面穿透的开口的基板，所述开口中的电子部件具有第一和第二电极，所述第一表面上的第一绝缘层，所述第二表面上的第二绝缘层，所述第一层具有底部连接到所述第一电极，所述第一层中的第二通孔导体具有底部连接到所述第二电极，所述第二层中的第三通孔导体具有底部连接到所述第一电极，以及第四通孔导体，底部连接到第二电极的第二层。第一导体比第三导体长，并且底部具有比第三导体的底部更大的宽度，并且第二导体比第四导体长，并且底部具有比第四导体的底部更大的宽度。

12. 发明授权

US09204552B2 Printed wiring board 有权
标题翻译：印刷电路板
公开(公告)号：US09204552B2
公开(公告)日：2015-12-01
申请号：US13685777
申请日：2012-11-27
申请人： IBIDEN Co., Ltd.
发明人： Toshiki Furutani , Yukinobu Mikado , Mitsuhiro Tomikawa
IPC分类号： H05K1/16 , H05K1/18 , H05K1/02 , H05K3/46
CPC分类号： H05K1/181 , H01L24/19 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2924/15311 , H01L2924/3511 , H05K1/0231 , H05K1/185 , H05K3/4697 , H05K2201/09527 , H05K2201/096
摘要： A printed wiring board includes a core substrate, an electronic component accommodated in the substrate, a first buildup structure formed on surface of the substrate and including an interlayer insulation layer, and a second buildup structure formed on the opposing surface of the substrate and including an interlayer insulation layer. The substrate includes a core material portion including multiple resin layers, a first conductive layer formed on first surface of the core portion and a second conductive layer formed on second surface of the core portion, the core portion has opening through the resin layers and accommodating the component, the insulation layer of the first structure is positioned such that the opening of the core portion is covered on the first surface, and the insulation layer of the second structure is positioned such that the opening of the core portion is covered on the second surface.
摘要翻译：印刷电路板包括芯基板，容纳在基板中的电子部件，形成在基板的表面上并且包括层间绝缘层的第一累积结构和形成在基板的相对表面上的第二累积结构，层间绝缘层。基板包括具有多个树脂层的芯材部分，形成在芯部的第一表面上的第一导电层和形成在芯部的第二表面上的第二导电层，芯部具有通过树脂层的开口并容纳第一结构的绝缘层被定位成使得芯部的开口被覆盖在第一表面上，并且第二结构的绝缘层被定位成使得芯部的开口被覆盖在第二表面上。

13. 发明授权

US09119322B2 Wiring board and method for manufacturing the same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US09119322B2
公开(公告)日：2015-08-25
申请号：US14510219
申请日：2014-10-09
申请人： IBIDEN CO., LTD.
发明人： Yukinobu Mikado , Shunsuke Sakai , Takashi Kariya , Toshiki Furutani
IPC分类号： H05K1/18 , H05K3/30 , H01G2/06 , H05K1/11 , H05K3/32 , H05K1/02 , H05K3/46
CPC分类号： H05K1/185 , H01G2/06 , H05K1/0207 , H05K1/115 , H05K3/30 , H05K3/32 , H05K3/4602 , H05K2201/09827 , H05K2201/10015 , H05K2201/10522 , H05K2201/1053 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/49146
摘要： A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.
摘要翻译：布线板包括具有开口部分的基板，位于基板的开口部分中的电子部件，并且包括第一和第二电子部件，以及形成在基板和第一和第二部件上的绝缘层。第一部件具有在第一部件的侧面具有侧部的第一电极和第二电极，第二部件具有第一部件和第二电极，第一部件的第一电极和第二电极具有在第二部件的侧面上的侧面部分，第一部件的第一电极和第一部件的第一电极第二部件被设定为具有大致相同的电位，并且第一部件和第二部件位于基板的开口部分中，使得第一部件的第一电极的侧部位于第二部件的侧部第二部件的第一电极。

14. 发明申请

US20130284506A1 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有内置电子元件的接线板及其制造方法
公开(公告)号：US20130284506A1
公开(公告)日：2013-10-31
申请号：US13749059
申请日：2013-01-24
申请人： IBIDEN CO., LTD.
发明人： Masahiro ZANMA , Toshiki Furutani , Yukinobu Mikado
IPC分类号： H05K1/11 , H05K3/30
CPC分类号： H05K1/115 , H05K1/185 , H05K3/305 , H05K3/4602 , H05K3/4652 , H05K2201/0195 , H05K2201/10015 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/4913
摘要： A wiring board including a substrate having opening penetrating from first to second surfaces, an electronic component in the opening having first and second electrodes, a first insulation layer over the first surface, a second insulation layer over the second surface, a first via conductor in the first layer having bottom connected to the first electrode, a second via conductor in the first layer having bottom connected to the second electrode, a third via conductor in the second layer having bottom connected to the first electrode, and a fourth via conductor in the second layer having bottom connected to the second electrode. The first conductor is longer than the third conductor and has the bottom having greater width than the bottom of the third conductor, and the second conductor is longer than the fourth conductor and has the bottom having greater width than the bottom of the fourth conductor.
摘要翻译：一种布线基板，包括具有从第一至第二表面穿透的开口的基板，所述开口中的电子部件具有第一和第二电极，所述第一表面上的第一绝缘层，所述第二表面上的第二绝缘层，所述第一层具有底部连接到所述第一电极，所述第一层中的第二通孔导体具有底部连接到所述第二电极，所述第二层中的第三通孔导体具有底部连接到所述第一电极，以及第四通孔导体，底部连接到第二电极的第二层。第一导体比第三导体长，并且底部具有比第三导体的底部更大的宽度，并且第二导体比第四导体长，并且底部具有比第四导体的底部更大的宽度。

15. 发明申请

US20130256007A1 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：具有内置电子元件的接线板及其制造方法
公开(公告)号：US20130256007A1
公开(公告)日：2013-10-03
申请号：US13729998
申请日：2012-12-28
申请人： IBIDEN CO., LTD.
发明人： Toshiki Furutani , Yukinobu Mikado , Mitsuhiro Tomikawa , Yuki Tanaka
IPC分类号： H05K1/18 , H05K3/30
CPC分类号： H05K1/185 , H01L24/19 , H01L2224/04105 , H01L2224/16227 , H01L2224/2518 , H01L2224/73267 , H01L2224/92144 , H01L2924/15153 , H01L2924/3511 , H05K3/306 , H05K3/4652 , H05K2201/10636 , H05K2203/1469 , Y02P70/611 , Y10T29/49139
摘要： A wiring board includes a substrate having a cavity, an electronic component positioned in the cavity and having a first-side electrode on one side of the electronic component and a second-side electrode on the opposite side of the electronic component, an insulation layer formed on a surface of the substrate and the electronic component such that the insulation layer covers the electronic component positioned in the substrate, and a conductive layer formed on the surface of the substrate and including linear conductive patterns surrounding an opening of the cavity on the surface of the substrate. The linear conductive patterns include a first linear conductive pattern positioned adjacent to the first-side electrode and a second linear conductive pattern positioned adjacent to the second-side electrode such that the first linear conductive pattern and the second linear conductive pattern are insulated from each other.
摘要翻译：布线板包括具有空腔的基板，位于空腔中的电子部件，并且在电子部件的一侧具有第一侧电极，在电子部件的相对侧具有第二侧电极，形成绝缘层在基板和电子部件的表面上，使得绝缘层覆盖位于基板中的电子部件，以及形成在基板的表面上的导电层，并且包括在该表面上的空腔的开口周围的线性导电图案底物。线性导电图案包括与第一侧电极相邻定位的第一线性导电图案和邻近第二侧电极定位的第二线性导电图案，使得第一线性导电图案和第二线性导电图案彼此绝缘。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式