专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

11. 发明申请

US20140042487A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE 有权
公开(公告)号：US20140042487A1
公开(公告)日：2014-02-13
申请号：US14055675
申请日：2013-10-16
申请人： Hwan Hee JEONG , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee JEONG , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01L33/40
CPC分类号： H01L33/44 , F21K9/23 , F21Y2105/10 , F21Y2113/13 , F21Y2115/10 , H01L33/0079 , H01L33/06 , H01L33/10 , H01L33/22 , H01L33/32 , H01L33/36 , H01L33/38 , H01L33/387 , H01L33/40 , H01L33/42 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2924/0002 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.

12. 发明授权

US08575644B2 Light emitting device having an electro-static discharge protection part 有权
标题翻译：具有静电放电保护部的发光装置
公开(公告)号：US08575644B2
公开(公告)日：2013-11-05
申请号：US13192142
申请日：2011-07-27
申请人： Hwan Hee Jeong , Sang Youl Lee , Jung Hyeok Bae , Kwang Ki Choi , June O Song
发明人： Hwan Hee Jeong , Sang Youl Lee , Jung Hyeok Bae , Kwang Ki Choi , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L27/15 , H01L33/0079 , H01L33/405 , H01L33/44 , H01L2224/48227 , H01L2924/12032 , H01L2924/00
摘要： Provided are a light emitting device and a light emitting device package. According to the light emitting device, a light emitting part and an electro-static discharge (ESD) protection part are disposed on a conductive support member. A connection layer electrically connects a first conducitve type semiconductor layer of the light emitting part to a second conductive type semiconductor layer of the ESD protection part. A ptrtection member is disposed on the connection layer and the ESD protection layer.
摘要翻译：提供了一种发光器件和发光器件封装。根据发光装置，发光部和静电放电（ESD）保护部设置在导电性支撑部件上。连接层将发光部的第一导通型半导体层与ESD保护部的第二导电型半导体层电连接。保护构件设置在连接层和ESD保护层上。

13. 发明授权

US08471241B2 Light emitting device, light emitting device package, and lighting system 有权
标题翻译：发光装置，发光装置封装和照明系统
公开(公告)号：US08471241B2
公开(公告)日：2013-06-25
申请号：US13049126
申请日：2011-03-16
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song , Ji Hyung Moon
IPC分类号： H01L33/06
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/22 , H01L33/385 , H01L33/44 , H01L2924/0002 , H01L2924/00
摘要： Provided are a light emitting device, a light emitting device package, and a lighting system. The light emitting device includes a light emitting structure layer, a conductive layer, a bonding layer, a support member, first and second pads, and first and second electrodes. The light emitting structure layer includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer. The conductive layer is disposed under the light emitting structure layer. The bonding layer is disposed under the conductive layer. The support member is disposed under the bonding layer. The first pad is disposed under the support member. The second pad is disposed under the support member at a distance from the first pad. The first electrode is connected between the first conductive type semiconductor layer and the first pad. The second electrode is connected between the bonding layer and the second pad.
摘要翻译：提供了一种发光器件，发光器件封装和照明系统。发光器件包括发光结构层，导电层，接合层，支撑构件，第一和第二焊盘以及第一和第二电极。发光结构层包括第一导电类型半导体层，有源层和第二导电类型半导体层。导电层设置在发光结构层的下方。接合层设置在导电层下方。支撑构件设置在接合层下方。第一衬垫设置在支撑构件的下方。第二垫片设置在支撑构件的下方距离第一垫片一定距离处。第一电极连接在第一导电类型半导体层和第一焊盘之间。第二电极连接在接合层和第二焊盘之间。

14. 发明授权

US08421112B2 Light emitting device and light emitting device package having the same 有权
标题翻译：发光器件和具有该发光器件的发光器件封装
公开(公告)号：US08421112B2
公开(公告)日：2013-04-16
申请号：US12986592
申请日：2011-01-07
申请人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , Ji Hyung Moon , June O Song , Kwang Ki Choi
IPC分类号： H01L31/0224
CPC分类号： H01L33/44 , H01L33/0079 , H01L33/382 , H01L33/385 , H01L33/62 , H01L2224/48091 , H01L2933/0016 , H01L2924/00014
摘要： Disclosed are a light emitting device and a light emitting device package having the same. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer; a first electrode layer under the second conductive semiconductor layer; an electrode including a top surface making contact with a part of a bottom surface of the first conductive semiconductor layer; and an insulating member for covering an outer peripheral surface of the electrode, wherein a part of the insulating member extends into a region between the second conductive semiconductor layer and the first electrode layer from a bottom surface of the electrode.
摘要翻译：公开了一种发光器件和具有该发光器件的发光器件封装。发光器件包括发光结构，其包括第一导电半导体层，第一导电半导体层下方的有源层和有源层下的第二导电半导体层; 第二导电半导体层下面的第一电极层; 电极，其包括与所述第一导电半导体层的底表面的一部分接触的顶表面; 以及用于覆盖电极的外周面的绝缘构件，其中绝缘构件的一部分从电极的底面延伸到第二导电半导体层和第一电极层之间的区域中。

15. 发明授权

US08421105B2 Semiconductor light-emitting device and method for fabricating the same 有权
公开(公告)号：US08421105B2
公开(公告)日：2013-04-16
申请号：US12793770
申请日：2010-06-04
申请人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Tchang Hun Oh , Hee Seok Choi , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Tchang Hun Oh , Hee Seok Choi , Kwang Ki Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/44 , H01L33/0075 , H01L33/0079 , H01L33/145 , H01L33/22 , H01L33/24 , H01L33/32 , H01L33/38 , H01L33/40 , H01L33/405 , H01L2224/48091 , H01L2933/0016 , H01L2924/00014
摘要： A semiconductor light-emitting device is provided. The semiconductor light-emitting device may include a light-emitting structure, an electrode, an ohmic layer, an electrode layer, an adhesion layer, and a channel layer. The light-emitting structure may include a compound semiconductor layer. The electrode may be disposed on the light-emitting structure. The ohmic layer may be disposed under the light-emitting structure. The electrode layer may include a reflective metal under the ohmic layer. The adhesion layer may be disposed under the electrode layer. The channel layer may be disposed along a bottom edge of the light-emitting structure.

16. 发明授权

US08772803B2 Semiconductor light-emitting device and method for fabricating the same 有权
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US08772803B2
公开(公告)日：2014-07-08
申请号：US12796044
申请日：2010-06-08
申请人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Kwang Ki Choi
发明人： Hwan Hee Jeong , Sang Youl Lee , June O Song , Kwang Ki Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/40 , H01L33/22 , H01L33/32 , H01L2224/45139 , H01L2224/48091 , H01L2924/00011 , H01L2924/00014 , H01L2924/00 , H01L2924/01039
摘要： A semiconductor light-emitting device is provided that may include an electrode layer, a light-emitting structure including a compound semiconductor layer on the electrode layer, and an electrode on the light-emitting structure, wherein the electrode includes an ohmic contact layer that contacts the compound semiconductor layer, a first barrier layer on the ohmic contact layer, a conductive layer including copper on the first barrier layer, a second barrier layer on the conductive layer, and a bonding layer on the second barrier layer.
摘要翻译：提供了一种半导体发光器件，其可以包括电极层，在电极层上包括化合物半导体层的发光结构和发光结构上的电极，其中电极包括接触的欧姆接触层所述化合物半导体层，所述欧姆接触层上的第一阻挡层，在所述第一阻挡层上包含铜的导电层，所述导电层上的第二阻挡层，以及所述第二阻挡层上的接合层。

17. 发明授权

US08659714B2 Light emitting device 有权
标题翻译：发光装置
公开(公告)号：US08659714B2
公开(公告)日：2014-02-25
申请号：US13219860
申请日：2011-08-29
申请人： Hwan Hee Jeong , Sang Youl Lee , Kwang Ki Choi , June O Song
发明人： Hwan Hee Jeong , Sang Youl Lee , Kwang Ki Choi , June O Song
IPC分类号： G02F1/136
CPC分类号： H01L33/40 , H01L21/28575 , H01L29/2003 , H01L33/025 , H01L33/30
摘要： A light emitting device includes a light emitting structure comprising a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer; a first ohmic layer and a first electrode provided on the first conductivity type semiconductor layer; and a second electrode provided on the second conductivity type semiconductor layer, wherein a contact area between the first conductivity type semiconductor layer and the first ohmic layer comprises oxygen at 5% or more of an atomic ratio or nitrogen at 50% or more of an atomic ratio.
摘要翻译：发光器件包括：发光结构，包括第一导电类型半导体层，有源层和第二导电类型半导体层; 第一欧姆层和设置在第一导电类型半导体层上的第一电极; 以及设置在所述第二导电类型半导体层上的第二电极，其中所述第一导电类型半导体层和所述第一欧姆层之间的接触面积包含原子比为5％以上的氧或者为原子比为50％以上的氮比。

18. 发明授权

US08637885B2 Light emitting device, light emitting device package, method of manufacturing light emitting device and lighting system 有权
标题翻译：发光器件，发光器件封装，制造发光器件和照明系统的方法
公开(公告)号：US08637885B2
公开(公告)日：2014-01-28
申请号：US13027952
申请日：2011-02-15
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/48 , H01L27/15 , H01L33/007 , H01L33/0079 , H01L33/20 , H01L33/385 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： A light emitting device according to the embodiment includes a conductive support member; a light emitting structure on the conductive support member including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second semiconductor layers; and a protective device on the light emitting structure.
摘要翻译：根据实施例的发光器件包括导电支撑构件; 所述导电支撑构件上的发光结构包括在所述第一和第二半导体层之间的第一导电半导体层，第二导电半导体层和有源层; 以及在发光结构上的保护装置。

19. 发明授权

US08610157B2 Light emitting apparatus 有权
标题翻译：发光装置
公开(公告)号：US08610157B2
公开(公告)日：2013-12-17
申请号：US12964161
申请日：2010-12-09
申请人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
发明人： Kwang Ki Choi , Hwan Hee Jeong , Sang Youl Lee , June O Song
IPC分类号： H01L33/00
CPC分类号： H01L33/60 , H01L33/20 , H01L33/38 , H01L33/44 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2924/0002 , H01L2924/12032 , H01L2924/00 , H01L2924/00014
摘要： A light emitting device including a contact layer, a blocking layer over the contact layer, a protection layer adjacent the blocking layer, a light emitter over the blocking layer, and an electrode layer coupled to the light emitter. The electrode layer overlaps the blocking layer and protection layer, and the blocking layer has an electrical conductivity that substantially blocks flow of current from the light emitter in a direction towards the contact layer. In addition, the protection layer may be conductive to allow current to flow to the light emitter or non-conductive to block current from flowing from the light emitter towards the contact layer.
摘要翻译：一种发光器件，包括接触层，接触层上的阻挡层，与阻挡层相邻的保护层，阻挡层上的发光体以及耦合到光发射器的电极层。电极层与阻挡层和保护层重叠，并且阻挡层具有导电性，其基本上阻挡来自光发射器的电流沿朝向接触层的方向。此外，保护层可以是导电的，以允许电流流到光发射器或不导电以阻止电流从发光体朝向接触层流动。

20. 发明授权

US08525215B2 Light emitting device, method of manufacturing the same, light emitting device package, and lighting system 有权
标题翻译：发光器件，其制造方法，发光器件封装和照明系统
公开(公告)号：US08525215B2
公开(公告)日：2013-09-03
申请号：US13175424
申请日：2011-07-01
申请人： Kwang Ki Choi , Hwan Hee Jeong , Ji hyung Moon , Sang Youl Lee , June O Song , Se Yeon Jung , Tae-Yeon Seong
发明人： Kwang Ki Choi , Hwan Hee Jeong , Ji hyung Moon , Sang Youl Lee , June O Song , Se Yeon Jung , Tae-Yeon Seong
IPC分类号： H01L33/42
CPC分类号： H01L33/22 , H01L33/14 , H01L2224/48091 , H01L2924/12032 , H01L2924/00014 , H01L2924/00
摘要： Provided are a light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system. The light emitting device includes: a light emitting structure layer including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; an oxide protrusion disposed on at least a portion of the second conducive semiconductor layer; and a current spreading layer on the second conductive semiconductor layer and the oxide protrusion.
摘要翻译：提供了发光器件，其制造方法，发光器件封装和照明系统。发光器件包括：包括第一导电半导体层，有源层和第二导电半导体层的发光结构层; 设置在所述第二导电半导体层的至少一部分上的氧化物突起; 以及在第二导电半导体层和氧化物突起上的电流扩展层。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式