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    • 14. 发明申请
    • Method For Manufacturing Semiconductor Device
    • 制造半导体器件的方法
    • US20080160783A1
    • 2008-07-03
    • US10598961
    • 2004-05-28
    • Tomoyuki WatanabeAtsushi Yoshinouchi
    • Tomoyuki WatanabeAtsushi Yoshinouchi
    • H01L21/469
    • H01L21/02129H01L21/02131H01L21/3165H01L21/76232H01L21/76801H01L21/76837H01L2924/0002H01L2924/00
    • A method for manufacturing semiconductor device according to the present invention comprises a first film forming step of forming, on a concave and convex portion formed by an element on a semiconductor substrate, an oxidation preventive layer which prevents permeation of moisture into the element; a second film forming step of forming, on this oxidation preventive layer, an expansion layer which can be oxidized and expanded by a heat treatment in an oxidation atmosphere; a third film forming step of forming, on this expansion layer, an insulating film which can be fluidized by the heat treatment in the oxidation atmosphere; and an expansion step of subjecting, to the heat treatment in the oxidation atmosphere, the semiconductor substrate on which the oxidation preventive layer, the expansion layer and the insulating film have been formed, to fluidize the insulating film and to oxidize and expand the expansion layer, thereby eliminating bubbles generated in the insulating film.
    • 根据本发明的制造半导体器件的方法包括:第一膜形成步骤,在由半导体衬底上的元件形成的凹凸部上形成防止水分渗透到元件中的防氧化层; 在该氧化防止层上形成能够在氧化气氛中进行热处理而被氧化膨胀的膨胀层的第二成膜工序; 在该膨胀层上形成能够在氧化气氛中通过热处理而流化的绝缘膜的第三成膜工序; 以及在氧化气氛中对其上形成有氧化层,膨胀层和绝缘膜的半导体衬底进行热处理以使绝缘膜流化并使膨胀层氧化和膨胀的膨胀步骤 从而消除在绝缘膜中产生的气泡。