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11. 发明授权

US09278425B2 Polishing head and polishing apparatus 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US09278425B2
公开(公告)日：2016-03-08
申请号：US13522370
申请日：2011-01-20
申请人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
发明人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B37/30 , B24B37/32 , H01L21/02
CPC分类号： B24B37/30 , B24B37/32 , H01L21/02024
摘要： A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.
摘要翻译：一种抛光头，其包括在抛光头本体下面的由盘形中间板保持的橡胶膜和设置在橡胶膜周围的橡胶膜周围的环形引导环，橡胶膜在橡胶膜的下表面部分上保持工件的后表面。抛光头还包括通过弹性膜联接到抛光头本体并且保持引导环和中间板的基部构件，使得在抛光期间导向环的下表面不接触抛光垫。抛光头和抛光装置可以在粗抛光工艺和最终抛光工艺中操作，可以稳定地实现工件抛光中预定的高平整度和高抛光余料去除均匀性，并且可以获得具有更少的具有直径为45nm以上。

12. 发明申请

US20120289129A1 POLISHING HEAD AND POLISHING APPARATUS 有权
标题翻译：抛光头和抛光装置
公开(公告)号：US20120289129A1
公开(公告)日：2012-11-15
申请号：US13522370
申请日：2011-01-20
申请人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
发明人： Hiromasa Hashimoto , Kouji Morita , Takashi Aratani , Hiromi Kishida , Satoru Arakawa
IPC分类号： B24B41/06 , B24B37/10
CPC分类号： B24B37/30 , B24B37/32 , H01L21/02024
摘要： A polishing head including, below a polishing head body, a rubber film held by a disk-shaped mid plate and an annular guide ring disposed around the rubber film holding the back surface of the workpiece on a lower face portion of the rubber film. The polishing head also includes a base member that is coupled to a polishing head body through an elastic film and holds the guide ring and the mid plate such that the lower surface of the guide ring does not contact the polishing pad during polishing. The polishing head and polishing apparatus, are operable in both of the rough polishing process and final polishing process, that can stably achieve predetermined high flatness and high polishing stock removal uniformity in polishing of a workpiece and can obtain a workpiece with fewer fine particles having a diameter of 45 nm or more.
摘要翻译：一种抛光头，其包括在抛光头本体下面的由盘形中间板保持的橡胶膜和设置在橡胶膜周围的橡胶膜周围的环形引导环，橡胶膜在橡胶膜的下表面部分上保持工件的后表面。抛光头还包括通过弹性膜联接到抛光头本体并且保持引导环和中间板的基部构件，使得导向环的下表面在抛光期间不接触抛光垫。抛光头和抛光装置可以在粗抛光工艺和最终抛光工艺中操作，可以稳定地实现工件抛光中预定的高平整度和高抛光余料去除均匀性，并且可以获得具有更少的具有直径为45nm以上。

13. 发明授权

US08886486B2 Device and method for testing APD measuring device 有权
标题翻译：测试APD测量装置的装置和方法
公开(公告)号：US08886486B2
公开(公告)日：2014-11-11
申请号：US13313303
申请日：2011-12-07
申请人： Sunao Ronte , Satoru Arakawa
发明人： Sunao Ronte , Satoru Arakawa
IPC分类号： G01C25/00 , G01R23/16 , G01R35/00
CPC分类号： G01R23/16 , G01R35/00
摘要： To accurately test the operating state of the APD measuring device. A test device 40 includes a test signal generator 41 that generates a test signal corresponding to the center frequency of a signal to be measured and a control unit 42 that variably controls the amplitude level of a test signal in the dynamic range of an APD measuring device 1 at random, in order to test the operating state of the APD measuring device 1.
摘要翻译：准确测试APD测量装置的运行状态。测试装置40包括产生与待测信号的中心频率对应的测试信号的测试信号发生器41以及可变地控制APD测量装置的动态范围内的测试信号的振幅电平的控制单元42 1，以测试APD测量装置1的工作状态。

14. 发明申请

US20120310583A1 DEVICE AND METHOD FOR TESTING APD MEASURING DEVICE 有权
标题翻译：用于测试APD测量装置的装置和方法
公开(公告)号：US20120310583A1
公开(公告)日：2012-12-06
申请号：US13313303
申请日：2011-12-07
申请人： Sunao Ronte , Satoru Arakawa
发明人： Sunao Ronte , Satoru Arakawa
IPC分类号： G06F17/18
CPC分类号： G01R23/16 , G01R35/00
摘要： To accurately test the operating state of the APD measuring device. A test device 40 includes a test signal generator 41 that generates a test signal corresponding to the center frequency of a signal to be measured and a control unit 42 that variably controls the amplitude level of a test signal in the dynamic range of an APD measuring device 1 at random, in order to test the operating state of the APD measuring device 1.
摘要翻译：准确测试APD测量装置的运行状态。测试装置40包括产生与待测信号的中心频率对应的测试信号的测试信号发生器41以及可变地控制APD测量装置的动态范围内的测试信号的振幅电平的控制单元42 1，以测试APD测量装置1的工作状态。

15. 发明申请

US20100246653A1 AMPLITUDE PROBABILITY DISTRIBUTION MEASUREMENT APPARATUS 有权
标题翻译：振幅概率分布测量装置
公开(公告)号：US20100246653A1
公开(公告)日：2010-09-30
申请号：US12730825
申请日：2010-03-24
申请人： Sunao Ronte , Satoru Arakawa
发明人： Sunao Ronte , Satoru Arakawa
IPC分类号： H04B17/00
CPC分类号： G01R23/16
摘要： There is disclosed a general-purpose APD measurement apparatus capable of changing a measurement condition, such as the number of channels or a resolution bandwidth (RBW) in compliance with a standard for the subject of measurement, measuring various subjects of measurement, and correcting measurement equipment, thereby enabling a higher accuracy of measurement. The resolution bandwidth (RBW) or the number of channels when measurement is performed can be flexibly changed by controlling the cycle of a clock signal whose data are sampled by A/D conversion means 110, frequency selection means 130, and an APD unit 300. The frequency selection means 130 includes FFT type processing means 131 and filter bank type processing means 132 arranged in parallel. The output of FFT type processing means 131 is corrected based on the output of the filter bank type processing means 132 with a high accuracy of measurement. Accordingly, a higher accuracy of measurement is made possible.
摘要翻译：公开了一种通用APD测量装置，其能够根据测量对象的标准，测量各种测量对象和校正测量来改变诸如频道数量或分辨率带宽（RBW）的测量条件设备，从而实现更高的测量精度。通过控制通过A / D转换装置110，频率选择装置130和APD单元300对其数据进行采样的时钟信号的周期，可以灵活地改变执行测量时的分辨率带宽（RBW）或通道数。频率选择装置130包括平行布置的FFT类型处理装置131和滤波器组类型处理装置132。基于滤波器组型处理装置132的输出，以高精度的测量来校正FFT型处理装置131的输出。因此，可以实现更高的测量精度。

16. 发明授权

US08355467B2 Amplitude probability distribution measurement apparatus 有权
标题翻译：振幅概率分布测量装置
公开(公告)号：US08355467B2
公开(公告)日：2013-01-15
申请号：US12730825
申请日：2010-03-24
申请人： Sunao Ronte , Satoru Arakawa
发明人： Sunao Ronte , Satoru Arakawa
IPC分类号： H04L27/00
CPC分类号： G01R23/16
摘要： There is disclosed a general-purpose APD measurement apparatus capable of changing a measurement condition, such as the number of channels or a resolution bandwidth (RBW) in compliance with a standard for the subject of measurement, measuring various subjects of measurement, and correcting measurement equipment, thereby enabling a higher accuracy of measurement. The resolution bandwidth (RBW) or the number of channels when measurement is performed can be flexibly changed by controlling the cycle of a clock signal whose data are sampled by A/D conversion means 110, frequency selection means 130, and an APD unit 300. The frequency selection means 130 includes FFT type processing means 131 and filter bank type processing means 132 arranged in parallel. The output of FFT type processing means 131 is corrected based on the output of the filter bank type processing means 132 with a high accuracy of measurement. Accordingly, a higher accuracy of measurement is made possible.
摘要翻译：公开了一种通用APD测量装置，其能够根据测量对象的标准，测量各种测量对象和校正测量来改变诸如频道数量或分辨率带宽（RBW）的测量条件设备，从而实现更高的测量精度。通过控制通过A / D转换装置110，频率选择装置130和APD单元300对其数据进行采样的时钟信号的周期，可以灵活地改变执行测量时的分辨率带宽（RBW）或通道数。频率选择装置130包括平行布置的FFT类型处理装置131和滤波器组类型处理装置132。基于滤波器组型处理装置132的输出，以高精度的测量来校正FFT型处理装置131的输出。因此，可以实现更高的测量精度。

17. 发明授权

US5908347A Polishing system for polishing wafer 失效
标题翻译：抛光晶圆抛光系统
公开(公告)号：US5908347A
公开(公告)日：1999-06-01
申请号：US838636
申请日：1997-04-11
申请人： Makoto Nakajima , Yoshio Nakamura , Yasuhide Denda , Toshihisa Yanagisawa , Toshiaki Seki , Satoru Arakawa , Masahiro Takeuchi , Mitsue Ogawa , Masanori Fukushima
发明人： Makoto Nakajima , Yoshio Nakamura , Yasuhide Denda , Toshihisa Yanagisawa , Toshiaki Seki , Satoru Arakawa , Masahiro Takeuchi , Mitsue Ogawa , Masanori Fukushima
IPC分类号： B23Q41/04 , B24B37/00 , B24B37/04 , B24B49/00
CPC分类号： B24B37/345 , B23Q41/04
摘要： In the polishing system of the present invention, a adhering unit adheres a wafer on a carrying plate using liquid. A polishing unit polishes the wafer using a polishing plate. A feeding unit conveys the carrying plate from the adhering unit to the polishing unit. A dismounting unit removes the wafer from the carrying plate. A first discharging unit conveys the carrying plate from the polishing unit to the dismounting unit. A cleaning unit cleans the vacant carrying plate. A second discharging unit conveys the carrying plate from the dismounting unit to the cleaning unit. A third discharging unit conveys the carrying plate from the cleaning unit to the adhering unit. The units are formed into a loop lines so that the carrying plate is circulated in the loop line and the wafers are polished therein.
摘要翻译：在本发明的抛光系统中，粘合单元使用液体将晶片粘附在承载板上。抛光单元使用抛光板抛光晶片。馈送单元将承载板从粘合单元传送到抛光单元。拆卸单元从承载板上取下晶片。第一排放单元将承载板从抛光单元传送到拆卸单元。清洁单元清洁空载板。第二排放单元将搬运单元从拆卸单元传送到清洁单元。第三排放单元将承载板从清洁单元传送到粘附单元。这些单元形成为环线，使得承载板在环线中循环并且晶片在其中被抛光。

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