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11. 发明申请

US20050213893A1 Optical fiber connector and connecting method 失效
标题翻译：光纤连接器及连接方式
公开(公告)号：US20050213893A1
公开(公告)日：2005-09-29
申请号：US11049758
申请日：2005-02-04
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/26 , G02B6/36 , G02B6/38
CPC分类号： G02B6/3801 , G02B6/3887
摘要： An optical fiber connector is used to optically connect a pair of optical fibers with their tips opposing each other. The optical fiber connector is formed of a material having a higher thermal deformation temperature than the coverings of the optical fibers. The connector has a guide hole for inserting therein the optical fibers with their tips opposing each other. The connector has fiber-fixing groove portions circumferentially formed in the wall of the guide hole. When the coverings of the optical fibers are thermally deformed, parts of the coverings bite the groove portions, whereby the optical fibers are fixed in the guide hole.
摘要翻译：光纤连接器用于将一对光纤与其尖端相对地光学连接。光纤连接器由具有比光纤的覆盖物更高的热变形温度的材料形成。连接器具有用于在其中插入其光纤的引导孔，其末端彼此相对。连接器具有周向地形成在导向孔的壁中的纤维固定槽部。当光纤的覆盖物热变形时，部分覆盖物咬住槽部，由此将光纤固定在引导孔中。

12. 发明授权

US5205032A Electronic parts mounting apparatus 失效
标题翻译：电子零件安装装置
公开(公告)号：US5205032A
公开(公告)日：1993-04-27
申请号：US766204
申请日：1991-09-27
申请人： Fumihiko Kuroda , Hideto Furuyama , Mayumi Sakaguchi , Hiroshi Hamasaki , Masaru Nakamura
发明人： Fumihiko Kuroda , Hideto Furuyama , Mayumi Sakaguchi , Hiroshi Hamasaki , Masaru Nakamura
IPC分类号： H01L21/58 , H01L21/60 , H01L23/13
CPC分类号： H01L24/81 , H01L23/13 , H01L24/29 , H01L24/75 , H01L24/83 , H01L24/85 , H01L2224/16225 , H01L2224/29111 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/75 , H01L2224/75303 , H01L2224/81801 , H01L2224/83191 , H01L2224/8385 , H01L2224/85 , H01L2224/85205 , H01L24/48 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01014 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01039 , H01L2924/0105 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/07802 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/12043 , H01L2924/15153 , H01L2924/15156 , H01L2924/15157 , H01L2924/1517 , H01L2924/15787 , Y10T29/53178 , Y10T29/53265
摘要： An electronic parts mounting device according to this invention is characterized by including a mount body which is obtained by bonding at least two substrates each having a predetermined thicknesses and a smooth surface and which has at least one bonding portion, the mount body having at least one recessed portion selectively formed in one exposed surface of the mount body to reach the bonding portion, and the recessed portion having a tapered shape widened from the bonding portion to the exposed surface, and an electronic part mounted in the recessed portion.
摘要翻译：根据本发明的电子部件安装装置的特征在于包括：安装体，其通过粘合至少两个具有预定厚度和光滑表面的基板而获得，并且具有至少一个接合部分，所述安装体具有至少一个所述凹部选择性地形成在所述安装体的一个露出表面中，以到达所述接合部，并且所述凹部具有从所述接合部扩大到所述暴露表面的锥形形状，以及安装在所述凹部中的电子部。

13. 发明授权

US07711237B2 Optical transmission line holding member, optical module and mounting method thereof 失效
标题翻译：光传输线保持部件，光模块及其安装方法
公开(公告)号：US07711237B2
公开(公告)日：2010-05-04
申请号：US12252702
申请日：2008-10-16
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/00
CPC分类号： G02B6/4239 , G02B6/4249
摘要： An optical transmission line holding member includes a main body that mechanically positions and holds an optical transmission line, and an electrical interconnection used to mount an optical element. The main body includes a holding hole which opens in one surface of the main body and is used to mechanically position and hold the optical transmission line, an guide hole which opens in another surface of the main body, has a diameter larger than that of the holding hole and is coaxially aligned with the holding hole, and a resin storage groove provided in the guide hole. The electrical interconnection is formed on the surface in which the holding hole opens.
摘要翻译：光传输线保持构件包括机械地定位和保持光传输线的主体以及用于安装光学元件的电互连。主体包括：保持孔，其在主体的一个表面上开口，用于机械地定位和保持光传输线，在主体的另一个表面上开口的引导孔的直径大于保持孔并与保持孔同轴对准，以及设置在引导孔中的树脂容纳槽。电互连形成在保持孔打开的表面上。

14. 发明授权

US07667311B2 LSI package provided with interface module, and transmission line header employed in the package 失效
标题翻译： LSI封装提供接口模块，并在封装中采用传输线头
公开(公告)号：US07667311B2
公开(公告)日：2010-02-23
申请号：US12098212
申请日：2008-04-04
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： H01L23/02
CPC分类号： G02B6/4201 , G02B6/4202 , G02B6/4249 , G02B6/4251 , G02B6/4269 , G02B6/428 , G02B6/4284 , H01L24/83 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/05647 , H01L2224/16 , H01L2224/29339 , H01L2224/29344 , H01L2224/29355 , H01L2224/29386 , H01L2224/83102 , H01L2224/83851 , H01L2224/92125 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/12043 , H01L2924/1305 , H01L2924/14 , H01L2924/3011 , H01L2924/3512 , H01L2924/00 , H01L2924/00014 , H01L2924/01022 , H01L2924/0665
摘要： An LSI package encompasses a transmission line header embracing a header-base, a transmission line held by the header-base, and an interface IC chip mounted on the header-base, an interposer substrate having a plurality of board-connecting joints, which facilitate connection with the printed wiring board; an LSI chip mounted on the interposer substrate; and a receptacle having a lead terminal and being mounted on the interposer substrate, configured to accommodate the transmission line header so that the interface IC chip electrically connects to the LSI chip through the lead terminal.
摘要翻译： LSI封装包括一个传输线头，包括一个标题基座，一个由标题基座保持的传输线，以及一个安装在标题基座上的接口IC芯片，一个具有多个板连接接头的插入基片，与印刷线路板的连接; 安装在所述插入器基板上的LSI芯片; 以及插座，其具有引线端子并安装在所述插入器基板上，被配置为容纳所述传输线集管，使得所述接口IC芯片通过所述引线端子电连接到所述LSI芯片。

15. 发明授权

US07401983B2 Method for manufacturing optical coupling part and optical coupling part 有权
标题翻译：制造光耦合部件和光耦合部件的方法
公开(公告)号：US07401983B2
公开(公告)日：2008-07-22
申请号：US11640861
申请日：2006-12-19
申请人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
发明人： Wataru Sakurai , Kazuhito Saito , Hideo Numata , Chiaki Takubo , Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/36
CPC分类号： G02B6/3644 , G02B6/3652 , G02B6/3696 , G02B6/4202
摘要： After a wiring plate 30 having a plurality of leads 31 been insert-molded to an edge face 21 of a molded article 20, unwanted portions of the wiring plate 30 are cut, thereby enabling easy three-dimensional wiring. As a result, an electrode terminal section 43 of a photoelectric conversion element 41 disposed opposite an end face 11b of an optical fiber 11 can be electrically coupled to an electrical wiring section 23 of an optical coupling part 10.
摘要翻译：在具有多根引线31的布线板30嵌入成型到成形品20的边缘面21之后，切断布线板30的不希望的部分，从而能够容易地进行三维布线。结果，与光纤11的端面11b相对设置的光电转换元件41的电极端子部43可以电耦合到光耦合部10的电配线部23。

16. 发明授权

US07314317B2 Optical fiber connector and connecting method 失效
标题翻译：光纤连接器及连接方式
公开(公告)号：US07314317B2
公开(公告)日：2008-01-01
申请号：US11049758
申请日：2005-02-04
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： G02B6/38
CPC分类号： G02B6/3801 , G02B6/3887
摘要： An optical fiber connector is used to optically connect a pair of optical fibers with their tips opposing each other. The optical fiber connector is formed of a material having a higher thermal deformation temperature than the coverings of the optical fibers. The connector has a guide hole for inserting therein the optical fibers with their tips opposing each other. The connector has fiber-fixing groove portions circumferentially formed in the wall of the guide hole. When the coverings of the optical fibers are thermally deformed, parts of the coverings bite the groove portions, whereby the optical fibers are fixed in the guide hole.
摘要翻译：光纤连接器用于将一对光纤与其尖端相对地光学连接。光纤连接器由具有比光纤的覆盖物更高的热变形温度的材料形成。连接器具有用于在其中插入其光纤的引导孔，其末端彼此相对。连接器具有周向地形成在导向孔的壁中的纤维固定槽部。当光纤的覆盖物热变形时，部分覆盖物咬住槽部，由此将光纤固定在引导孔中。

17. 发明申请

US20050156304A1 LSI package provided with interface module 失效
标题翻译： LSI封装提供了接口模块
公开(公告)号：US20050156304A1
公开(公告)日：2005-07-21
申请号：US11015013
申请日：2004-12-20
申请人： Hideto Furuyama , Hiroshi Hamasaki
发明人： Hideto Furuyama , Hiroshi Hamasaki
IPC分类号： G02B6/42 , H01L23/12 , H01L23/48 , H01L23/498 , H01L23/50 , H01L23/52 , H01L25/10 , H01L25/16 , H01L31/0232 , H05K1/02 , H05K1/14 , H05K7/02
CPC分类号： H01L23/49827 , H01L25/18 , H01L2924/0002 , H01L2924/09701 , H01L2924/15311 , H01L2924/3011 , H05K1/0268 , H05K1/141 , H05K7/023 , H05K2201/049 , H05K2201/10704 , H05K2201/10719 , H01L2924/00
摘要： A LSI package encompasses: an interposer having board-connecting joints, which facilitate connection with a printed wiring board, and module-connecting terminals, part of the module-connecting terminals are assigned as interposer-site monitoring terminals; a signal processing LSI mounted on the interposer; and an I/F module having a plurality of interposer-connecting terminals, which are arranged to correspond to arrangement of the module-connecting terminals, and a transmission line to establish an external interconnection of signal, which is transmitted from the signal processing LSI, part of the interposer-connecting terminals are assigned as module-site monitoring terminals. The interposer-site and module-site monitoring terminals are configured to flow a monitoring current to confirm electric contact between the signal processing LSI and the I/F module.
摘要翻译： LSI封装包括：具有板连接接头的插入件，其便于与印刷线路板的连接，以及模块连接端子，部分模块连接端子被分配为插入器位置监视端子; 安装在所述插入器上的信号处理LSI; 以及具有多个插入器连接端子的I / F模块，其被配置为对应于模块连接端子的布置，以及用于建立从信号处理LSI发送的信号的外部互连的传输线，插入器连接端子的一部分被分配为模块站点监视终端。中介站点和模块现场监视终端被配置为流动监视电流以确认信号处理LSI和I / F模块之间的电接触。

18. 发明申请

US20050063651A1 Optical semiconductor module and its manufacturing method 有权
标题翻译：光半导体模块及其制造方法
公开(公告)号：US20050063651A1
公开(公告)日：2005-03-24
申请号：US10898337
申请日：2004-07-26
申请人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
发明人： Hiroshi Hamasaki , Hideto Furuyama , Hideo Numata , Takashi Imoto
IPC分类号： G02B6/42 , H01L31/0232 , H01L33/08 , H01L33/56 , H01L33/62 , H01L29/10
CPC分类号： G02B6/4249 , G02B6/423
摘要： An optical semiconductor module comprises an optical transmission channel including a waveguide transmitting a light beam, a holding member whose holding member holds the channel with the end of the channel being exposed from the surface, electric wiring formed on the surface, an optical semiconductor element, mounted above the surface, including an active area to emit or receive a light beam and an electrode pad electrically connected to the electric wiring, the active area optically coupled to the waveguide at the end of the channel, and an electrical insulation film between the optical semiconductor element and the holding member, including openings each corresponding to an electrical connection between the electrode pad and the electric wiring, and an optically coupling portion between the active area and the waveguide, the electrical insulation film being in contact with a portion of the end of the channel.
摘要翻译：光学半导体模块包括：光传输通道，其包括透射光束的波导;保持部件，其保持部件保持沟道的端部从表面露出，形成在表面上的电布线，光学半导体元件，安装在所述表面上方，包括发射或接收光束的有源区域和电连接到所述电线路的电极焊盘，所述有源区域在所述通道的端部处光耦合到所述波导，以及在所述光学器件之间的电绝缘膜半导体元件和保持构件，包括各自对应于电极焊盘和电布线之间的电连接的开口以及有源区域和波导之间的光学耦合部分，电绝缘膜与端部的一部分接触的频道。

19. 发明授权

US06449296B1 Semiconductor laser device 失效
标题翻译：半导体激光器件
公开(公告)号：US06449296B1
公开(公告)日：2002-09-10
申请号：US09606014
申请日：2000-06-29
申请人： Hiroshi Hamasaki , Hideto Furuyama
发明人： Hiroshi Hamasaki , Hideto Furuyama
IPC分类号： H01S5022
CPC分类号： H01S5/02292 , H01S5/02248 , H01S5/02276 , H01S5/0683
摘要： A semiconductor laser device including a mounting body having a step including an upper level, a lower level and an inclined plane provided between the upper and lower levels; and a semiconductor laser element mounted on the lower level, the mounting body further having a pin-type photodiode including a region of a first conduction type, and i-type region and a region of a second conduction type, a portion of laser beam emitted from the laser element being reflected by the inclined plan and output therefrom, a reminder of the laser beam emitted from the laser element being incident into the mounting body through the inclined plane and detected by the photodiode, the i-type region of the photodiode being provided on the inclined plane so that a major part of the remainder of the laser beam can enter the i-type region without passing the region of a first conduction type and the region of a second conduction type of the photodiode.
摘要翻译：一种半导体激光装置，包括具有台阶的安装体，所述台阶包括设置在所述上下层之间的上层，下层和倾斜面; 以及安装在下层的半导体激光元件，所述安装体还具有包括第一导电类型的区域的pin型光电二极管，以及i型区域和第二导电类型的区域，发射的激光束的一部分从激光元件被倾斜平面反射并从其输出，从激光元件发射的激光束通过倾斜平面入射到安装体中并被光电二极管检测到，光电二极管的i型区域设置在倾斜平面上，使得激光束的剩余部分的大部分可以进入i型区域而不通过第一导电类型的区域和第二导电类型的光电二极管的区域。

20. 发明授权

US5412748A Optical semiconductor module 失效
标题翻译：光半导体模块
公开(公告)号：US5412748A
公开(公告)日：1995-05-02
申请号：US160919
申请日：1993-12-03
申请人： Hideto Furuyama , Hiroshi Hamasaki , Tamon Kobayashi
发明人： Hideto Furuyama , Hiroshi Hamasaki , Tamon Kobayashi
IPC分类号： G02B6/38 , G02B6/42 , G02B6/00 , G02B6/36
CPC分类号： G02B6/3839 , G02B6/4231 , G02B6/4238 , G02B6/4248 , G02B6/4249 , G02B6/3838 , G02B6/4232
摘要： An optical semiconductor module includes a submount body having a groove buried with an insulator, an optical semiconductor device mounted on the submount body, a cap, arranged across the groove on the submount body and bonded and fixed to the submount body by a bonding member, for hermetically sealing the optical semiconductor device, and an electrical wiring layer arranged to extend from the outside of the cap on the submount body to the inside of the cap through the groove buried with the insulator. The electrical wiring layer is electrically connected to the optical semiconductor device.
摘要翻译：一种光半导体模块，包括：具有埋置有绝缘体的沟槽的基座主体，安装在所述基座主体上的光学半导体装置，盖子，布置在所述基座主体上的所述槽上，并且通过接合构件粘合固定到所述基座主体，用于气密地密封光学半导体器件;以及电布线层，其布置成通过所述绝缘体埋入的沟槽从所述底座主体上的盖的外部延伸到所述盖的内部。电配线层与光半导体装置电连接。

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