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11. 发明申请

US20080268752A1 SUBSTRATE GRINDING METHOD AND DEVICE 有权
标题翻译：基板研磨方法和装置
公开(公告)号：US20080268752A1
公开(公告)日：2008-10-30
申请号：US12099424
申请日：2008-04-08
申请人： Seiji Nemoto
发明人： Seiji Nemoto
IPC分类号： B24B49/02 , B24B49/16
CPC分类号： B24B7/228 , B24B49/02 , B24B49/16
摘要： A grinding method wherein the correlation between the amount of inertial grinding occurring in performing spark-out by a grinding unit and the maximum load current in a motor of the grinding unit is grasped, and a correction value for the amount of inertial grinding corresponding to the maximum load current is preliminarily obtained. When the wafer thickness measured by a thickness measuring gauge has reached the sum of a desired value and the correction value (=the amount of inertial grinding) corresponding to the maximum load current, the spark-out is started. Accordingly, the wafer thickness becomes the desired value after the inertial grinding in performing the spark-out.
摘要翻译：一种研磨方法，其中，掌握在研磨单元中进行火花发生时发生的惯性磨削量与研磨单元的电动机中的最大负载电流之间的相关性，以及对应于磨削单元的惯性磨削量的校正值预先获得最大负载电流。当通过厚度测量计测量的晶片厚度达到与最大负载电流相对应的期望值和修正值（=惯性磨削量）之和时，开始火花发射。因此，在进行火花发射的惯性磨削之后，晶片厚度成为期望值。

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