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    • 13. 发明授权
    • Compound semiconductor bipolar transistor
    • 复合半导体双极晶体管
    • US5726468A
    • 1998-03-10
    • US614688
    • 1996-03-13
    • Tomoki OkuHirofumi NakanoShinichi MiyakuniTeruyuki ShimuraRyo Hattori
    • Tomoki OkuHirofumi NakanoShinichi MiyakuniTeruyuki ShimuraRyo Hattori
    • H01L29/41H01L21/28H01L21/302H01L21/3065H01L21/3205H01L21/331H01L23/52H01L29/205H01L29/423H01L29/43H01L29/73H01L29/732H01L29/737H01L31/0328H01L31/0336
    • H01L29/7371H01L29/42304
    • A semiconductor device includes a semiconductor substrate; a first active layer disposed on the semiconductor substrate; a second active layer disposed on the first active layer; a first electrode including a lower stage disposed on the second active layer and an upper stage disposed on the lower stage and having an overhanging portion protruding from the lower stage; an insulating film continuously covering a surface of the second active layer, a side surface of the lower stage of the first electrode, and a lower surface and a side surface of the overhanging portion of the upper stage; and a second electrode disposed on the surface of the first active layer at opposite sides of the second active layer, self-aligned with the second active layer. The distance between the second electrode and the second active layer is minimized and the thickness of the second electrode can be about 7000 .ANG., minimizing the resistance of the first active layer and improving high frequency characteristics. Electrical separation between the first and second active layers can be achieved reliably. Recombination at the surface of the second active layer is suppressed.
    • 半导体器件包括半导体衬底; 设置在所述半导体衬底上的第一有源层; 设置在所述第一有源层上的第二有源层; 第一电极,其包括设置在第二有源层上的下层和设置在下层上的上层,具有从下层突出的突出部; 绝缘膜,连续地覆盖第二有源层的表面,第一电极的下层的侧表面,以及上层的突出部的下表面和侧表面; 以及第二电极,其设置在所述第二有源层的与所述第二有源层自对准的所述第二有源层的相对侧的所述表面上。 第二电极和第二有源层之间的距离被最小化,并且第二电极的厚度可以是约7000,使第一有源层的电阻最小化并提高高频特性。 可以可靠地实现第一和第二有源层之间的电气分离。 第二活性层的表面的重组被抑制。
    • 14. 发明授权
    • Heterojunction bipolar transistor
    • 异质结双极晶体管
    • US5670801A
    • 1997-09-23
    • US582317
    • 1996-01-03
    • Hirofumi Nakano
    • Hirofumi Nakano
    • H01L21/28H01L21/331H01L23/482H01L23/522H01L29/41H01L29/417H01L29/45H01L29/73H01L29/737H01L29/201
    • H01L29/66318H01L23/4821H01L23/5221H01L29/452H01L29/7371H01L2924/0002
    • A method of fabricating a semiconductor device includes producing a collector layer, a base layer, and an emitter layer on a semiconductor substrate; producing a dummy emitter electrode on a region of the emitter layer; forming a first resist except where the dummy emitter electrode is present; completely removing the dummy emitter electrode to expose the surface of the emitter layer; depositing an emitter electrode material on the first resist and the emitter layer that is exposed by the removal of the dummy emitter electrode; forming a mask on a region of the emitter electrode material film where an emitter electrode is later produced; and etching the emitter electrode material film using the mask; and removing the first resist, thereby producing an emitter electrode layer, a peripheral side part extending upward from the bottom part, and an upper fringe part protruding outward from the peripheral side part perpendicular to the peripheral side part. A minute emitter electrode is produced without employing vacuum evaporation and lift-off techniques that can cause burrs on the emitter electrode. Since a refractory metal can be employed as the emitter electrode material, a highly-reliable emitter electrode is produced with high stability.
    • 制造半导体器件的方法包括在半导体衬底上制造集电极层,基极层和发射极层; 在发射极层的区域上产生虚拟发射极; 形成除了存在虚拟发射极之外的第一抗蚀剂; 完全去除虚拟发射极电极以暴露出发射极层的表面; 在第一抗蚀剂和通过去除虚拟发射极电极而暴露的发射极层上沉积发射极电极材料; 在发射电极材料膜的稍后产生发射电极的区域上形成掩模; 并使用掩模蚀刻发射电极材料膜; 除去第一抗蚀剂,从而产生发射极电极层,从底部向上延伸的周边部分和从垂直于周边侧部分的周边侧部分向外突出的上边缘部分。 在不使用可能引起发射极电极上的毛刺的真空蒸发和剥离技术的情况下制造微小的发射极。 由于难熔金属可以用作发射极电极材料,所以产生高可靠性的发射极电极,其稳定性高。