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11. 发明申请

US20060222285A1 Optical device cavity structure, optical device, and method for manufacturing an optical device cavity structure 有权
标题翻译：光学器件腔结构，光学器件以及用于制造光学器件腔结构的方法
公开(公告)号：US20060222285A1
公开(公告)日：2006-10-05
申请号：US11396651
申请日：2006-04-04
申请人： Masanori Minamio , Toshiyuki Fukuda , Noriyuki Yoshikawa , Hiroaki Fujimoto , Yoshinobu Kunitomo
发明人： Masanori Minamio , Toshiyuki Fukuda , Noriyuki Yoshikawa , Hiroaki Fujimoto , Yoshinobu Kunitomo
IPC分类号： G02B6/12
CPC分类号： H01L27/14618 , H01L27/14683 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/92247 , H01L2924/01021 , H01L2924/01078 , H01L2924/01079 , H01L2924/00014 , H01L2924/00
摘要： An optical device cavity structure includes: insulator layers and metal layers alternately layered on one another; a first terminal section which is formed on a mounting surface to be mounted on a wiring substrate and which is electrically connected to the wiring substrate; a cavity portion having a generally rectangular opening formed in a central portion of the upper surface; and a light-transmitting member placement section formed on the upper surface surrounding the opening for receiving a light-transmitting member thereon, wherein the light-transmitting member is for transmitting therethrough light to be received by, or light emitted from, an optical element chip.
摘要翻译：光学器件腔结构包括：彼此交替层叠的绝缘体层和金属层; 第一端子部，形成在安装在布线基板上的与布线基板电连接的安装面上; 空腔部分，其具有形成在所述上表面的中心部分中的大致矩形的开口; 以及透光部件配置部，其形成在所述开口的周围的上表面上，用于容纳透光部件，其中，所述透光部件用于透射由所述光学元件芯片接收的光或从所述光学元件芯片发出的光。

12. 发明授权

US06680220B2 Method of embedding an identifying mark on the resin surface of an encapsulated semiconductor package 有权
标题翻译：在封装的半导体封装的树脂表面上嵌入识别标记的方法
公开(公告)号：US06680220B2
公开(公告)日：2004-01-20
申请号：US10152725
申请日：2002-05-23
申请人： Masanori Minamio , Hiroaki Fujimoto , Ryuichi Sahara , Toshiyuki Fukuda , Toru Nomura
发明人： Masanori Minamio , Hiroaki Fujimoto , Ryuichi Sahara , Toshiyuki Fukuda , Toru Nomura
IPC分类号： H01L2144
CPC分类号： H01L21/561 , H01L23/49816 , H01L23/544 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/97 , H01L2223/54406 , H01L2223/54473 , H01L2223/54486 , H01L2224/451 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/49171 , H01L2224/4943 , H01L2224/97 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2224/85 , H01L2924/00 , H01L2924/00015 , H01L2224/05599 , H01L2924/00012
摘要： A semiconductor device includes: a wiring substrate; a wiring electrode; a semiconductor chip; a connecting member; a resin encapsulant; and a mark member. The wiring electrode is formed on the wiring substrate. The semiconductor chip is mounted on the wiring substrate. An electrode pad formed on the semiconductor chip and the wiring electrode are electrically connected to each other with the connecting member. The semiconductor chip, the wiring electrode, and the connecting member, for example, are molded with the resin encapsulant on the upper surface of the wiring substrate. The mark member is embedded in the upper surface of the resin encapsulant. The mark member, which is transferred from a transfer sheet in a single process step, is highly visible and can be formed efficiently.
摘要翻译：半导体器件包括：布线基板; 布线电极; 半导体芯片; 连接构件; 树脂密封剂; 和标记成员。布线电极形成在布线基板上。半导体芯片安装在布线基板上。形成在半导体芯片上的电极焊盘和布线电极通过连接部件彼此电连接。例如，半导体芯片，布线电极和连接部件用树脂密封剂模制在布线基板的上表面上。标记构件嵌入树脂密封剂的上表面。在单个工艺步骤中从转印纸转印的标记部件是高度可见的并且可以有效地形成。

13. 发明申请

US20110083322A1 OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：光学装置及其制造方法
公开(公告)号：US20110083322A1
公开(公告)日：2011-04-14
申请号：US12970407
申请日：2010-12-16
申请人： Masanori MINAMIO , Yutaka Harada , Kiyokazu Itoi , Toshiyuki Fukuda
发明人： Masanori MINAMIO , Yutaka Harada , Kiyokazu Itoi , Toshiyuki Fukuda
IPC分类号： H01R43/00
CPC分类号： H01L27/14618 , H01L24/97 , H01L27/14683 , H01L2224/48091 , H01L2224/49171 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/14 , Y10T29/49117 , H01L2224/85 , H01L2924/00014
摘要： An optical device includes a substrate, an optical element, a translucent component, a plurality of first terminals and a sealant. The sealant is located lower than the top surface of the translucent component. The top surface of the translucent component is exposed out of the sealant, while the side surface of the translucent component is covered with the sealant.
摘要翻译：光学装置包括基板，光学元件，半透明部件，多个第一端子和密封剂。密封剂位于比半透明组件的顶表面更低的位置。半透明部件的顶面从密封剂露出，而半透明部件的侧表面被密封剂覆盖。

14. 发明授权

US07822090B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US07822090B2
公开(公告)日：2010-10-26
申请号：US12186979
申请日：2008-08-06
申请人： Masanori Minamio , Noriyuki Yoshikawa , Shinichi Ijima , Toshiyuki Fukuda
发明人： Masanori Minamio , Noriyuki Yoshikawa , Shinichi Ijima , Toshiyuki Fukuda
IPC分类号： H01S5/00 , H01S3/30 , H01S3/04 , H01L29/16
CPC分类号： B82Y20/00 , G11B7/127 , H01L2224/48091 , H01S5/0021 , H01S5/0071 , H01S5/02212 , H01S5/02216 , H01S5/02224 , H01S5/02248 , H01S5/02292 , H01S5/024 , H01S5/02476 , H01S5/028 , H01S5/34333 , H01L2924/00014
摘要： A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than −15° C. and not more than −5° C.
摘要翻译：半导体器件包括光学半导体元件，包括由用于安装光学半导体元件的金属制成的基座的封装以及用于通过覆盖封装和光学半导体元件来封装光学半导体元件的盖和气体。用包装封装的气体的氧浓度不小于15％且小于30％，露点不低于-15℃且不大于-5℃。

15. 发明申请

US20080100732A1 Optical device module, fabrication method thereof, optical device unit and fabrication method thereof 有权
标题翻译：光器件模块及其制造方法，光学元件单元及其制造方法
公开(公告)号：US20080100732A1
公开(公告)日：2008-05-01
申请号：US11798370
申请日：2007-05-14
申请人： Masanori Minamio , Yutaka Harada , Yoshiki Takayama , Toshiyuki Fukuda
发明人： Masanori Minamio , Yutaka Harada , Yoshiki Takayama , Toshiyuki Fukuda
IPC分类号： H04N5/335 , G06F19/00
CPC分类号： H04N5/2251 , H01L2924/0002 , H04N5/2257 , H05K1/189 , H05K2201/046 , H05K2201/10121 , H05K2201/10689 , H01L2924/00
摘要： One end of a flexible substrate is connected to a solid-state image sensing device and the other end constitutes an external connection part in which external lead-out electrodes are provided. A plurality of electronic components are mounted on a mounting part of the flexible substrate. The flexible substrate is bent at a first bent part thereof to make an acute angle with the solid-state image sensing device and also bent at a second bent part thereof to make an acute angle with the external connection part. The two acute angles are alternate angles and the solid-state image sensing device has a cross section of the letter Z.
摘要翻译：柔性基板的一端连接到固态图像感测装置，另一端构成外部引出电极的外部连接部。多个电子部件安装在柔性基板的安装部上。柔性基板在其第一弯曲部分处弯曲以与固态图像感测装置成锐角并且在其第二弯曲部分处弯曲以与外部连接部分成锐角。两个锐角是交替的角度，固态图像感测装置具有字母Z的横截面。

16. 发明申请

US20070252227A1 Optical apparatus and optical module using the same 有权
标题翻译：光学装置和使用其的光学模块
公开(公告)号：US20070252227A1
公开(公告)日：2007-11-01
申请号：US11698100
申请日：2007-01-26
申请人： Toshiyuki Fukuda , Yoshiki Takayama , Masanori Minamio , Tetsushi Nishio , Yutaka Harada
发明人： Toshiyuki Fukuda , Yoshiki Takayama , Masanori Minamio , Tetsushi Nishio , Yutaka Harada
IPC分类号： H01L31/0232
CPC分类号： H01L31/0203 , H01L27/14618 , H01L27/14625 , H01L31/0232 , H01L33/483 , H01L33/58 , H01L33/62 , H01L2224/05026 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16 , H01L2224/73204 , H01L2924/00014
摘要： An optical apparatus includes an optical device (LED device or semiconductor imaging device) having a photoreceptor/light-emitting region, a peripheral circuit region and an electrode region, a transparent member having a larger light passing through region than the optical device and including, on one surface thereof, protruding electrodes for connection to the optical device, external connection electrodes for connection to a mounting substrate, conductive interconnects for connecting the protruding electrodes and the external connection electrodes, and a transparent adhesive provided between the optical device and the transparent member. In the optical apparatus, one surface of the optical device in which the photoreceptor/light-emitting region is formed and one surface of the transparent member are arrange so as to face to each other and electrodes of the optical device and the protruding electrodes of the transparent member are electrically connected and also adhered by the transparent adhesive.
摘要翻译：光学设备包括具有感光体/发光区域，外围电路区域和电极区域的光学器件（LED器件或半导体成像器件），具有比光学器件更大的光通过区域的透明部件，在其一个表面上具有用于连接到光学装置的突出电极，用于连接到安装基板的外部连接电极，用于连接突出电极的导电互连和外部连接电极，以及设置在光学装置和透明构件之间的透明粘合剂。在光学装置中，形成感光体/发光区域的光学装置的一个表面和透明构件的一个表面相互配置，并且光学装置的电极和透明构件电连接并且还通过透明粘合剂粘合。

17. 发明申请

US20070228502A1 Semiconductor imaging device and method for manufacturing the same 有权
标题翻译：半导体成像装置及其制造方法
公开(公告)号：US20070228502A1
公开(公告)日：2007-10-04
申请号：US11700124
申请日：2007-01-31
申请人： Masanori Minamio , Tomoko Komatsu , Toshiyuki Fukuda
发明人： Masanori Minamio , Tomoko Komatsu , Toshiyuki Fukuda
IPC分类号： H01L27/14
CPC分类号： H01L27/14618 , H01L24/73 , H01L27/14627 , H01L27/14683 , H01L27/14685 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49171 , H01L2224/73265 , H01L2224/92247 , H01L2924/01019 , H01L2924/01079 , H01L2924/15153 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor imaging device includes: a semiconductor imaging element including an imaging region, a peripheral circuit region, and an electrode region, the imaging region including a plurality of micro lenses; a semiconductor package the semiconductor package in which a cavity for mounting the semiconductor imaging element is formed, the semiconductor package including a plurality of internal connection terminals formed inside the periphery of the cavity for being connected with a plurality of electrode terminals of the semiconductor imaging element and a plurality of external connection terminals connected with the internal connection terminals; a fixing member for fixing the semiconductor imaging element to the cavity; and an optical member fixed to the semiconductor package by a sealing member so as to cover the semiconductor imaging element arranged in the cavity. Wherein, a face obtained by connecting vertexes of the micro lenses is formed into a continuous concave curve.
摘要翻译：一种半导体成像装置，包括：具有成像区域，外围电路区域和电极区域的半导体摄像元件，所述摄像区域包括多个微透镜; 半导体封装，其中形成有用于安装半导体成像元件的空腔的半导体封装，所述半导体封装包括形成在所述腔的周围的多个内部连接端子，用于与所述半导体成像元件的多个电极端子连接以及与所述内部连接端子连接的多个外部连接端子; 用于将所述半导体成像元件固定到所述空腔的固定构件; 以及光学构件，其通过密封构件固定到所述半导体封装，以覆盖布置在所述空腔中的所述半导体成像元件。其中，将通过连接微透镜的顶点获得的面形成为连续凹曲线。

18. 发明申请

US20070019101A1 Optical device, optical device apparatus, camera module, and optical device manufacturing method 有权
标题翻译：光学装置，光学装置装置，相机模块和光学装置的制造方法
公开(公告)号：US20070019101A1
公开(公告)日：2007-01-25
申请号：US11490232
申请日：2006-07-21
申请人： Masanori Minamio , Yutaka Harada , Toshiyuki Fukuda
发明人： Masanori Minamio , Yutaka Harada , Toshiyuki Fukuda
IPC分类号： G02B13/16
CPC分类号： H01L27/14632 , G02B3/0006 , G02B3/0056 , H01L27/14618 , H01L27/14625 , H01L27/14685 , H01L27/14687 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： An optical device includes an optical element, a transparent member arranged on the optical element, and a transparent resin adhesive for causing the transparent member to adhere and be fixed onto a circuit formation face of the optical element. The optical device includes a light detecting region having a plurality of micro lenses, a peripheral circuit region formed in the outer peripheral part of the light detecting region, and an electrode region formed at the outer peripheral part of the peripheral circuit region. A roughed region in a saw-toothed shape in section is formed in part of a face of the transparent member which adheres to the optical element, the part being overlapped with the outer peripheral part of the light detecting region as viewed in plan.
摘要翻译：光学装置包括光学元件，布置在光学元件上的透明构件和用于使透明构件粘附并固定到光学元件的电路形成面上的透明树脂粘合剂。光学装置包括具有多个微透镜的光检测区域，形成在光检测区域的外周部分中的外围电路区域和形成在外围电路区域的外周部分处的电极区域。如图所示，锯齿状形状的粗糙区域形成在粘附于光学元件的透明构件的表面的一部分中，该部分与光检测区域的外周部分重叠。

19. 发明授权

US07923798B2 Optical device and method for fabricating the same, camera module using optical device, and electronic equipment mounting camera module 有权
标题翻译：光学装置及其制造方法，使用光学装置的相机模块和安装摄像机模块的电子设备
公开(公告)号：US07923798B2
公开(公告)日：2011-04-12
申请号：US12045522
申请日：2008-03-10
申请人： Masanori Minamio , Yoshiki Takayama , Toshiyuki Fukuda
发明人： Masanori Minamio , Yoshiki Takayama , Toshiyuki Fukuda
IPC分类号： H01L31/0232 , H01L31/18
CPC分类号： H01L27/14625 , H01L27/14618 , H01L27/14627 , H01L27/14632 , H01L2224/05001 , H01L2224/05009 , H01L2224/05567 , H01L2224/13 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48227 , H01L2224/48464 , H01L2924/00014 , H04N5/2257 , H01L2224/05599 , H01L2224/05099
摘要： An optical device includes a light receiving element chip having: an active region formed on a principal plane of a substrate and made by arranging a plurality of light receiving pixels; a circuit region disposed around an outer circumference of the active region; a penetrating conductor provided to penetrate the substrate in the thickness direction of the substrate; and an external connection terminal provided on a back surface of the substrate facing the principal plane thereof and connected to the penetrating conductor. The optical device further includes a microlens, a planarization film, and a transparent protective film formed on the planarization film.
摘要翻译：光学装置包括：光接收元件芯片，其具有：形成在基板的主平面上并通过布置多个光接收像素而制成的有源区; 设置在所述有源区域的外周的电路区域; 穿透导体，其设置成在所述基板的厚度方向上穿透所述基板; 以及外部连接端子，其设置在所述基板的与所述基板的主面相对的背面，并与所述贯通导体连接。光学器件还包括形成在平坦化膜上的微透镜，平坦化膜和透明保护膜。

20. 发明授权

US07876570B2 Module with embedded electronic components 有权
标题翻译：嵌入式电子元件模块
公开(公告)号：US07876570B2
公开(公告)日：2011-01-25
申请号：US12566186
申请日：2009-09-24
申请人： Masanori Minamio , Hideki Takehara , Yoshiyuki Arai , Toshiyuki Fukuda
发明人： Masanori Minamio , Hideki Takehara , Yoshiyuki Arai , Toshiyuki Fukuda
IPC分类号： H05K1/16
CPC分类号： H05K3/284 , H05K3/3442 , H05K2201/0191 , H05K2201/10636 , Y02P70/611
摘要： In a module with embedded electronic components, connection electrodes are formed on the component mounting surface of a substrate. The electrode portions of each of the electronic components are placed on the individual connection electrodes and connected in fixed relation thereto by using a solder. The electronic components are encapsulated in an encapsulating resin. When the distance between the lower surface of the main body portion of each of the electronic components and the component mounting surface is assumed to be a and the thickness of the portion of the encapsulating resin which is located above the main body portion of the electronic component is assumed to be b, if b/a is set to a value of not more than 6, it becomes possible to prevent, when the module with embedded electronic components is reflow-mounted on a printed wiring substrate or the like, the occurrence of a short circuit failure resulting from the melting and flowing of the solder which causes a short circuit between the two electrode portions.
摘要翻译：在具有嵌入式电子部件的模块中，在基板的部件安装面上形成有连接电极。每个电子部件的电极部分被放置在各个连接电极上，并通过使用焊料与固定的关系连接。电子部件被封装在封装树脂中。当将每个电子部件的主体部分的下表面与部件安装表面之间的距离假设为a，并且封装树脂的位于电子部件的主体部分上方的部分的厚度假定为b，如果b / a设定为不大于6的值，则当具有嵌入式电子部件的模块被回流安装在印刷布线基板等上时，可以防止发生由焊料的熔化和流动导致的短路故障，这导致两个电极部分之间的短路。

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