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11. 发明申请

US20100178810A2 Connecting Scheme for Orthogonal Assembly of Microstructures 审中-公开
标题翻译：微结构正交装配连接方案
公开(公告)号：US20100178810A2
公开(公告)日：2010-07-15
申请号：US12110676
申请日：2008-04-28
申请人： Arno Aarts , Hercules Pereira Neves , Chris Van Hoof , Eric Beyne , Patrick Ruther , Robert Puers
发明人： Arno Aarts , Hercules Pereira Neves , Chris Van Hoof , Eric Beyne , Patrick Ruther , Robert Puers
IPC分类号： H01R24/00 , H01R43/00
CPC分类号： B81C3/008 , A61B5/04001 , A61B5/0478 , A61B2562/125 , A61N1/0529 , A61N1/0531 , B81B2201/055 , Y10T29/49222
摘要： In the present disclosure a device for sensing and/or actuation purposes is presented in which microstructures (20) comprising shafts (2) with different functionality and dimensions can be inserted in a modular way. That way, out-of-plane connectivity, mechanical clamping between the microstructures (20) and a substrate (1) of the device, and electrical connection between electrodes (5) on the microstructures (20) and the substrate (1) can be realized. Connections to external circuitry can be realised. Microfluidic channels (10) in the microstructures (20) can be connected to external equipment. A method to fabricate and assemble the device is provided.
摘要翻译：在本公开中，提出了用于感测和/或致动目的的装置，其中可以以模块化方式插入包括具有不同功能和尺寸的轴（2）的微结构（20）。这样，平面外连接，微结构（20）和器件的衬底（1）之间的机械夹紧以及微结构（20）和衬底（1）上的电极（5）之间的电连接可以是实现了可以实现与外部电路的连接。微结构（20）中的微流体通道（10）可以连接到外部设备。提供了一种制造和组装该装置的方法。

12. 发明申请

US20130015853A1 HALL SENSOR 有权
标题翻译：霍尔传感器
公开(公告)号：US20130015853A1
公开(公告)日：2013-01-17
申请号：US13542465
申请日：2012-07-05
申请人： Roiy Raz , Patrick Ruther , Timo Kaufmann , Oliver Paul
发明人： Roiy Raz , Patrick Ruther , Timo Kaufmann , Oliver Paul
IPC分类号： G01R33/07
CPC分类号： G01R33/07 , G01R33/066 , G01R33/077
摘要： A Hall sensor is provided having a first Hall element with a first terminal contact and with a second terminal contact and with a third terminal contact, a second Hall element with a fourth terminal contact and with a fifth terminal contact and with a sixth terminal contact, a third Hall element with a seventh terminal contact and with an eighth terminal contact and with a ninth terminal contact, and a fourth Hall element with a tenth terminal contact and with an eleventh terminal contact and with a twelfth terminal contact. The first Hall element and the second Hall element and the third Hall element and the fourth Hall element are connectable in series.
摘要翻译：霍尔传感器具有第一霍尔元件，第一霍尔元件具有第一端子触点和第二端子触点和第三端子触点，第二霍尔元件具有第四端子触点和第五端子触点以及第六端子触点，具有第七端子触点和第八端子触点和第九端子触点的第三霍尔元件，以及具有第十端子触点和第十一端子触点的第四霍尔元件以及与第十二端子触点相连接的第四霍尔元件。第一霍尔元件和第二霍尔元件以及第三霍尔元件和第四霍尔元件可串联连接。

13. 发明申请

US20110048799A1 Microstructure and Process for its Assembly 审中-公开
标题翻译：其组装及其组装工艺
公开(公告)号：US20110048799A1
公开(公告)日：2011-03-03
申请号：US12857737
申请日：2010-08-17
申请人： Sebastian Kisban , Stanislav Herwik , Patrick Ruther , Tobias Holzhammer , Oliver Paul
发明人： Sebastian Kisban , Stanislav Herwik , Patrick Ruther , Tobias Holzhammer , Oliver Paul
IPC分类号： H02G3/00 , B81C1/00
CPC分类号： B81C3/004 , B81B2201/12 , B81B2207/07 , B81C3/008 , H01R12/79 , H05K1/118 , H05K3/0058 , H05K3/326 , H05K3/365 , H05K2201/091 , H05K2201/1059 , Y10T29/49002
摘要： In a process for assembling a microstructure (1), provision is made of a first microstructure piece (2) having a receiving recess (3) in its surface and a second microstructure piece (5) having a connecting region (6) fitting into the receiving recess (3) and on which is arranged at least one electrical contact element (7a, 7b). Provision is made of a flexible cable (8) having a flat substrate layer (9) made of an electrically insulating material and at least one strip conductor (10) arranged thereon. The cable (8) has at least one tongue (14a, 14b) on which is arranged at least one counter-contact element (11a, 11b) connected to the strip conductor (10). The cable (8) and the microstructure pieces (5) are positioned relative to each other in a preassembly position in which the connecting region (6) is opposite the receiving recess (3) and the tongue (14a, 14b) is aligned between the connecting region (6) and the receiving recess (3). The connecting region (6) is then introduced in the receiving recess (3) by displacement of the microstructure pieces (2, 5) toward one another. In doing so the at least one tongue (14a, 14b) is deflected in the receiving recess (3) in such a way that the at least one counter-contact element (11a, 11b) contacts the at least one contact element (7a, 7b).
摘要翻译：在组装微结构（1）的方法中，提供在其表面上具有接收凹槽（3）的第一微结构件（2）和具有连接区域（6）的第二微结构件（5）接收凹部（3），并且其上布置有至少一个电接触元件（7a，7b）。设置有具有由电绝缘材料制成的平坦基底层（9）的柔性电缆（8）和布置在其上的至少一个带状导体（10）。电缆（8）具有至少一个舌片（14a，14b），其上设置有至少一个连接到带状导体（10）的反接触元件（11a，11b）。电缆（8）和微结构件（5）在连接区域（6）与容纳凹部（3）相对的预组装位置中相对定位，并且舌部（14a，14b）在连接区域（6）和接收凹部（3）。然后通过使微结构件（2,5）彼此移位将连接区域（6）引入到容纳凹部（3）中。在这样做时，至少一个舌片（14a，14b）在接收凹部（3）中被偏转，使得至少一个反接触元件（11a，11b）接触至少一个接触元件（7a， 7b）。

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