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11. 发明申请

US20080224160A1 High-power light emitting diode and method of manufacturing the same 审中-公开
标题翻译：大功率发光二极管及其制造方法
公开(公告)号：US20080224160A1
公开(公告)日：2008-09-18
申请号：US12003275
申请日：2007-12-21
申请人： Myung Whun Chang , Jong Myeon Lee , Hyong Sik Won , Youn Gon Park
发明人： Myung Whun Chang , Jong Myeon Lee , Hyong Sik Won , Youn Gon Park
IPC分类号： H01L33/00
CPC分类号： H01L33/58 , H01L33/52 , H01L33/60 , H01L2224/48091 , H01L2924/3025 , H01L2933/0091 , H01L2924/00014 , H01L2924/00
摘要： Provided is a method of manufacturing a high-power LED package, the method including the steps of: preparing a mold having an irregularity pattern; providing a transparent resin solid having an irregularity pattern provided on the surface thereof by using the mold; preparing an irregularity film with the irregularity pattern by cutting a portion of the transparent resin solid; preparing an LED package structure having a cavity in which an LED chip is mounted; filling transparent liquid resin into the cavity having the LED chip mounted therein; mounting the irregularity film on the transparent liquid resin such that the irregularity film projects from the cavity at a predetermined height; and curing the transparent liquid resin having the irregularity film mounted thereon. The irregularity pattern of the irregularity film projects from the cavity at a predetermined height.
摘要翻译：提供一种制造大功率LED封装的方法，该方法包括以下步骤：制备具有不规则图案的模具; 通过使用模具提供其表面上设置有不规则图案的透明树脂固体; 通过切割一部分透明树脂固体来制备具有不规则图案的不规则膜; 制备具有其中安装有LED芯片的空腔的LED封装结构; 将透明液体树脂填充到其中安装有LED芯片的空腔中; 将不规则膜安装在透明液体树脂上，使得不规则膜以预定高度从空腔突出; 并固化其上安装有不规则膜的透明液体树脂。不规则膜的不规则图案在预定高度从腔体突出。

12. 发明授权

US07994084B2 Dielectric composition and multilayer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same 有权
标题翻译：介电组合物和多层陶瓷电容器嵌入式低温共烧陶瓷基板使用相同
公开(公告)号：US07994084B2
公开(公告)日：2011-08-09
申请号：US12323840
申请日：2008-11-26
申请人： Soo Hyun Lyoo , Jong Myeon Lee , Ho Sung Choo , Min Ji Ko , Beom Joon Cho , Myung Whun Chang
发明人： Soo Hyun Lyoo , Jong Myeon Lee , Ho Sung Choo , Min Ji Ko , Beom Joon Cho , Myung Whun Chang
IPC分类号： C04B35/468 , H01G4/12
CPC分类号： H01G4/129 , B82Y30/00 , C04B35/468 , C04B2235/3281 , C04B2235/3298 , C04B2235/365 , C04B2235/5445 , C04B2235/5454 , C04B2235/656 , C04B2235/6567 , C04B2235/9615 , H01G4/1227 , H01G4/30 , H05K1/0306 , H05K1/162 , H05K3/4611 , H05K3/4629 , H05K3/4688
摘要： Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.
摘要翻译：提供一种电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷衬底。电介质组合物包括约80重量％以上的主成分BaTiO 3和约20重量％以下的辅助成分CuBi 2 O 4和ZnO-B 2 O 3 -SiO 2基玻璃。

13. 发明申请

US20090141427A1 DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR EMBEDDED LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE USING THE SAME 有权
标题翻译：介电组合物和多层陶瓷电容器嵌入式低温合成陶瓷基板
公开(公告)号：US20090141427A1
公开(公告)日：2009-06-04
申请号：US12323840
申请日：2008-11-26
申请人： Soo Hyun Lyoo , Jong Myeon Lee , Ho Sung Choo , Min Ji Ko , Beom Joon Cho , Myung Whun Chang
发明人： Soo Hyun Lyoo , Jong Myeon Lee , Ho Sung Choo , Min Ji Ko , Beom Joon Cho , Myung Whun Chang
IPC分类号： H01G4/12 , C04B35/468
CPC分类号： H01G4/129 , B82Y30/00 , C04B35/468 , C04B2235/3281 , C04B2235/3298 , C04B2235/365 , C04B2235/5445 , C04B2235/5454 , C04B2235/656 , C04B2235/6567 , C04B2235/9615 , H01G4/1227 , H01G4/30 , H05K1/0306 , H05K1/162 , H05K3/4611 , H05K3/4629 , H05K3/4688
摘要： Provided are a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The dielectric composition includes a main component, BaTiO3 of about 80 wt % or more, and an accessory component, CuBi2O4 and ZnO—B2O3—SiO2-based glass of about 20 wt % or less.
摘要翻译：提供一种电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷衬底。电介质组合物包括约80重量％以上的主成分BaTiO 3和约20重量％以下的辅助成分CuBi 2 O 4和ZnO-B 2 O 3 -SiO 2基玻璃。

14. 发明申请

US20090135542A1 GLASS COMPOSITION, DIELECTRIC COMPOSITION AND MULTILAYER CERAMIC CAPACITOR EMBEDDED LOW TEMPERATURE CO-FIRED CERAMIC SUBSTRATE USING THE SAME 有权
标题翻译：玻璃组合物，电介质组合物和多层陶瓷电容器嵌入式低温共烧陶瓷基板
公开(公告)号：US20090135542A1
公开(公告)日：2009-05-28
申请号：US12271386
申请日：2008-11-14
申请人： Ho Sung Choo , Jong Myeon Lee , Eun Tae Park , Myung Whun Chang , Soo Hyun Lyoo , Beom Joon Cho
发明人： Ho Sung Choo , Jong Myeon Lee , Eun Tae Park , Myung Whun Chang , Soo Hyun Lyoo , Beom Joon Cho
IPC分类号： H01G4/30 , C03C3/064
CPC分类号： H01G4/1227 , C03C3/064 , C03C8/02 , C04B35/4682 , C04B2235/3215 , C04B2235/3232 , C04B2235/3298 , C04B2235/3409 , C04B2235/3418 , C04B2235/36 , C04B2235/5445 , H01G4/129 , H05K1/0306 , H05K1/162 , H05K3/4611 , H05K3/4629 , H05K3/4688
摘要： Provided are a glass composition, a dielectric composition and a multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate using the same. The multi-layer ceramic capacitor embedded low temperature co-fired ceramic substrate is sinterable at a low temperature while showing a high dielectric constant. The glass composition includes a composition component expressed by a composition formula of aBi2O3-bB2O3-cSiO2-dBaO-eTiO2, where a+b+c+d+e=100, and a, b, c, d, and e are 40≦a≦89, 10≦b≦50, 1≦c≦20, O≦d≦10, and O≦e≦10, respectively.
摘要翻译：提供一种玻璃组合物，电介质组合物和使用其的多层陶瓷电容器嵌入式低温共烧陶瓷基板。多层陶瓷电容器嵌入式低温共烧陶瓷基板在低温下可烧结，同时显示高介电常数。玻璃组合物包括由组成式表示的Bi 2 O 3 -bB 2 O 3 -cSiO 2 -dBaO-eTiO 2的组成成分，其中a + b + c + d + e = 100，a，b，c，d和e分别为40 < = a <= 89，10 <= b <= 50，1 <= c <= 20，O <= d <= 10，O <= e <= 10。

15. 发明申请

US20090117357A1 CONSTRAINING GREEN SHEET AND MANUFACTURING METHOD OF MULTI-LAYER CERAMIC SUBSTRATE 有权
标题翻译：约束陶瓷基板的绿色板材和制造方法
公开(公告)号：US20090117357A1
公开(公告)日：2009-05-07
申请号：US12265561
申请日：2008-11-05
申请人： Beom Joon CHO , Jong Myeon Lee , Myung Whun Chang
发明人： Beom Joon CHO , Jong Myeon Lee , Myung Whun Chang
IPC分类号： B32B18/00 , B32B5/16 , C04B35/00
CPC分类号： B32B18/00 , C04B35/638 , C04B2235/3217 , C04B2235/5292 , C04B2235/5436 , C04B2235/6562 , C04B2235/6567 , C04B2235/721 , C04B2235/9615 , C04B2237/562 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K2201/0209 , H05K2201/0266 , H05K2201/0269 , H05K2203/308 , Y10T428/24942 , Y10T428/2495 , Y10T428/25 , Y10T428/252
摘要： There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic binder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than a powder packing density of the first constraining layer.
摘要翻译：提供了难以烧结的约束生片和使用其制造多层陶瓷基板的方法。所述难烧结约束生片设置在非烧结多层陶瓷衬底的顶表面和底表面中的至少一个上，所述难烧结约束生片包括：具有待定位表面的第一约束层在多层陶瓷基板上，第一约束层包括第一有机粘合剂和具有球形或准球形的第一无机粘合剂; 以及第二约束层，其结合到所述第一约束层的顶表面并且包括第二有机粘合剂和具有片状的第二无机粉末，所述第二约束层的粉末填充密度低于所述第一约束层的粉末堆积密度层。

16. 发明授权

US07951446B2 Constraining green sheet and manufacturing method of multi-layer ceramic substrate 有权
标题翻译：限制生坯板和多层陶瓷基板的制造方法
公开(公告)号：US07951446B2
公开(公告)日：2011-05-31
申请号：US12265561
申请日：2008-11-05
申请人： Beom Joon Cho , Jong Myeon Lee , Myung Whun Chang
发明人： Beom Joon Cho , Jong Myeon Lee , Myung Whun Chang
IPC分类号： B32B18/00 , B32B5/16 , C04B35/00
CPC分类号： B32B18/00 , C04B35/638 , C04B2235/3217 , C04B2235/5292 , C04B2235/5436 , C04B2235/6562 , C04B2235/6567 , C04B2235/721 , C04B2235/9615 , C04B2237/562 , H05K1/0306 , H05K3/4611 , H05K3/4629 , H05K2201/0209 , H05K2201/0266 , H05K2201/0269 , H05K2203/308 , Y10T428/24942 , Y10T428/2495 , Y10T428/25 , Y10T428/252
摘要： There is provided a hard-to-sinter constraining green sheet and a method of manufacturing a multilayer ceramic substrate using the same. The hard-to-sinter constraining green sheet disposed at least one of top and bottom surfaces of a non-sintered multi-layer ceramic substrate, the hard-to-sinter constraining green sheet including: a first constraining layer having a surface to be positioned on the multi-layer ceramic substrate, the first constraining layer including a first organic binder and a first inorganic powder having a spherical shape or a quasi-spherical shape; and a second constraining layer bonded to a top surface of the first constraining layer and including a second organic binder and a second inorganic powder having a flake shape, the second constraining layer having a powder packing density lower than that of the first constraining layer.
摘要翻译：提供了难以烧结的约束生片和使用其制造多层陶瓷基板的方法。所述难烧结约束生片设置在非烧结多层陶瓷衬底的顶表面和底表面中的至少一个上，所述难烧结约束生片包括：具有待定位表面的第一约束层在多层陶瓷基板上，第一约束层包括第一有机粘合剂和具有球形或准球形的第一无机粉末; 以及第二约束层，其结合到所述第一约束层的顶表面并且包括第二有机粘合剂和具有片状形状的第二无机粉末，所述第二约束层的粉末堆积密度低于所述第一约束层的密度。

17. 发明授权

US07781155B2 Fabrication method of micro-lens and fabrication method of master for micro-lens 失效
标题翻译：微透镜的制造方法和微透镜的制作方法
公开(公告)号：US07781155B2
公开(公告)日：2010-08-24
申请号：US12005668
申请日：2007-12-28
申请人： Hyong Sik Won , Jong Myeon Lee , Myung Whun Chang
发明人： Hyong Sik Won , Jong Myeon Lee , Myung Whun Chang
IPC分类号： G02B3/00
CPC分类号： G03F7/2022 , G03F7/70416
摘要： A method of fabricating a micro lens, the method including: forming a photo-sensitive film on a substrate; placing a photo mask at a predetermined distance from a top of the photo-sensitive film; exposing the photo-sensitive film by varying an area of exposure of the photo-sensitive film so as to selectively expose three-dimensional structures of the photo-sensitive film corresponding to desired micro lenses; and developing the photo-sensitive film such that the exposed three-dimensional structures remain. Also, there is provided a method of fabricating a master for a micro lens, in which a master material is applied on the photo-sensitive film with the three-dimensional structures to form a master having the three-dimensional structures transferred thereonto.
摘要翻译：一种制造微透镜的方法，所述方法包括：在基板上形成感光膜; 将光掩模放置在距离感光膜的顶部预定距离处; 通过改变感光膜的曝光面积来曝光感光膜，以便选择性地曝光对应于期望的微透镜的感光膜的三维结构; 并显影感光膜，使得曝光的三维结构保留。此外，提供了一种制造微透镜的母版的方法，其中将母材用三维结构施加在感光膜上，以形成其上转印有三维结构的母版。

18. 发明申请

US20080206682A1 Fabrication method of micro-lens and fabrication method of master for micro-lens 失效
标题翻译：微透镜的制造方法和微透镜的制作方法
公开(公告)号：US20080206682A1
公开(公告)日：2008-08-28
申请号：US12005668
申请日：2007-12-28
申请人： Hyong Sik Won , Jong Myeon Lee , Myung Whun Chang
发明人： Hyong Sik Won , Jong Myeon Lee , Myung Whun Chang
IPC分类号： G03F7/00
CPC分类号： G03F7/2022 , G03F7/70416
摘要： A method of fabricating a micro lens, the method including: forming a photo-sensitive film on a substrate; placing a photo mask at a predetermined distance from a top of the photo-sensitive film; exposing the photo-sensitive film by varying an area of exposure of the photo-sensitive film so as to selectively expose three-dimensional structures of the photo-sensitive film corresponding to desired micro lenses; and developing the photo-sensitive film such that the exposed three-dimensional structures remain. Also, there is provided a method of fabricating a master for a micro lens, in which a master material is applied on the photo-sensitive film with the three-dimensional structures to form a master having the three-dimensional structures transferred thereonto.
摘要翻译：一种制造微透镜的方法，所述方法包括：在基板上形成感光膜; 将光掩模放置在距离感光膜的顶部预定距离处; 通过改变感光膜的曝光面积来曝光感光膜，以便选择性地曝光对应于期望的微透镜的感光膜的三维结构; 并显影感光膜，使得曝光的三维结构保留。此外，提供了一种制造微透镜的母版的方法，其中将母材用三维结构施加在感光膜上，以形成其上转印有三维结构的母版。

19. 发明授权

US08222529B2 Ceramic substrate and manufacturing method thereof 有权
标题翻译：陶瓷基板及其制造方法
公开(公告)号：US08222529B2
公开(公告)日：2012-07-17
申请号：US12588502
申请日：2009-10-16
申请人： Je Hong Sung , Jin Waun Kim , Myung Whun Chang
发明人： Je Hong Sung , Jin Waun Kim , Myung Whun Chang
IPC分类号： H05K1/03
CPC分类号： H05K3/4061 , H05K1/113 , H05K3/0029 , H05K3/245 , H05K3/4629 , H05K2201/096 , H05K2201/09827 , H05K2201/09845 , H05K2203/0242 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49149 , Y10T29/49155 , Y10T29/49165
摘要： The present invention provides a ceramic substrate including: a ceramic stacked layer structure in which multiple ceramic layers are stacked to be interconnected through a via provided within each of the ceramic layers, the ceramic stacked layer structure having a hole provided therein to expose a top portion of the via provided within a ceramic layer of being a surface layer; a conductive material filled within the hole; and an external electrode formed on the surface of the ceramic stacked layer structure so that the external electrode is electrically connected to the conductive material, and a manufacturing method thereof.
摘要翻译：本发明提供一种陶瓷基板，其特征在于，包括：陶瓷层叠体，其中多个陶瓷层通过设置在各陶瓷层内的通孔进行层叠而互连，所述陶瓷层叠体结构具有设置在其内的孔，位于作为表层的陶瓷层内的通孔; 填充在孔内的导电材料; 以及外部电极，其形成在陶瓷层叠结构的表面上，使得外部电极与导电材料电连接，及其制造方法。

20. 发明授权

US08806731B2 Method of repairing a probe board 有权
标题翻译：修理探针板的方法
公开(公告)号：US08806731B2
公开(公告)日：2014-08-19
申请号：US12987697
申请日：2011-01-10
申请人： Myung Whun Chang , Dae Hyeong Lee , Ki Pyo Hong
发明人： Myung Whun Chang , Dae Hyeong Lee , Ki Pyo Hong
IPC分类号： B23P6/00
CPC分类号： H05K1/11 , G01R1/02 , H05K1/09 , H05K3/225 , H05K3/4015 , H05K3/4061 , Y10T29/49002 , Y10T29/49149 , Y10T29/49165 , Y10T29/49726 , Y10T29/49748
摘要： There is provided a method of repairing a probe board, the method including: preparing a plurality of first via electrodes filled with a first filling material in a board body formed as a ceramic sintered body; forming a via hole for an open via electrode among the plurality of first via electrodes; filling the via hole with a second filling material having a lower sintering temperature than that of the first filling material; and forming a second via electrode by sintering the second filling material. The open via repair according to the present invention improves the manufacturing yield of the board and reduces the manufacturing costs thereof.
摘要翻译：提供了一种修复探针板的方法，所述方法包括：在形成为陶瓷烧结体的板体中制备多个填充有第一填充材料的第一通孔电极; 在所述多个第一通孔电极中形成用于开放通孔电极的通孔; 用具有比第一填充材料低的烧结温度的第二填充材料填充通孔; 以及通过烧结所述第二填充材料形成第二通孔电极。根据本发明的开放通孔修复提高了板的制造成品率并降低了其制造成本。

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