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11. 发明授权

US07755155B2 Packaging structure and method for fabricating the same 有权
标题翻译：包装结构及其制造方法
公开(公告)号：US07755155B2
公开(公告)日：2010-07-13
申请号：US12233807
申请日：2008-09-19
申请人： Guoping Yu , Zhiqi Wang , Guoqing Yu , Wei Wang , Quihong Zou
发明人： Guoping Yu , Zhiqi Wang , Guoqing Yu , Wei Wang , Quihong Zou
IPC分类号： H01L31/02
CPC分类号： H01L27/14683 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L27/14618 , H01L2224/0401 , H01L2224/13022 , H01L2224/16 , H01L2924/14 , H01L2924/15311
摘要： The present invention provides a packaging structure and a method for fabricating the same, the packaging structure includes a chip, a compatible pad provided on the chip, an intermediate metal layer electrically connecting with the compatible pad, a solder bump, and a redistribution metal layer electrically connecting with the solder bump, wherein the redistribution metal layer connects with the intermediate metal layer directly to form an electrical connection. Also, some connections between the redistribution metal layer and the intermediate metal layer are in a manner of concave shape, while other connections between the redistribution metal layer and the intermediate metal layer are in a manner of “-” shape, so that the number of the connections increases while the stability of connection is ensured.
摘要翻译：本发明提供了一种封装结构及其制造方法，封装结构包括芯片，设置在芯片上的兼容焊盘，与兼容焊盘电连接的中间金属层，焊料凸块和再分布金属层与焊料凸块电连接，其中再分布金属层直接与中间金属层连接以形成电连接。此外，再分布金属层和中间金属层之间的一些连接呈凹形，而再分布金属层与中间金属层之间的其它连接呈“ - ”形状，因此，连接增加，同时确保连接的稳定性。

12. 发明授权

US08174090B2 Packaging structure 有权
标题翻译：包装结构
公开(公告)号：US08174090B2
公开(公告)日：2012-05-08
申请号：US12434199
申请日：2009-05-01
申请人： Zhiqi Wang , Guoqing Yu , Qiuhong Zou , Youjun Wang , Wei Wang
发明人： Zhiqi Wang , Guoqing Yu , Qiuhong Zou , Youjun Wang , Wei Wang
IPC分类号： H01L31/00
CPC分类号： H01L27/14687 , H01L24/13 , H01L27/14618 , H01L2224/05001 , H01L2224/05008 , H01L2224/0554 , H01L2224/05548 , H01L2224/05569 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2924/01028 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The invention discloses a packaging structure and packaging method. The packaging structure includes a solder bump, a pad located on a front side of a chip, and an intermediate metal layer which connects the solder bump and the pad, wherein a through hole passing from a back side of the chip to the pad is provided on the chip, and the intermediate metal layer is connected to the pad within the through hole. In the packaging structure, a through hole is formed on the back side of the chip to expose the pad on the front side of the chip and the intermediate metal layer is connected to the pad within the through hole. This provides a relatively large contacting area therebetween. The connection thus formed is more reliable and stable, compared with the prior art structure.
摘要翻译：本发明公开了一种包装结构和包装方法。封装结构包括焊料凸块，位于芯片前侧的焊盘和连接焊料凸块和焊盘的中间金属层，其中提供从芯片的背面通过焊盘的通孔并且中间金属层在通孔内连接到焊盘。在封装结构中，在芯片的背面形成通孔，露出芯片正面的焊盘，中间金属层与通孔内的焊盘连接。这提供了它们之间相对较大的接触面积。与现有技术的结构相比，这样形成的连接更可靠和稳定。

13. 发明申请

US20100133640A1 PACKAGING METHOD AND PACKAGING STRUCTURE 有权
标题翻译：包装方法和包装结构
公开(公告)号：US20100133640A1
公开(公告)日：2010-06-03
申请号：US12434199
申请日：2009-05-01
申请人： Zhiqi Wang , Guoqing Yu , Qiuhong Zou , Youjun Wang , Wei Wang
发明人： Zhiqi Wang , Guoqing Yu , Qiuhong Zou , Youjun Wang , Wei Wang
IPC分类号： H01L31/0224 , H01L21/768
CPC分类号： H01L27/14687 , H01L24/13 , H01L27/14618 , H01L2224/05001 , H01L2224/05008 , H01L2224/0554 , H01L2224/05548 , H01L2224/05569 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2924/00014 , H01L2924/14 , H01L2924/00 , H01L2924/01028 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The invention discloses a packaging structure and packaging method. The packaging structure includes a solder bump, a pad located on a front side of a chip, and an intermediate metal layer which connects the solder bump and the pad, wherein a through hole passing from a back side of the chip to the pad is provided on the chip, and the intermediate metal layer is connected to the pad within the through hole. In the packaging structure, a through hole is formed on the back side of the chip to expose the pad on the front side of the chip and the intermediate metal layer is connected to the pad within the through hole. This provides a relatively large contacting area therebetween. The connection thus formed is more reliable and stable, compared with the prior art structure.
摘要翻译：本发明公开了一种包装结构和包装方法。封装结构包括焊料凸块，位于芯片前侧的焊盘和连接焊料凸块和焊盘的中间金属层，其中提供从芯片的背面通过焊盘的通孔并且中间金属层在通孔内连接到焊盘。在封装结构中，在芯片的背面形成通孔，露出芯片正面的焊盘，中间金属层与通孔内的焊盘连接。这提供了它们之间相对较大的接触面积。与现有技术的结构相比，这样形成的连接更可靠和稳定。

14. 发明申请

US20100065956A1 PACKAGING STRUCTURE, PACKAGING METHOD AND PHOTOSENSITIVE DEVICE 审中-公开
标题翻译：包装结构，包装方法和感光装置
公开(公告)号：US20100065956A1
公开(公告)日：2010-03-18
申请号：US12412778
申请日：2009-03-27
申请人： Zhiqi WANG , Guoqing Yu , Qiuhong Zou , Wei Wang
发明人： Zhiqi WANG , Guoqing Yu , Qiuhong Zou , Wei Wang
IPC分类号： H01L23/485 , H01L21/50
CPC分类号： H01L27/14618 , H01L24/16 , H01L27/14627 , H01L27/14636 , H01L27/14683 , H01L27/14685 , H01L31/0203 , H01L31/0232 , H01L2224/05001 , H01L2224/05008 , H01L2224/05548 , H01L2224/05569 , H01L2224/05624 , H01L2224/05644 , H01L2224/05655 , H01L2924/00014 , H01L2924/01079 , H01L2924/14 , H01L2924/3025 , H01L2224/05099 , H01L2924/01028
摘要： The application provides a packaging structure, a packaging method and a photosensitive device. The packaging structure includes a substrate structure, a chip and a solder bump electrically connecting with a pad on the chip. The solder bump is located on the substrate structure, so that the multilayer coverage structure required when forming a bump on a side of the chip in the prior art packaging structure is avoided. In this way, the thickness of the packaging structure is reduced and the reliably of the packaging structure is improved.
摘要翻译：该应用提供包装结构，包装方法和感光装置。封装结构包括与芯片上的焊盘电连接的衬底结构，芯片和焊料凸块。焊料凸块位于衬底结构上，从而避免了在现有技术的封装结构中在芯片侧面形成凸块所需的多层覆盖结构。以这种方式，减小了包装结构的厚度，提高了包装结构的可靠性。

15. 发明授权

US08445919B2 Wafer-level package structure of light emitting diode and manufacturing method thereof 有权
标题翻译：发光二极管的晶圆级封装结构及其制造方法
公开(公告)号：US08445919B2
公开(公告)日：2013-05-21
申请号：US12708943
申请日：2010-02-19
申请人： Junjie Li , Wenbin Wang , Qiuhong Zou , Guoqing Yu , Wei Wang
发明人： Junjie Li , Wenbin Wang , Qiuhong Zou , Guoqing Yu , Wei Wang
IPC分类号： H01L27/15 , H01L31/12 , H01L33/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/60 , H01L2224/16 , H01L2933/0033
摘要： A wafer-level package structure of a light emitting diode and a manufacturing method thereof, and the package structure includes: a die including a first side and a second side opposite to the first side; a first insulating layer on the first side of the die; at least two wires which are arranged on the insulating layer and electrically isolated from each other; bumps which are arranged on the wires and adapted to be electrically connected correspondingly with electrodes of a bare chip of the light emitting diode; at least two discrete lead areas on the second side of the die; and leads in the lead areas, electrically isolated from each other and electrically connected correspondingly with the wires. The invention forms the leads on the second side of the substrate to extract the electrodes of the light emitting diode, that is, the light emitting diode and the leads thereof are located on the two opposite sides of the substrate in the technical solution of the invention, to thereby reduce the area required for the substrate; and the electrodes can be extracted in the subsequent structure of the package without gold wiring to thereby further reduce the volume of the package.
摘要翻译：发光二极管的晶片级封装结构及其制造方法，封装结构包括：模具，其包括第一侧和与第一侧相对的第二侧; 在所述模具的第一侧上的第一绝缘层; 布置在绝缘层上并彼此电隔离的至少两根导线; 布置在导线上并适于与发光二极管的裸芯片的电极相对应地电连接的凸块; 在模具的第二面上的至少两个离散引线区域; 并且在引线区域中引线，彼此电隔离并且与导线相应地电连接。本发明在本发明的技术方案中在基板的第二面上形成引线以提取发光二极管的电极，即发光二极管及其引线位于基板的相对两侧，从而减小基板所需的面积; 并且可以在包装的后续结构中提取电极，而不需要金线，从而进一步减小包装的体积。

16. 发明授权

US07795074B2 WLCSP target and method for forming the same 有权
标题翻译： WLCSP目标和形成方法
公开(公告)号：US07795074B2
公开(公告)日：2010-09-14
申请号：US12352858
申请日：2009-01-13
申请人： Mingda Shao , Guoqing Yu , Wei Wang , Hanyu Li , Xiaohua Huang
发明人： Mingda Shao , Guoqing Yu , Wei Wang , Hanyu Li , Xiaohua Huang
IPC分类号： H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/568 , H01L24/94 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： The invention provides a Wafer Level Chip Size Packaging (WLCSP) target and a method for forming it. A WLCSP target is formed by recombining single chips, wafer parts each including two or more chips or half finished packaging targets which have been subjected to at least one previous step of packaging onto a first substrate, or bonding a wafer part which is formed by dicing a whole wafer and includes at least two chips to a second substrate for bonding. Thus, a wafer with a larger size can be packaged through the WLCSP on a WLCSP apparatus with a smaller size while benefiting from the advantages of the WLCSP, the WLCSP apparatus remains applicable within a longer period of time, the cost is lowered, and enterprises may keep up with the development of the market and the increase of the wafer size without having to update the WLCSP apparatus substantially.
摘要翻译：本发明提供一种晶片级芯片尺寸封装（WLCSP）靶及其形成方法。通过将单个芯片，每个包括两个或更多个芯片的半成品包装靶或已经经受至少一个前述包装步骤的半成品封装目标的晶片部分重新组合到第一基板上，或者通过切割形成的晶片部分整个晶片，并且包括至少两个芯片到第二基板用于结合。因此，具有较大尺寸的晶片可以通过WLCSP封装在具有较小尺寸的WLCSP装置上，同时受益于WLCSP的优点，WLCSP装置在较长时间内保持适用，成本降低，企业可以跟上市场的发展和晶片尺寸的增加，而不必基本上更新WLCSP设备。

17. 发明申请

US20100171134A1 OPTICAL CONVERTER AND MANUFACTURING METHOD THEREOF AND LIGHT EMITTING DIODE 审中-公开
标题翻译：光转换器及其制造方法及其发光二极管
公开(公告)号：US20100171134A1
公开(公告)日：2010-07-08
申请号：US12482230
申请日：2009-06-10
申请人： Mingda Shao , Junjie Li , Hanyu Li , Qiuhong Zou , Zhiqi Wang , Guoqing Yu , Youjun Wang , Wei Wang
发明人： Mingda Shao , Junjie Li , Hanyu Li , Qiuhong Zou , Zhiqi Wang , Guoqing Yu , Youjun Wang , Wei Wang
IPC分类号： G02F1/35 , H01L33/00 , B32B17/00 , C03C27/10
CPC分类号： H01L33/507 , H01L2933/0041
摘要： The present invention relates to an optical converter and a manufacturing method thereof and a light emitting diode. An optical converter for a light emitting diode includes two substrates, in which, a annular first cavity wall is arranged between the two substrates, and an airtight space filled with an optical conversion substance is surrounded by the first cavity wall and the two substrates. The invention implements the encapsulation and manufacturing of the optical conversion substance for the LED. The structure and the manufacturing method according to the invention can be utilized to encapsulate an active optical conversion substance in the optical converter while avoiding the active optical conversion substance reacting to other active substance, e.g., oxygen, during manufacturing. Furthermore, the optical conversion substance is encapsulated with wafer level chip size packaging to thereby improve the efficiency of manufacturing the optical converter and reduce the cost.
摘要翻译：本发明涉及一种光转换器及其制造方法和发光二极管。用于发光二极管的光转换器包括两个基板，其中在两个基板之间布置环形第一空腔壁，并且填充有光学转换物质的气密空间被第一空腔壁和两个基板包围。本发明实现了用于LED的光转换物质的封装和制造。根据本发明的结构和制造方法可以用于在光学转换器中封装有源光学转换物质，同时避免在制造期间与其它活性物质例如氧反应的活性光学转换物质。此外，光学转换物质用晶片级芯片尺寸封装封装，从而提高了光转换器制造的效率并降低了成本。

18. 发明申请

US20100044857A1 WLCSP TARGET AND METHOD FOR FORMING THE SAME 有权
标题翻译： WLCSP目标及其形成方法
公开(公告)号：US20100044857A1
公开(公告)日：2010-02-25
申请号：US12352858
申请日：2009-01-13
申请人： Mingda Shao , Guoqing Yu , Wei Wang , Hanyu Li , Xiaohua Huang
发明人： Mingda Shao , Guoqing Yu , Wei Wang , Hanyu Li , Xiaohua Huang
IPC分类号： H01L21/78 , H01L23/00
CPC分类号： H01L23/3114 , H01L21/561 , H01L21/568 , H01L24/94 , H01L2924/01033 , H01L2924/01082 , H01L2924/14 , H01L2924/1461 , H01L2924/00
摘要： The invention provides a Wafer Level Chip Size Packaging (WLCSP) target and a method for forming it. A WLCSP target is formed by recombining single chips, wafer parts each including two or more chips or half finished packaging targets which have been subjected to at least one previous step of packaging onto a first substrate, or bonding a wafer part which is formed by dicing a whole wafer and includes at least two chips to a second substrate for bonding. Thus, a wafer with a larger size can be packaged through the WLCSP on a WLCSP apparatus with a smaller size while benefiting from the advantages of the WLCSP, the WLCSP apparatus remains applicable within a longer period of time, the cost is lowered, and enterprises may keep up with the development of the market and the increase of the wafer size without having to update the WLCSP apparatus substantially.
摘要翻译：本发明提供一种晶片级芯片尺寸封装（WLCSP）靶及其形成方法。通过将单个芯片，每个包括两个或更多个芯片的半成品包装靶或已经经受至少一个前面的包装步骤的半成品包装靶，将单个芯片，晶片部分重新组合形成WLCSP靶，或者通过切割形成的晶片部分整个晶片，并且包括至少两个芯片到第二基板用于结合。因此，具有较大尺寸的晶片可以通过WLCSP封装在具有较小尺寸的WLCSP装置上，同时受益于WLCSP的优点，WLCSP装置在较长时间内保持适用，成本降低，企业可以跟上市场的发展和晶片尺寸的增加，而不必基本上更新WLCSP设备。

19. 发明授权

US12115004B2 Method and apparatus for processing physiological signals and non-transitory computer-readable medium 有权
公开(公告)号：US12115004B2
公开(公告)日：2024-10-15
申请号：US17445866
申请日：2021-08-25
申请人： Luyun Qin , Ke Liao , Xiaojing Fan , Jinting Hou , Wei Wang
发明人： Luyun Qin , Ke Liao , Xiaojing Fan , Jinting Hou , Wei Wang
IPC分类号： A61B5/00
CPC分类号： A61B5/7232 , A61B5/7203 , A61B5/7225
摘要： Disclosed are a method and apparatus for processing physiological signals. The method is inclusive of steps of obtaining the physiological signals; grouping the physiological signals based on their sampling frequencies and/or generation mechanisms, so as to acquire grouping results; and compressing, based on the grouping results, each group of physiological signals.

20. 发明公开

US20240312634A1 RISK RELATIONSHIP MENTAL HEALTH EQUIPMENT MANAGEMENT SYSTEM 审中-公开
公开(公告)号：US20240312634A1
公开(公告)日：2024-09-19
申请号：US18183493
申请日：2023-03-14
申请人： Wei Wang , Moira E. Pierce , Matthew W. Brown
发明人： Wei Wang , Moira E. Pierce , Matthew W. Brown
IPC分类号： G16H50/30 , G16H10/60
CPC分类号： G16H50/30 , G16H10/60
摘要： A mental health equipment data store may contain electronic records associated with mental health equipment identifiers. For each mental health equipment identifier, the data store may include a communication address and associated equipment parameters. A risk relationship data store may contain electronic records associated with parties having risk relationships with an enterprise. A back-end application computer server may associate a selected equipment identifier in the mental health equipment data store with a selected party having a risk relationship with the enterprise. The server may update the risk relationship data store with the selected equipment identifier and arrange to collect selected mental health data for the selected party in accordance with the communication address of the selected equipment identifier. The selected mental health data is input to a predictive model algorithm, and the server automatically executes a treatment workflow for the selected party based on an output of the algorithm.

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