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11. 发明授权

US07329831B2 Laser trimming of resistors 有权
标题翻译：激光微调电阻
公开(公告)号：US07329831B2
公开(公告)日：2008-02-12
申请号：US11094003
申请日：2005-03-29
申请人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
发明人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
IPC分类号： B23K26/38
CPC分类号： H05K1/167 , B23K26/351 , H01C17/242 , H05K1/116 , H05K3/027 , H05K2203/171
摘要： Improved systems and methods for laser trimming resistors printed on a substrate layer are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each resistor with their respective target value. The laser drill uses the laser trim files to trim the resistors within each bin in accordance with the laser trim file assigned to that bin.
摘要翻译：提供了改进的印刷在基底层上的激光微调电阻的系统和方法。示例性实施例测量每个环形电阻器的电阻值，并且基于所测量的电阻值和与每个电阻器相关联的目标电阻值，将环形电阻器分类成一个或多个箱体。然后可以基于预测装饰公式将激光修剪文件分配给每个仓，其中每个激光修剪文件定义一组激光钻孔的配置参数，以使每个电阻器具有其各自的目标值。激光钻孔机使用激光修剪文件根据分配给该纸盒的激光修剪文件来修整每个纸槽内的电阻器。

12. 发明申请

US20060199390A1 Simultaneous and selective partitioning of via structures using plating resist 审中-公开
标题翻译：使用电镀抗蚀剂同时选择性地分配通孔结构
公开(公告)号：US20060199390A1
公开(公告)日：2006-09-07
申请号：US11369448
申请日：2006-03-06
申请人： George Dudnikov , Franz Gisin
发明人： George Dudnikov , Franz Gisin
IPC分类号： H01L21/311 , H01L23/48
CPC分类号： H05K3/429 , H05K1/0257 , H05K1/0259 , H05K1/116 , H05K1/167 , H05K3/184 , H05K3/422 , H05K2201/0187 , H05K2201/0738 , H05K2201/096 , H05K2201/09645 , H05K2201/09718 , H05K2201/09881 , Y10T29/49117 , Y10T29/49124 , Y10T29/49126 , Y10T29/49139 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165
摘要： Systems and methods for simultaneously partitioning a plurality of via structures into electrically isolated portions by using plating resist within a PCB stackup are disclosed. Such via structures are made by selectively depositing plating resist in one or more locations in a sub-composite structure. A plurality of sub-composite structures with plating resist deposited in varying locations are laminated to form a PCB stackup of a desired PCB design. Through-holes are drilled through the PCB stackup through conductive layers, dielelectric layers and through the plating resist. Thus, the PCB panel has multiple through-holes that can then be plated simultaneously by placing the PCB panel into a seed bath, followed by immersion in an electroless copper bath. Such partitioned vias increase wiring density and limit stub formation in via structures. Such partitioned vias allow a plurality of electrical signals to traverse each electrically isolated portion without interference from each other.
摘要翻译：公开了通过在PCB堆叠中使用电镀抗蚀剂将多个通孔结构同时分隔成电隔离部分的系统和方法。通过在子复合结构中的一个或多个位置选择性地沉积电镀抗蚀剂来制造这种通孔结构。具有在不同位置沉积的电镀抗蚀剂的多个亚复合结构层压以形成期望的PCB设计的PCB堆叠。通过导电层，电介质层和电镀抗蚀剂在PCB堆叠中钻出通孔。因此，PCB面板具有多个通孔，然后可以通过将PCB面板放置在种子池中，然后浸入无电解铜浴中而同时进行电镀。这种分隔的通孔增加布线密度并限制通孔结构中的短截线形成。这种分隔的通孔允许多个电信号穿过每个电隔离部分而没有彼此的干扰。

13. 发明授权

US06972391B2 Laser trimming of annular passive components 有权
标题翻译：环形无源元件的激光修整
公开(公告)号：US06972391B2
公开(公告)日：2005-12-06
申请号：US10302099
申请日：2002-11-21
申请人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
发明人： Nicholas Biunno , Atul Patel , Ken Ogle , George Dudnikov
IPC分类号： H01C17/242 , H05K1/11 , H05K1/16 , H05K3/02 , B23K26/38
CPC分类号： H05K1/167 , H01C17/242 , H05K1/116 , H05K3/027 , H05K2203/171
摘要： Improved systems and methods for laser trimming annular resistors printed on a circuit board are provided. An exemplary embodiment measures a resistance value for each annular resistor and sorts the annular resistors into one or more bins based on the measured resistance values and target resistance values associated with each annular resistor. A laser trim file may then be assigned to each bin based on a predictive trim formulation, where each laser trim file defines a set of configuration parameters for a laser drill to conform each annular resistor with their respective target value. The laser drill uses laser trim files to trim the annular resistors within each bin in accordance with a laser trim file assigned to that bin.
摘要翻译：提供了印刷在电路板上的用于激光修整环形电阻器的改进的系统和方法。示例性实施例测量每个环形电阻器的电阻值，并且基于与每个环形电阻器相关联的测量的电阻值和目标电阻值，将环形电阻器分类成一个或多个箱体。然后可以基于预测装配公式将激光修剪文件分配给每个仓，其中每个激光修剪文件定义一组激光钻孔的配置参数，以使每个环形电阻器与其各自的目标值一致。激光钻孔机使用激光修剪文件根据分配给该仓的激光修剪文件来修整每个仓内的环形电阻器。

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