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11. 发明授权

US07131193B2 Heat-shrinkable retainer for PCB double-sided assembly 失效
公开(公告)号：US07131193B2
公开(公告)日：2006-11-07
申请号：US10847989
申请日：2004-05-17
申请人： Arjang Fartash , Christopher D. Combs , Raiyomand Aspandiar , Tom E. Pearson
发明人： Arjang Fartash , Christopher D. Combs , Raiyomand Aspandiar , Tom E. Pearson
IPC分类号： H05K3/36
CPC分类号： H05K3/303 , H05K3/301 , H05K3/3415 , H05K2201/0125 , H05K2201/09072 , H05K2201/10598 , H05K2201/10734 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49147 , Y10T29/49153
摘要： An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.

12. 外观设计

USD456249S1 Plastic package with pull tab 失效
标题翻译：塑料包装拉扯
公开(公告)号：USD456249S1
公开(公告)日：2002-04-30
申请号：US29134839
申请日：2000-12-29
申请人： Tom E. Pearson , Christopher D. Combs
设计人： Tom E. Pearson , Christopher D. Combs

13. 发明授权

US06875931B2 Retainer for circuit board assembly and method for using the same 失效
标题翻译：电路板组装用保持器及其使用方法
公开(公告)号：US06875931B2
公开(公告)日：2005-04-05
申请号：US10198792
申请日：2002-07-18
申请人： Christopher D. Combs , Arjang Fartash , Raiyomand Aspandiar , Tom E. Pearson
发明人： Christopher D. Combs , Arjang Fartash , Raiyomand Aspandiar , Tom E. Pearson
IPC分类号： H05K3/30 , H05K3/34 , H05R12/04 , H05K1/11
CPC分类号： H05K3/303 , H01L2224/81141 , H01L2924/15151 , H05K3/3415 , H05K3/3436 , H05K2201/0308 , H05K2201/09072 , H05K2201/10598 , Y02P70/613
摘要： An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-expandable member and a retainer member. Being formed from a heat-expandable material, the heat-expandable member is coupled with the retainer member and is disposed about a periphery thereof. The retainer member is configured to be coupled with a component and, when the component is assembled onto a double-sided printed circuit board, to be received by an opening formed in the double-sided printed circuit board. The heat-expandable member is configured to expand during assembly of the component, engaging an inner surface that defines the opening. Thereby, the component is retained and supported when the double-sided printed circuit board is subsequently inverted, populated, and reflowed.
摘要翻译：一种用于在随后位于双面印刷电路板的相对侧上的其它部件的回流期间在双面印刷电路板的一侧上保持组装的部件的装置及其制造和使用方法。保持器包括热膨胀构件和保持构件。由可热膨胀材料形成的热膨胀构件与保持构件联接并围绕其周围设置。保持构件被构造成与部件联接，并且当组件组装到双面印刷电路板上时，保持构件被形成在双面印刷电路板中的开口接收。热膨胀构件构造成在组件的组装期间膨胀，与限定开口的内表面接合。因此，当双面印刷电路板随后被倒置，填充和回流时，该部件被保持和支撑。

14. 发明授权

US06472612B2 Printed circuit board with embedded thermocouple junctions 失效
标题翻译：带嵌入式热电偶接头的印刷电路板
公开(公告)号：US06472612B2
公开(公告)日：2002-10-29
申请号：US09822989
申请日：2001-03-30
申请人： Arjang Fartash , Raiyomand Aspandiar , Tom E. Pearson , Christopher D. Combs
发明人： Arjang Fartash , Raiyomand Aspandiar , Tom E. Pearson , Christopher D. Combs
IPC分类号： H05K116
CPC分类号： G01K7/04 , H05K1/0201 , H05K2201/10151
摘要： A first strip and a second strip of metal are embedded on a first layer of a printed circuit board (PCB) to form a junction. The junction has a first strip tail and a second strip tail. The first strip and the second strip are made of different metals. A first trace and a second trace are fabricated on a second layer to extend the junction to a first trace pad and a second trace pad, respectively. The first and second traces are fabricated on a second layer. The first and second traces have a first end one and a second end one, respectively. The first end one is connected to the first strip using a first via and the second end one is connected to the second strip using a second via. A first wire is inserted to the first via and a second wire to the second via to measure the temperature of the PCB.
摘要翻译：第一条带和第二条金属条被嵌入在印刷电路板（PCB）的第一层上以形成结。连接处具有第一条带尾部和第二条带尾部。第一条带和第二条带由不同的金属制成。在第二层上制造第一迹线和第二迹线，以将结点分别延伸到第一迹线焊盘和第二迹线焊盘。第一和第二迹线被制造在第二层上。第一和第二迹线分别具有第一端和第二端。第一端部使用第一通孔连接到第一条带，并且第二端部使用第二通孔连接到第二条带。将第一导线插入到第一通孔中，将第二导线插入第二通孔以测量PCB的温度。

15. 发明授权

US06906268B2 Heat-shrinkable retainer for PCB double-sided assembly 失效
标题翻译：用于PCB双面组装的热缩保持架
公开(公告)号：US06906268B2
公开(公告)日：2005-06-14
申请号：US10022821
申请日：2001-12-14
申请人： Arjang Fartash , Christopher D. Combs , Raiyomand Aspandiar , Tom E. Pearson
发明人： Arjang Fartash , Christopher D. Combs , Raiyomand Aspandiar , Tom E. Pearson
IPC分类号： H05K3/30 , H05K3/34 , H05K1/00
CPC分类号： H05K3/303 , H05K3/301 , H05K3/3415 , H05K2201/0125 , H05K2201/09072 , H05K2201/10598 , H05K2201/10734 , Y02P70/613 , Y10T29/49126 , Y10T29/4913 , Y10T29/49139 , Y10T29/49144 , Y10T29/49147 , Y10T29/49153
摘要： An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned on an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. The retainer includes a heat-shrinkable member and a retaining member. Being formed from a heat-shrinkable material, the heat-shrinkable member is configured to receive a post extending through an opening formed in a double-sided printed circuit board from a component previously assembled on one side thereof. The retaining member is coupled with the heat-shrinkable member, and the double-sided printed circuit board is disposed substantially between the retaining member and the component. The heat-shrinkable member is configured to shrinkably engage the post when an opposite side of the double-sided printed circuit board is populated and reflowed, retaining the inverted component on the double-sided printed circuit board.
摘要翻译：一种用于在随后位于双面印刷电路板的相对侧上的其它部件的回流期间在双面印刷电路板的一侧上保持组装的部件的装置及其制造和使用方法。保持器包括热收缩构件和保持构件。由热收缩材料形成的热收缩构件被构造成从预先组装在其一侧上的部件接收通过形成在双面印刷电路板中的开口延伸的柱。保持构件与热收缩构件联接，并且双面印刷电路板基本上设置在保持构件和部件之间。当双面印刷电路板的相反侧被填充和回流时，热收缩构件被构造成可收缩地接合柱，将倒置的部件保持在双面印刷电路板上。

16. 发明授权

US06791189B2 Epoxy washer for retention of inverted SMT components 失效
标题翻译：用于保留反向SMT组件的环氧树脂垫圈
公开(公告)号：US06791189B2
公开(公告)日：2004-09-14
申请号：US10313238
申请日：2002-12-05
申请人： Tom E. Pearson , Christopher D. Combs , Arjang Fartash , Raiyomand Aspandiar
发明人： Tom E. Pearson , Christopher D. Combs , Arjang Fartash , Raiyomand Aspandiar
IPC分类号： H01L2348
CPC分类号： H05K3/305 , H01L2924/15151 , H05K3/3415 , H05K2201/09072 , H05K2201/10568 , H05K2201/10734 , H05K2203/1105 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149
摘要： An apparatus to retain an assembled component on one side of a double-sided printed circuit board during reflow of other components subsequently positioned onto an opposite side of the double-sided printed circuit board and methods for manufacturing and using the same. Being formed from an epoxy material, the retainer is configured to be coupled with a component, which is then positioned onto a printed circuit board. During a subsequent solder reflow stage, an ambient temperature surrounding the printed circuit board increases, and the epoxy material is configured to enter a semi-liquid state, flowing onto, and adhering with, the printed circuit board. Upon reaching a typical solder reflow temperature, the liquefied epoxy material is configured to cure or harden, adhesively coupling the component with the printed circuit board. Thereby, the component is inhibited from separating from the printed circuit board when the printed circuit board is subsequently inverted, populated, and reflowed.
摘要翻译：一种在随后位于双面印刷电路板的相对侧上的其它部件的回流焊接及其制造和使用双面印刷电路板的相对侧的其它部件的回焊期间将组装部件保持在双面印刷电路板的一侧上的装置。由环氧树脂材料形成，保持器被构造成与部件联接，然后将其定位在印刷电路板上。在随后的回流焊步骤期间，印刷电路板周围的环境温度升高，并且环氧树脂材料被配置为进入半液态，流到印刷电路板上并与印刷电路板粘附。在达到典型的回流焊温度时，液化环氧树脂材料被配置成固化或硬化，将组件与印刷电路板粘合地连接。因此，当印刷电路板随后被倒置，填充和回流时，该部件被禁止与印刷电路板分离。

17. 发明授权

US06691407B2 Methods for retaining assembled components 失效
标题翻译：保持组装部件的方法
公开(公告)号：US06691407B2
公开(公告)日：2004-02-17
申请号：US10020859
申请日：2001-12-13
申请人： Tom E. Pearson , Christopher D. Combs , Arjang Fartash , Raiyomand Aspandiar
发明人： Tom E. Pearson , Christopher D. Combs , Arjang Fartash , Raiyomand Aspandiar
IPC分类号： H05K332
CPC分类号： H05K3/305 , H01L2924/15151 , H05K3/3415 , H05K2201/09072 , H05K2201/10568 , H05K2201/10734 , H05K2203/1105 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49149
摘要： A method to retain an assembled component on one side of a double-sided printed circuit board. In one embodiment, an adhesive body, in a solid state, is coupled with a component by disposing a coupling member extending from said component within a channel formed in said adhesive body such that the coupling member is engaged with at least one engaging member, said at least one engaging member each extending into said channel from an internal surface defining said channel. The component is then assembled onto a printed circuit board and adhered onto the printed circuit board via the adhesive body when the adhesive body is in semi-liquid state.
摘要翻译：一种在双面印刷电路板的一侧上保持组装的部件的方法。在一个实施例中，固体状态的粘合剂体通过将形成在所述粘合体中的通道中的所述部件延伸的连接部件与部件联接，使得所述连接部件与至少一个接合部件接合，所述接合部件每个至少一个接合构件从限定所述通道的内表面延伸到所述通道中。然后当粘合体处于半液态时，将组件组装到印刷电路板上并通过粘合体粘附到印刷电路板上。

18. 发明授权

US07036217B2 Methods of manufacturing via intersect pad for electronic components 失效
公开(公告)号：US07036217B2
公开(公告)日：2006-05-02
申请号：US10348159
申请日：2003-01-21
申请人： Tom E. Pearson , Carolyn R. McCormick , Jayne L. Mershon
发明人： Tom E. Pearson , Carolyn R. McCormick , Jayne L. Mershon
IPC分类号： H05K3/34
CPC分类号： H05K1/113 , H05K1/0231 , H05K1/114 , H05K3/3442 , H05K2201/10636 , H05K2203/0455 , Y02P70/611 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49147 , Y10T29/49165 , Y10T29/49169
摘要： According to a method of mounting electronic components on a printed circuit board (PCB), the electrical contacts of the components are coupled to PCB bonding pads that are intersected by via pads. To minimize various defects encountered during solder reflow, while concurrently minimizing PCB area and manufacturing costs, the via pads are formed so that the via holes substantially avoid underlying the solder fillets coupling the component contacts to the PCB bonding pads. In one embodiment, the via pads are formed in the inter-pad space beneath the component; in another embodiment they are offset from the bonding pads. A substrate, an electronic assembly, and an electronic system are also described.

19. 发明申请

US20120155602A1 TEMPORAL BASED MOTION SENSOR REPORTING 有权
标题翻译：基于时间的运动传感器报告
公开(公告)号：US20120155602A1
公开(公告)日：2012-06-21
申请号：US12969318
申请日：2010-12-15
申请人： Terrance J. O'Shea , Tom E. Pearson
发明人： Terrance J. O'Shea , Tom E. Pearson
IPC分类号： G07C3/02
CPC分类号： G08B21/18 , G01S11/12 , G08B13/191 , G08B21/0469
摘要： Methods and systems may include a motion sensor and logic to sample an output signal of the motion sensor. The logic can also be configured to track an amount of time the motion sensor is triggered based on the output signal, and transmit the amount of time over a wireless link on a periodic basis.
摘要翻译：方法和系统可以包括运动传感器和用于对运动传感器的输出信号进行采样的逻辑。逻辑还可以被配置为基于输出信号跟踪运动传感器的触发时间量，并且周期性地通过无线链路发送时间量。

20. 发明授权

US07161238B2 Structural reinforcement for electronic substrate 失效
标题翻译：电子基板结构钢筋
公开(公告)号：US07161238B2
公开(公告)日：2007-01-09
申请号：US10335092
申请日：2002-12-31
申请人： George Hsieh , David Shia , Tom E. Pearson
发明人： George Hsieh , David Shia , Tom E. Pearson
IPC分类号： H01L23/12
CPC分类号： H01L23/42 , H01L2224/16 , H01L2224/73253 , H01L2924/00014 , H05K1/0271 , H05K3/301 , H05K3/3447 , H05K2201/10734 , H05K2201/2009 , H01L2224/0401
摘要： Embodiments of stiffening members in accordance with the present invention provide a mechanical support that is wave soldered to the frontside of the system substrate simultaneously with other wave soldered components. The stiffening member comprises a flat plate with a plurality of mounting pins. The number of mounting pins are predetermined to provide the plate with sufficient support to resist expected loading conditions when wave soldered in plated through holes on a system substrate. The mounting pins are adapted for insertion into plated through holes on the system substrate. The length of the mounting pins are predetermined to account for the height of the SMT component upon which it is attached, the thickness of the system substrate, and the desired amount of mounting pin protrusion from the backside of the system substrate. The stiffening members consume very little system substrate space while retaining a platform for heat dissipation.
摘要翻译：根据本发明的加强构件的实施例提供了与其它波形焊接部件同时波纹焊接到系统基板的前侧的机械支撑。加强构件包括具有多个安装销的平板。安装销的数量是预定的，以便在波形焊接在系统基板上的通孔中时，为板提供足够的支撑以抵抗预期的负载状况。安装销适于插入系统基板上的电镀通孔中。安装销的长度是预先确定的，以考虑其附接的SMT部件的高度，系统基板的厚度以及从系统基板的背面的期望的安装销突出量。加强构件消耗非常小的系统基板空间，同时保留用于散热的平台。

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