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11. 发明授权

US07304376B2 Microelectronic assemblies with springs 有权
标题翻译：带弹簧的微电子组件
公开(公告)号：US07304376B2
公开(公告)日：2007-12-04
申请号：US10901407
申请日：2004-07-28
申请人： Belgacem Haba , Jae M. Park , Teck-Gyu Kang , Nicholas J. Colella
发明人： Belgacem Haba , Jae M. Park , Teck-Gyu Kang , Nicholas J. Colella
IPC分类号： H01L23/48
CPC分类号： H01L24/16 , H01L24/11 , H01L24/12 , H01L24/81 , H01L2224/1134 , H01L2224/13144 , H01L2224/13147 , H01L2224/13655 , H01L2224/81143 , H01L2224/81801 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/0105 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , Y10T29/4913 , H01L2924/00015 , H01L2924/00014 , H01L2224/13099
摘要： A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.
摘要翻译：诸如半导体芯片的微电子元件具有弹簧，例如键合到触点的螺旋弹簧，使得弹簧用作与电路板的电连接。该单元可以容易地测试，并且可以通过将远离微电子元件的弹簧的远端粘合到面板上而被表面安装到电路板。弹簧也可以用作天线，以便提供小型化的相控阵列。

12. 发明授权

US5783316A Composite material having high thermal conductivity and process for fabricating same 失效
标题翻译：具有高导热性的复合材料及其制造方法
公开(公告)号：US5783316A
公开(公告)日：1998-07-21
申请号：US703914
申请日：1996-08-22
申请人： Nicholas J. Colella , Howard L. Davidson , John A. Kerns , Daniel M. Makowiecki
发明人： Nicholas J. Colella , Howard L. Davidson , John A. Kerns , Daniel M. Makowiecki
IPC分类号： C22C26/00 , B23K31/02
CPC分类号： C22C26/00 , Y10T428/12479 , Y10T428/12493 , Y10T428/12625 , Y10T428/12806 , Y10T428/1284 , Y10T428/12847 , Y10T428/12882 , Y10T428/12903 , Y10T428/24975 , Y10T428/249967 , Y10T428/24997 , Y10T428/249986 , Y10T428/249987 , Y10T428/24999 , Y10T428/25 , Y10T428/2991 , Y10T428/31678
摘要： A process for fabricating a composite material such as that having high thermal conductivity and having specific application as a heat sink or heat spreader for high density integrated circuits. The composite material produced by this process has a thermal conductivity between that of diamond and copper, and basically consists of coated diamond particles dispersed in a high conductivity metal, such as copper. The composite material can be fabricated in small or relatively large sizes using inexpensive materials. The process basically consists, for example, of sputter coating diamond powder with several elements, including a carbide forming element and a brazeable material, compacting them into a porous body, and infiltrating the porous body with a suitable braze material, such as copper-silver alloy, thereby producing a dense diamond-copper composite material with a thermal conductivity comparable to synthetic diamond films at a fraction of the cost.
摘要翻译：一种制造复合材料的方法，例如具有高导热性并具有特定应用的复合材料作为用于高密度集成电路的散热器或散热器。通过该方法生产的复合材料具有金刚石和铜之间的导热性，并且基本上由分散在诸如铜的高导电性金属中的涂覆的金刚石颗粒组成。复合材料可以使用廉价的材料制造成小尺寸或相对大的尺寸。该方法基本上包括例如溅射镀金刚石粉末，其中包含几种元素，包括碳化物形成元件和可钎焊材料，将其压实成多孔体，并用合适的钎焊材料如铜 - 银渗透多孔体合金，从而制造出具有与人造金刚石膜相当的热导率的致密金刚石 - 铜复合材料，成本仅为成本的一小部分。

13. 发明授权

US5576561A Radiation-tolerant imaging device 失效
标题翻译：辐射耐受成像装置
公开(公告)号：US5576561A
公开(公告)日：1996-11-19
申请号：US291085
申请日：1994-08-18
申请人： Nicholas J. Colella , Joseph R. Kimbrough
发明人： Nicholas J. Colella , Joseph R. Kimbrough
IPC分类号： H01L27/148 , H01L29/768
CPC分类号： H01L27/14831
摘要： A barrier at a uniform depth for an entire wafer is used to produce imaging devices less susceptible to noise pulses produced by the passage of ionizing radiation. The barrier prevents charge created in the bulk silicon of a CCD detector or a semiconductor logic or memory device from entering the collection volume of each pixel in the imaging device. The charge barrier is a physical barrier, a potential barrier, or a combination of both. The physical barrier is formed by an SiO.sub.2 insulator. The potential barrier is formed by increasing the concentration of majority carriers (holes) to combine with the electron's generated by the ionizing radiation. A manufacturer of CCD imaging devices can produce radiation-tolerant devices by merely changing the wafer type fed into his process stream from a standard wafer to one possessing a barrier beneath its surface, thus introducing a very small added cost to his production cost. An effective barrier type is an SiO.sub.2 layer.
摘要翻译：用于整个晶片的均匀深度的屏障用于产生对由电离辐射通过产生的噪声脉冲不太敏感的成像装置。屏障防止在CCD检测器或半导体逻辑或存储器件的体硅中产生的电荷进入成像装置中每个像素的收集体积。电荷屏障是物理屏障，势垒或两者的组合。物理屏障由SiO2绝缘体形成。通过增加多数载流子（空穴）的浓度与电离辐射产生的电子结合而形成势垒。 CCD成像设备的制造商可以通过将从标准晶片馈送到其工艺流中的晶片类型改变为在其表面之下具有屏障的晶片类型来产生耐辐射器件，从而为其生产成本引入非常小的附加成本。有效的屏障类型是SiO 2层。

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