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11. 发明授权

US07339787B2 Heat sink module for dissipating heat from a heat source on a motherboard 有权
标题翻译：散热模块，用于从主板上的热源散热
公开(公告)号：US07339787B2
公开(公告)日：2008-03-04
申请号：US11403948
申请日：2006-04-14
申请人： Yi-Lun Cheng , Chun-Lung Lin , Feng-Ku Wang
发明人： Yi-Lun Cheng , Chun-Lung Lin , Feng-Ku Wang
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat sink module includes a fan set and a heat sink plate. The fan set is integrated as a whole, reducing manufacture time, and the material of the fan set is plastic, thus reducing the weight as well. Due to the hook design of the fan set and the ear design of the heat sink plate, the number of screws is reduced. Furthermore, the screws pass through the first lug of the heat sink plate and the second lug of the fan set, so that the heat sink plate and the fan set are fixed on the motherboard, and thereby the number of the parts to be fixed by screws is reduced. Heat from the heat source on the motherboard is conducted to the fan set to be dispersed through the heat sink plate extending to the heat source and covering the fan set.
摘要翻译：散热器模块包括风扇组和散热板。风扇组整体整合，减少制造时间，风扇组的材质为塑料，减轻重量。由于风扇组的钩设计和散热板的耳设计，螺丝数量减少。此外，螺丝穿过散热板的第一凸耳和风扇组的第二凸耳，使得散热板和风扇组固定在主板上，由此固定的部件的数量由螺丝减少。将来自主板上的热源的热量传导到风扇组，通过延伸到热源的散热板分散并覆盖风扇组。

12. 发明授权

US08641271B2 Method for testing heat pipes 有权
标题翻译：热管测试方法
公开(公告)号：US08641271B2
公开(公告)日：2014-02-04
申请号：US12772540
申请日：2010-05-03
申请人： Feng-Ku Wang , Yi-Lun Cheng , Chih-Kai Yang
发明人： Feng-Ku Wang , Yi-Lun Cheng , Chih-Kai Yang
IPC分类号： G01K1/16
CPC分类号： G01M99/002 , G01K17/00
摘要： A method for testing heat pipes includes the following steps. A plurality of bar-shaped heat pipes having the same size is provided, and the heat pipes are deformed. The deformed heat pipes are placed in a temperature regulator, such that a temperature of the heat pipes is periodically changed between a first temperature and a second temperature. The heat pipes are then taken out of the temperature regulator. One end of each heat pipe is maintained at a third temperature by a thermostatic device, and a heat pipe temperature difference of two opposite ends of the heat pipe is measured. The heat pipes having the heat pipe temperature difference greater than a standard temperature difference in the heat pipes are marked.
摘要翻译：热管测试方法包括以下步骤。提供了多个具有相同尺寸的棒状热管，并且热管变形。变形的热管被放置在温度调节器中，使得热管的温度在第一温度和第二温度之间周期性地变化。然后将热管从温度调节器中取出。每个热管的一端通过恒温装置保持在第三温度，并且测量热管的两个相对端的热管温度差。具有热管温度差大于热管中的标准温差的热管被标记。

13. 发明申请

US20070240639A1 Injector with a coating head 审中-公开
标题翻译：注射器带涂层头
公开(公告)号：US20070240639A1
公开(公告)日：2007-10-18
申请号：US11405640
申请日：2006-04-18
申请人： Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
发明人： Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： B05C3/02 , B05C1/00
CPC分类号： B05C17/00516 , B05C5/02 , H01L21/4882
摘要： An injector with a coating head, for uniformly coating a heat sink paste onto a surface to be coated is provided, which includes a body, a piston, and a coating head, wherein the piston is pressed to force the heat sink paste out of the body through the coating head, and the heat sink paste is molded by the coating head into a shape suitable for uniformly coating the surface to be coated, and is also quantified. Moreover, a scraping surface is provided at the opening of the coating head, for scraping off the redundant heat sink paste from the steel plate and for smoothing the surface of the heat sink paste, in the case that a steel plate is used to assist the quantifying operation of the heat sink paste.
摘要翻译：提供一种具有涂覆头的注射器，用于将散热膏均匀地涂覆在待涂覆的表面上，其包括主体，活塞和涂覆头，其中活塞被压制以迫使散热器膏从通过涂布头将散热膏模制成适于均匀涂布被覆表面的形状，并且也被定量。此外，在涂层头部的开口部设置有刮削面，从钢板上刮掉多余的散热膏，并且在使用钢板来辅助该散热片的情况下使散热膏的表面平滑化定量散热片的操作。

14. 发明授权

US07319592B2 Recyclable protective cover for a heat-conductive medium 有权
标题翻译：用于导热介质的可回收保护罩
公开(公告)号：US07319592B2
公开(公告)日：2008-01-15
申请号：US11401365
申请日：2006-04-11
申请人： Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
发明人： Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/4093 , H01L2023/4068 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.
摘要翻译：提供了具有散热装置的导热介质的保护盖，其用于覆盖和保护放置在散热装置的底部的底表面处的导热介质。它包括片状板，弹性壁和容纳室，其中片状板是凹形的并且位于保护罩的一侧，并具有导热介质; 弹性壁沿片状板的边缘延伸，以便提供用于与散热装置夹紧的夹持力; 并且容纳室由片状基板的凹部形成以遮盖和覆盖导热介质; 而板状板通过弹性壁被夹紧到散热装置，使得容纳室用于掩蔽和覆盖导热介质。

15. 发明申请

US20070237896A1 Recyclable protective cover for a heat-conductive medium 有权
标题翻译：用于导热介质的可回收保护罩
公开(公告)号：US20070237896A1
公开(公告)日：2007-10-11
申请号：US11401365
申请日：2006-04-11
申请人： Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
发明人： Frank Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： B05D5/00 , F28F7/00 , H05K7/20
CPC分类号： H01L23/4093 , H01L2023/4068 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： A protective cover with a heat-conductive medium of a heat sink apparatus is provided, which is used to cover and protect the heat-conductive medium placed at the bottom surface of a base of the heat sink apparatus. It includes a sheet-like board, an elastic wall, and an accommodation chamber, wherein the sheet-like board is concave and located at one side of the protective cover with the heat-conductive medium; the elastic wall is extended along the edge of the sheet-like board so as to provide a clipping force for clipping with the heat sink apparatus; and the accommodation chamber is formed by the concave portion of the sheet-like board to mask and cover the heat-conductive medium; while the sheet-like board is clipped to the heat sink apparatus through the elastic wall, such that the accommodation chamber is used to mask and cover the heat-conductive medium.
摘要翻译：提供了具有散热装置的导热介质的保护盖，其用于覆盖和保护放置在散热装置的底部的底表面处的导热介质。它包括片状板，弹性壁和容纳室，其中片状板是凹形的并且位于保护罩的一侧，并具有导热介质; 弹性壁沿片状板的边缘延伸，以便提供用于与散热装置夹紧的夹持力; 并且容纳室由片状基板的凹部形成以遮盖和覆盖导热介质; 而板状板通过弹性壁被夹紧到散热装置，使得容纳室用于掩蔽和覆盖导热介质。

16. 发明申请

US20100014247A1 ANTI-TURBULENT CASING 审中-公开
标题翻译：防静电箱
公开(公告)号：US20100014247A1
公开(公告)日：2010-01-21
申请号：US12503290
申请日：2009-07-15
申请人： Feng-Ku Wang , Yi-Lun Cheng
发明人： Feng-Ku Wang , Yi-Lun Cheng
IPC分类号： H05K7/20
CPC分类号： H05K7/20145
摘要： An anti-turbulent casing includes a plate and an airflow guiding element. The plate has a first surface and a second surface opposite to the first surface. The first surface faces outward, and the second surface faces an interior of an electronic device. In addition, the plate has an opening passing through the first surface and the second surface. The airflow guiding element is disposed on the plate and has a curved surface and two sidewall surfaces connected between the curved surface and the second surface, and the curved surface protrudes out of the second surface and extends on top of the opening. The airflow guiding element makes the cooling airflow in a state of laminar.
摘要翻译：防湍流壳体包括板和气流引导元件。板具有与第一表面相对的第一表面和第二表面。第一表面朝外，第二表面面向电子设备的内部。此外，板具有穿过第一表面和第二表面的开口。气流引导元件设置在板上，具有弯曲表面和连接在弯曲表面和第二表面之间的两个侧壁表面，并且弯曲表面从第二表面突出并在开口顶部延伸。气流引导元件使冷却气流处于层流状态。

17. 发明授权

US08388221B2 Method for detecting performances of heat dissipation modules 失效
标题翻译：用于检测散热模块性能的方法
公开(公告)号：US08388221B2
公开(公告)日：2013-03-05
申请号：US12748809
申请日：2010-03-29
申请人： Feng-Ku Wang , Yi-Lun Cheng
发明人： Feng-Ku Wang , Yi-Lun Cheng
IPC分类号： G01N25/00 , G01K7/00
CPC分类号： H01L23/367 , G06F1/206 , H01L2924/0002 , H01L2924/00
摘要： A corresponding relation between heat resistance values of first heat dissipation modules under a non-uniform heat source and heat resistance values of the first heat dissipation modules under a uniform heat source is described through a linear equation. Therefore, before second heat dissipation modules are tested, a calculation is performed with the linear equation, such that a target heat resistance value of the first heat dissipation modules arranged on the non-uniform heat source is corresponding to a standard heat resistance value of the first heat dissipation modules arranged on the uniform heat source. Afterwards, it is predicted whether the second heat dissipation modules arranged on the non-uniform heat source satisfy a test standard or not by using a test heat resistance value acquired by testing the second heat dissipation modules arranged on the uniform heat source.
摘要翻译：通过线性方程描述在不均匀热源下的第一散热模块的耐热值与均匀热源下的第一散热模块的耐热值之间的对应关系。因此，在第二散热模块被测试之前，利用线性方程进行计算，使得布置在不均匀热源上的第一散热模块的目标耐热值对应于第一个散热模块布置在均匀的热源上。然后，通过使用通过测试布置在均匀热源上的第二散热模块而获得的测试耐热值来预测布置在不均匀热源上的第二散热模块是否满足测试标准。

18. 发明授权

US08482916B2 Mobile computing apparatus 有权
标题翻译：移动计算设备
公开(公告)号：US08482916B2
公开(公告)日：2013-07-09
申请号：US13176390
申请日：2011-07-05
申请人： Feng-Ku Wang , Yi-Lun Cheng
发明人： Feng-Ku Wang , Yi-Lun Cheng
IPC分类号： H05K7/20
CPC分类号： G06F1/203
摘要： A mobile computing apparatus includes a shell, a circuit board, a first heat-dissipation module, a centrifugal fan for exhaust, and a centrifugal fan for convection. The shell has a first through hole. The circuit board is disposed on the shell, and has a first heat-generation device. The first heat-dissipation module has a first heat-absorption end and a first heat-dissipation end, and the first heat-absorption end thermally contacts with the first heat-generation device. The centrifugal fan for exhaust has a first gas outlet, and the first heat-dissipation end is located between the first gas outlet and the first through hole, so that the centrifugal fan for exhaust exhausts to an outside of the shell. The centrifugal fan for convection is configured in the shell, and exhausts to an inside of the shell. Therefore, gas flow circulation occurs in the shell, so that the mobile computing apparatus has a desirable heat-dissipation effect.
摘要翻译：移动计算装置包括外壳，电路板，第一散热模块，用于排气的离心式风扇和用于对流的离心式风扇。壳有一个第一通孔。电路板设置在外壳上，具有第一发热装置。第一散热模块具有第一吸热端和第一散热端，第一吸热端与第一发热装置热接触。用于排气的离心式风扇具有第一气体出口，第一散热端位于第一气体出口和第一通孔之间，使得用于排气的离心式风扇排出到壳体的外部。用于对流的离心式风扇配置在外壳中，并排放到外壳的内部。因此，在壳体中发生气体流动循环，使得移动计算装置具有期望的散热效果。

19. 发明授权

US08340922B2 Method for estimating fan life 有权
标题翻译：风扇寿命估算方法
公开(公告)号：US08340922B2
公开(公告)日：2012-12-25
申请号：US12748774
申请日：2010-03-29
申请人： Feng-Ku Wang , Yi-Lun Cheng
发明人： Feng-Ku Wang , Yi-Lun Cheng
IPC分类号： G01B3/44
CPC分类号： G06F1/206 , F04D27/001
摘要： A method for estimating a fan life includes the following steps. Fans to be checked at a number of M are provided. A working temperature and a test temperature of a fan are set, and the test temperature is greater than the working temperature. An acceleration factor is set, which has a fixed value. The fans are kept in an operating state at the test temperature, and a number of the damaged fans is detected and recorded at intervals of a check time, until N damaged fans are detected. A distribution of time points when the fans are damaged is simulated with a Weibull distribution model, and a shape parameter and a characteristic life of the Weibull distribution model are calculated. A life value of the fans at the test temperature is calculated. A life value of the fans at the working temperature is calculated by using the acceleration factor.
摘要翻译：用于估计风扇寿命的方法包括以下步骤。提供要在多个M上检查的风扇。设置风扇的工作温度和试验温度，测试温度大于工作温度。加速因子设定为固定值。风扇在测试温度下保持在运行状态，并且在检查时间间隔内检测并记录多个损坏的风扇，直到检测到N个损坏的风扇。用威布尔分布模型模拟风扇损坏时间点的分布，并计算威布尔分布模型的形状参数和特征寿命。计算测试温度下风扇的寿命值。风扇在工作温度下的寿命值通过使用加速度因子进行计算。

20. 发明申请

US20120194995A1 MOBILE COMPUTING APPARATUS 有权
标题翻译：手机计算机
公开(公告)号：US20120194995A1
公开(公告)日：2012-08-02
申请号：US13176390
申请日：2011-07-05
申请人： Feng-Ku Wang , Yi-Lun Cheng
发明人： Feng-Ku Wang , Yi-Lun Cheng
IPC分类号： G06F1/20
CPC分类号： G06F1/203
摘要： A mobile computing apparatus includes a shell, a circuit board, a first heat-dissipation module, a centrifugal fan for exhaust, and a centrifugal fan for convection. The shell has a first through hole. The circuit board is disposed on the shell, and has a first heat-generation device. The first heat-dissipation module has a first heat-absorption end and a first heat-dissipation end, and the first heat-absorption end thermally contacts with the first heat-generation device. The centrifugal fan for exhaust has a first gas outlet, and the first heat-dissipation end is located between the first gas outlet and the first through hole, so that the centrifugal fan for exhaust exhausts to an outside of the shell. The centrifugal fan for convection is configured in the shell, and exhausts to an inside of the shell. Therefore, gas flow circulation occurs in the shell, so that the mobile computing apparatus has a desirable heat-dissipation effect.
摘要翻译：移动计算装置包括外壳，电路板，第一散热模块，用于排气的离心式风扇和用于对流的离心式风扇。壳有一个第一通孔。电路板设置在外壳上，具有第一发热装置。第一散热模块具有第一吸热端和第一散热端，第一吸热端与第一发热装置热接触。用于排气的离心式风扇具有第一气体出口，第一散热端位于第一气体出口和第一通孔之间，使得用于排气的离心式风扇排出到壳体的外部。用于对流的离心式风扇配置在外壳中，并排放到外壳的内部。因此，在壳体中发生气体流动循环，使得移动计算装置具有期望的散热效果。

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